Abstract: The invention relates to a method for determining a set-point voltage for a piezoelectric actuator system to achieve a desired optical response of the piezoelectric actuator system, such as an optical power. The method is based on a mathematical model, OP(V,T,n) describing a relationship between the applied voltage and the optical response. Calibration and use of the model involves determining a transition time count value. During use, e.g. at given intervals, the model is updated based on actual values of the temperature and the transition time count value. The set-point voltage required to achieve a desired optical response is determined based on the updated model and the set-point voltage is applied to the piezoelectric actuator.

Abstract: A rapid detection device for multi-channel sporadic transient partial discharge, comprising a CPU and several partial discharge detection circuits. The partial discharge detection circuits are connected to a plurality of ports of the CPU one to one, respectively. First, a partial discharge pulse signal is filtered and amplified by means of a partial discharge pulse signal processing module in the partial discharge detection circuits, and is then inputted to a comparator, and a reference voltage passes through the CPU and is sent to a reference voltage processing module for amplification, filtering and other processing, and then is inputted to the comparator, so that the comparator processes same according to the partial discharge pulse signal and the reference voltage and then inputs same to a trigger. Finally, according to a level signal at an output terminal of the trigger, the CPU determines whether partial discharge occurs in a circuit to be detected.

Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Abstract: A manufacturing process for electrode of neuromodulation probe includes the steps of: preparing a plurality of the manufacturing fixtures for electrode of neuromodulation probe; preparing a plurality of the manufacturing fixtures for electrode in a surrounding manner by having the first-layer frames to be externally disposed side by side with the bevels of the two neighboring first-layer frames close to each other, so that the second-layer frames, the plurality of electrodes and the plurality of wires are enclosed thereinside; placing a cylinder amid the plurality of manufacturing fixtures for electrode to have the plurality of wires to surround the cylinder; having a fluid plastic to surround the cylinder by filling all the spaces between the plurality of wires and the plurality of electrodes, and waiting the fluid plastic to cure; removing the plurality of first-layer frames and the plurality of second-layer frames; and, pulling off the cylinder.

Abstract: Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs.

Abstract: Systems, methods, and apparatus for corona detection using audio data are provided. In one example embodiment, the method includes obtaining, by one or more computing devices, audio data during at least one time interval, the time interval including a plurality of time windows; partitioning, by the one or more computing devices, the audio data into a plurality of window audio data each corresponding to a respective one of said time windows; and determining, by the one or more computing devices, a signal indicative of a presence of corona based at least in part on at least one window audio data relative to a remainder audio data.

Abstract: The invention discloses a field detection device and system for achieving no maintenance of a gas density relay. The field detection device comprises a temperature adjusting mechanism and an intelligent control unit, wherein rise and fall of the temperature of the temperature adjusting mechanism are controlled by the intelligent control unit, thereby making the temperature of a temperature compensation component of the density relay rise and fall to complete the field detection of the gas density relay, and no maintainer is needed to operate on site, which achieves no maintenance of the gas density relay, and greatly improves the efficiency and reliable and safe running of power grids. The invention further provides a field detection method for supporting normal running of the field detection device above.

Abstract: A method and apparatus for configuring a conductive plane for electromagnetic compatibility test of equipment or device. A positioning object is fixed above the plane of a conductive plane, the positioning object contacts an equipment under test (EUT), and the distance from the EUT to the conductive plane is equal to the distance from the positioning object to the conductive plane plus the thickness of the positioning object, thereby avoiding an error in measurement caused by a change in the distance from the conductive plane to the EUT during each test. In addition, the device is portable, and the conductive plane does not need to be grounded, and may be applied to a production site or field in which no grounding is available.

Abstract: A system for monitoring a circuit, comprising a device under test, such as a power field effect transistor or capacitor, coupled to a power source and a signal source and configured to generate a power output using the signal source, a current output, a voltage output and an end of life detector coupled to the current output and the voltage output and configured to generate a first impedance as a function of the current output and the voltage output, to compare the first impedance to a second impedance and to generate an indicator if the first impedance exceeds the second impedance.

Abstract: Techniques are described herein that are capable of using variable voltage sources to control respective thermoelectric coolers independently in a thermal testing environment. The variable voltage sources create temperature differentials between first and second opposing surfaces of the thermoelectric coolers by applying input voltages to the respective thermoelectric coolers. Heat is transferred, by first heat exchanger(s), between a fluid and respective subset(s) of the thermoelectric coolers Heat is transferred, by second heat exchanger(s), between semiconductor device(s) and the subset(s) of the thermoelectric coolers.

