Abstract: An electrolytic processing system performs a continuous electrolytic process to discrete conductors such as metal coupling elements of a slide fastener chain or conductive objects having a large electrical resistance. In the electrolytic processing system, an object is electrolytically processed while it is guided between intermediate rollers and arc electrodes.

Abstract: A method for manufacturing a zinc-silica composite electroplated steel sheet, which comprises the steps of: adding, to a zinciferous acidic electroplating solution containing silica particles and nitric acid ions, a complexing agent, which is capable of forming a stable complex with zinc, in an amount within a range of from 0.001 to 10 moles per liter of the electroplating solution, or a pH buffer, which has a pH buffering effect in a solution having a pH value within a range of from 5 to 12, in an amount within a range of from 1 to 50 g per liter of the electroplating solution; and electroplating a steel sheet in the resultant electroplating solution containing the complexing agent of the pH buffer in addition to the silica particles and the nitric acid ions, to form, on the surface of the steel sheet, a zinciferous plating layer in which silica particles are uniformly dispersed.

Abstract: The present invention aims to stabilize the plating film and to even the thickness thereof in the case where through holes of printed wiring boards are subjected to copper plating.Copper recovered from the etching waste liquor produced in the general manufacture of the printed wiring boards is supplied from a powder feeder 21 into a dissolution tank 23 to obtain a copper ion solution. For the copper plating, a substrate 1 acting as a cathod is arranged facing anodes 28 within a plating tank 26. The dissolution tank 23 supplies the copper ion solution into a plating tank 26 to maintain at a predetermined value the concentration of copper ions of a plating solution 27. This allows the insoluble polar plate to be used as the anodes 28, which leads to a stable current density.

Abstract: For electrodeposition of metal from an electrolyte with a vibrator conveyor the bulk material is transported in a conveying trough which is connected as cathode. According to the invention, the conveying trough (18) is provided with supporting stringpieces (22 to 29) which are intended for the mechanical attachment of the conveying trough (18) on the central pipe (2) as well as for current transmission to the cathode and furthermore serve as electric lead-through through the sidewall (5) of the central pipe (2). The supporting stringpieces (22 to 29) comprise an electrically conducting contact shaft (52) which is electrically insulated from the electrolyte (12) and the central pipe (2). For the attachment of the conveying trough (18) on the stringpieces (22 to 29) contact bolts (56 to 58) are provided which serve at the same time for current transmission from the contact shaft (52) to the bulk material (20). In this form realization one obtains a simple current supply to the cathode.

Abstract: Surface treated titanium and titanium alloy articles having a thin anodized film substantially of TiO.sub.2 and characterized by a leakage current of less than about 25 microamps per square centimeter and a dielectric strength of at least one million volts per square centimeter, together with a high breakdown potential and high corrosion resistance, is disclosed. The process for forming such titanium and titanium alloy articles is also disclosed and is characterized by anodizing the articles in a substantially non-aqueous solution of a mineral acid and an organic solvent at a formation current above 0.1 microamps per square centimeter.

Abstract: An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.

Abstract: A line for continuously annealing and pickling a stainless steel strip comprising: a drying/temperature adjusting zone, provided between a water cooling zone and a tank containing a neutral salt electrolytic solution, including hot air jetting means which controls the temperature and amount of hot air so as to dry the stainless steel strip after the stainless steel strip is cooled with water and uniformly heat the temperature of the material of the stainless steel strip.

Abstract: Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities, and/or to modify the tensile strength and ductility characteristics of the foil. An IPC Class 2 foil is prepared without annealing.

Abstract: Electroformed and/or electroplated iron with superior ferro-magnetic properties is prepared by an electrolytic process wherein the iron is deposited from an electrolyte bath containing iron salts and preferably substantially free of carbon. The bath and its environment are substantially free of oxygen and other oxidizing agents. A titanium-palladium alloy is a preferred electrode upon which to deposit the iron.

Abstract: Disclosed are a master holder of a stamper electroforming apparatus and an electroforming method using this master holder. The master holder is for use in a stamper electroforming apparatus that forms a metal film by electroforming on a conductive film formed on a master having a minute relief pattern on its surface; and this master includes: a contact ring for electrically connecting the conductive film to a power source; and a structure for controlling the rate at which the metal film is formed, which structure is provided on the contact ring and adapted to control the metal-film-formation rate such that the thickness of a peripheral portion of the metal film gradually decreases in the vicinity of the contact ring.

