Patents Examined by Thang X Le
  • Patent number: 10895147
    Abstract: A method and system for estimating a thickness of at least one casing string in a cased hole may comprise obtaining a plurality of induction measurements from a plurality of channels using a casing inspection tool, computing a quality vector for the plurality of channels, wherein each element of the quality vector is a numeric output, identifying the plurality of channels is a high-quality or a low-quality based at least in part on an evaluation of the quality vector to obtain a high-quality subset of the plurality of channels and a low-quality subset of the plurality of channels, and estimating the thickness of the at least one casing with an inversion using a high-quality subset of the plurality of channels. A system may comprise a multi-channel induction tool and an information handling system. The multi-channel induction tool may comprise at least one transmitter and at least one receiver.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 19, 2021
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Kai Ren, Ahmed Elsayed Fouda, Ilker R. Capoglu
  • Patent number: 10890841
    Abstract: A camera module testing fixture for testing a performance of a camera module includes a mounting body, a fixture block set detachably mounted to the mounting body, an actuating module, a cover fixed on the actuating module, and a base. The mounting body and the actuating module are disposed on a same first side of the base. The actuating module is configured to move the cover along a first direction to above the fixture block set and further configured to move the cover along a second direction perpendicular to the first direction and perpendicular to the mounting body.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 12, 2021
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Chun-Yao Huang, Cheng-An Lin
  • Patent number: 10890642
    Abstract: A method of calibrating an impedance measurement device for measuring DUT impedance includes performing short calibration measurements using a short calibration standard to obtain short raw data; performing first shunt calibration measurements using a first shunt calibration standard to obtain first raw data, the first shunt calibration standard having known first resistance and unknown first inductance; performing second shunt calibration measurements using a second shunt calibration standard to obtain second raw data, the second shunt calibration standard having known second resistance and unknown second inductance; determining first and second complex impedances of the first and second shunt calibration standards by calculating the first and second inductances using the short, first and second raw data applied to a specific error model; and determining general error coefficients for an error model using the first and second complex impedances and the first and second raw data applied to a one-port calibrat
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: January 12, 2021
    Assignee: Keysight Technologies, Inc.
    Inventor: Manuel Kasper
  • Patent number: 10890607
    Abstract: A sense circuit for a piezoresistive sensor is provided that comprises: an energy storage circuit coupled to the piezoresistive sensor via a first node; a charge control circuit coupled to the first node and configured to charge the energy storage circuit to a predetermined potential; a discharge control circuit configured to allow the energy storage circuit to discharge through the piezoresistive sensor; and a readout circuit coupled to the first node and configured to output a sensed voltage based on a level of charges stored by the energy storage circuit.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 12, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chihjen Cheng, Xiaoliang Ding, Pengpeng Wang, Xueyou Cao, Yuzhen Guo
  • Patent number: 10884067
    Abstract: An apparatus and a method are described for modifying test measurement signals for protective devices for electric power networks. The apparatus has an input interface to receive a first test measurement signal from a test generator, wherein the first test measurement signal is matched to a first electrical input characteristic of a first protective device for a power network. The apparatus further has an electrical modification system coupled to the input interface to convert the first test measurement signal into a second test measurement signal, wherein the second test measurement signal is matched to a second electrical input characteristic of a second protective device for the power network. The apparatus additionally has an output interface to output the second test measurement signal to the second protective device.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: January 5, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventor: Federico Canas
  • Patent number: 10883918