Abstract: A method for manufacturing a first radio-frequency (RF) device, including: receiving a substrate having the first RF device, wherein the first RF device has a signal port for receiving or transmitting RF signals with an input impedance greater than ten times an input impedance of a testing tool; causing a probe assembly to connect to the signal port and the testing tool; and causing the probe assembly to connect to a first terminal of a resistive element having a resistance equal to the input impedance.

Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.

Abstract: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

Abstract: Devices, systems, and methods for measuring a power consumption of a hot pluggable solid-state drives are described. An example method for measuring a power consumption of a solid-state drive communicatively coupled to a server backplane within a server chassis includes performing, by an adaptor, a power measurement to generate a value corresponding to the power consumption of the solid-state drive, and transmitting, using a wireless transceiver of the adaptor, the value to a recording unit, where a first end of the adaptor is coupled to the solid-state drive and a second end of the adaptor is coupled to the server backplane, and where the wireless transceiver, communicatively coupled to an antenna, is configured to operate using at least one wireless protocol.

Abstract: The invention relates to a method for carrying out signal detection by means of magnetic particle imaging, in which method magnetic/magnetisable particles (4), arranged in the field-free region of a location-dependent magnetic field, in particular a gradient magnetic field, are magnetised by means of an excitation magnetic field that changes over time, and the harmonics (9, 15), generated by the particles (4), of the frequency of the excitation magnetic field are detected as a signal from the magnetic particles (4) by means of a receiver coil arrangement (1) which in particular surrounds the particles (4), wherein a signal-transmitting arrangement, which has an outer coil (10) and at least one inner coil (11; 16, 17) connected in series to said outer coil, is positioned within the receiver coil arrangement (1) around the particles (4), wherein the signal received from the particles (4) by the at least one inner coil (11; 16, 17) is transmitted to the outer coil (10) by current flow and is re-emitted by said o

Abstract: The present disclosure refers to a sensor assembly for an IVD analyzer, the sensor comprising two opposite substrates with at least one fluidic conduit for receiving a sample. The electrodes of different types of electrochemical sensors are arranged on the two opposite substrates facing the at least one fluidic conduit for coming in contact with the sample and determining sample parameters, wherein the counter electrodes and the reference electrodes are formed on one substrate and the working electrodes are formed on the opposite substrate. This achieves optimal sensor-working conditions in terms of a homogeneous and symmetrical electric field density and enables a sensor assembly with simpler geometry and smaller size.

Abstract: A system for detecting a leak in a building layer comprising a plurality of dual foil insulation panels arranged to cover at a base building surface, each panel including: an insulating body and upper and lower conductive layers covering, respectively, upper and lower surfaces of the insulating body. The system comprising: a plurality of upper electrodes formed by respective rows of electrically interconnected upper conductive layers of the panels; a plurality of lower electrodes formed by respective transverse rows of electrically interconnected lower conductive layers of the panels; and a control circuitry configured to: apply a voltage between the upper and lower electrodes to measure an electrical property therebetween; and detect the presence of a leak within the building layer based on a measurement of the electrical property between the upper and lower electrodes.

Abstract: A front-end device for monitoring operation of an associated electric power device with semiconductor power switches generating a power output, e.g. a three-phase power output. The front-end device has input terminals arranged for connection to the electric phase(s) of the power output of the associated electric power device, and an electric circuit connected to the input terminals and connected to at set of output terminals. The electric circuit has a passive interconnection comprising electric semiconductor switches and diodes. The electric circuit serves to electrically block any high voltage component from the input terminals from reaching the output terminals, while allowing an on-state voltage of at least one semiconductor power switch in the associated electric power device to pass to the at least two output terminals. The front-end allows low voltage equipment to be connected to its output terminals for determining an on-state voltage of switches of the electric power device.

Abstract: A system for real-time continuous and remote monitoring of the progressive degradation of insulators installed in Electric Power Transmission Networks, namely in Very High Voltage electric Lines (VHVL), which can be applied at lower voltage levels (High and Medium Voltage). The principle of operation is based on the identification of the occurrence of leakage currents in the insulators by registering the current intensities, the periods of the occurrences, and local measurements of temperature and relative humidity.

Abstract: A medicament preparation system includes a disposable cartridge with a flow path. Various sensors may be placed on the cartridge to measure qualities of the fluid flowing through the flow path. The sensors are placed in precise locations using various approaches that make manufacturing of the cartridge efficient and repeatable. A drain line that is susceptible to fouling may be preattached and various approaches are used to remove or reduce the fouling. An elastomeric contact can also be present in the medical preparation system and used in a conductivity measurement subsystem.