Abstract: A new and improved orifice or nozzle plate for an inkjet printhead and method of manufacture wherein the orifice or nozzle plate thickness has been increased significantly to a value on the order of 75 micrometers or greater while simultaneously maintaining the integrity of the convergent contour of the multiple orifice openings formed therein. In a first embodiment of this invention, metal layer stacking through the use of successive electroforming processes is used to achieve a desired orifice plate structure, architecture and convergent orifice geometry. In a second embodiment of this invention, anisotropic electroplating on a metal surface and over the edges of an inorganic dielectric mask is used to produce this orifice plate of increased orifice bore thickness and convergent orifice bore geometry. In yet a third embodiment of the invention, a selected metal is plated upon a permanent insulating mandrel having a metal pattern thereon to form convergent orifice openings in the plated metal.

Abstract: A process for producing a structure including an anodic film exhibiting a colored pattern, and the resulting structures. The process involves anodizing a surface of a metal substrate or article made of or coated with aluminum or an anodizable aluminum alloy to produce an anodic film preferably having pores extending from the film surface inwardly towards the underlying metal. A semi-refective layer of a non-noble metal is then deposited on or within the pores of the film in order to generate a color by effects including light interference. Limited areas of the resulting film are then contacted with a solution of a noble metal compound (e.g. Pd, Au or Pt) by a procedure which avoids the use of an adhering mask. The noble metal from the solution at least partially replaces the non-noble metal in the contacted areas and creates a different color in these areas.

Abstract: Impure anhydrous hydrogen fluoride is purified by removing metallic and non-metallic impurities by electrolysis under conditions whereby no explosive gas mixture is formed in the electrolytic cell.

Abstract: An electroplating apparatus having a tank containing a bath of an electrolytic solution, and a roll supported for immersion into the electrolytic bath for transporting a sheet material through the bath. The roll has a current collector rotatably supported on a shaft thereof for transmitting high amperage electricity to the roll. The current collector is supported on a part of the shaft which projects exteriorly of the tank side wall, and incorporates a sleevelike housing structure which surrounds and is rotatable relative to the shaft and mounts therein a plurality of conductive shoes which are of a highly electrically conductive material and are spring urged for snug radial contact with a conductive ring secured to a conductive sleeve arrangement which snugly axially and nonrotatably mounts to the shaft. The housing cooperates with the sleeve arrangement to define a generally sealed interior annular chamber in which the current-conducting shoes are positioned.

Abstract: The application of electrochemical reduction treatment liquids and electroless reduction treatment liquids to elements such as circuit boards for cleaning metallic surfaces in preparation for soldering is accomplished using a wave of the treatment liquid over a liquid tank. A wave treatment has advantages over spraying, which causes too much atomizing, and dipping, which is slow and requires complicated conveyors that are multi-directional. The method comprises forming a wave of reduction treatment liquid in an inert atmosphere and passing components through the wave so the reduction treatment liquid contacts the surfaces to be solder coated.

Abstract: The invention relates to a method of producing microstructured metallic bodies in which plastic negative molds of the microstructures are produced on an electrically conductive base plate by means of electron beam lithography, X-ray lithography or a micromolding technique. Cavities of the negative molds are filled with metal by electroplating while employing the electrically conductive base plate as an electrode. In the course of producing the negative molds, a residual plastic layer is left at the bottom of the cavities of the negative molds on the electrically conductive base plate. Also, before the cavities of the negative molds are filled with metal by electroplating, the residual plastic layer at the bottom of the cavities is removed by means of reactive ion etching with ions that are accelerated perpendicularly toward the surface of the base plate.

Abstract: An electroforming process is used to prepare an electroformed metal layer on the inside surface of a female mandrel to form an electroform with a hollow interior. A device may be positioned within the hollow interior of the electroform, and the interior is filled with a filling material. The electroform may then be separated from the mandrel by a force applied to the device positioned within the filling material.

Abstract: An electrode array containing individual electrode segments having means to electrically bias each of the segments individually and to control the quantity of current supplied to each of the electrode segments individually; and use of the array.

Abstract: A process for roughening aluminum or alloys thereof for printing plate supports, wherein an electrochemical roughening is performed by means of alternating current in an acidic electrolyte including sulfate ions and chloride ions, the chloride ions being in the form of aluminum chloride. In a preceding or subsequent rougheniong stage, mechanical roughening and/or electrochemical roughening by means of alternating current in an electrolyte is carried out. The electrolyte can include hydrochloric acid and aluminum ions, nitric acid and aluminum ions or sulfuric acid and chloride ions.

Abstract: A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin and, if required, further applying an electrolytic copper plating successively thereto, wherein heat treatment is applied to the substrate after the electroless copper-plating treatment within a temperature range from 120.degree. to 420.degree. C. The metal plating layer has an excellent adhesion capable of withstanding thermal shocks. The substrate can be used for producing electronic parts having high reliability with stable operationability.