    Abstract: As the development of DC transit systems continues, many of the buried pipelines and metal structures close to the metro system have experienced accelerated corrosion by the dynamic DC stray current. Because of the dynamic feature of the stray currents, monitoring the effect of the dynamic stray current on the corrosion of the buried structures has been a challenging task. This invention discloses a method to use a multielectrode system to measure the effect of dynamic stray currents on the corrosion of a metal structure or buried pipeline. The method also measures the effectiveness of cathodic protection under the influence of stray current. High-voltage power transmission lines that produce a changing magnetic field, which in turn produces an alternating current flowing through the berried pipe or other structures that run in parallel with the transmission lines. The method disclosed in this invention may also be used to detect the effect of the interference of the alternating current.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: January 5, 2021
    Inventors: Xiaodong Sun Yang, Lietai Yang Yang
  • Patent number: 10877089
    Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Harry-Hak-Lay Chuang, Chih-Yang Chang, Ching-Huang Wang, Tien-Wei Chiang, Meng-Chun Shih, Chia Yu Wang
  • Patent number: 10877106
    Abstract: In a jig main body constructing a conduction inspection jig, a pin guard plate is arranged so as to be movable back and forth between the main body bottom portion and the main body guide portion. Before conduction inspection, the tip end of a conduction pin is positioned outside the conduction pin hole. When the pin guard plate moves towards a side of the main body bottom portion with a start of the conduction inspection, only the tip end of the normal conduction pin without bent enters into the conduction pin hole and penetrates, and thereby protrudes from the conduction pin hole. An inspection method of a conduction pin includes an arranging step of arranging the tip end outside the conduction pin hole, a moving step of moving the pin guard plate, and a detecting step of detecting whether or not the tip end enters into the conduction pin hole.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 29, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Shoichi Watanabe, Keigo Seki, Hiroshi Takeuchi
  • Patent number: 10866213
    Abstract: A flexible eddy current probe for non-destructive testing of a metallic object, the probe having a flexible printed circuit containing eddy current drive and sense coils and a rotary encoder configured to measure liner distance as the eddy current probe is scanned over the object. The probe features an encoder arm that adjustably connects a flexible eddy current sensor array to the rotary encoder.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: December 15, 2020
    Assignee: Zetec, Inc.
    Inventor: William Oren Wekell
  • Patent number: 10866117
    Abstract: A system for reducing stray field effects comprises a magnetic target producing a changing magnetic field; a first set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a first magnetic field sensing element and a second magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; a second set of magnetic field sensing elements placed in spaced relation to the magnetic target and comprising at least a third magnetic field sensing element and a fourth magnetic field sensing element, each magnetic field sensing element having an axis of maximum sensitivity; and wherein the first set of magnetic field sensing elements is positioned closer to a center point of the magnetic field than the second set of magnetic field sensing elements.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 15, 2020
    Assignee: Allegro MicroSystems, LLC
    Inventors: Nevenka Kozomora, William Wilkinson, Braden Blanchette
  • Patent number: 10859643
    Abstract: Methods and apparatus for a sensor having a first magnetic field sensing element with first and second segments where the first and second segments are located at positions of opposite magnetic field. The first and second segments are spaced from each other based upon iso-lines of the magnetic field. A processing module can process an output of the magnetic field sensing element.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: December 8, 2020
    Assignee: Allegro MicroSystems, LLC
    Inventor: Rémy Lassalle-Balier
  • Patent number: 10852136
    Abstract: A method for detecting frequency mismatch in microelectromechanical systems (MEMS) gyroscopes is described. Detection of the frequency mismatch between a drive signal and a sense signal may be performed by generating an output signal whose spectrum reflects the physical characteristics of the gyroscope, and using the output signal to determine the frequency fC of the sense signal. The output signal may be generated by cross-correlating a random or pseudo-random noise signal with a response signal, where the response signal can be obtained by allowing the noise signal to pass through a system designed to have a noise transfer function that mimics the frequency response of the gyroscope. Since the noise signal is random or pseudo-random, cross-correlating the noise signal with the response signal reveals spectral characteristics of the gyroscope. To improve computational efficiency, the cross-correlation can be performed on demodulated versions of the noise signal and the response signal.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: December 1, 2020
    Assignee: Analog Devices, Inc.
    Inventors: Jiefeng Yan, Ronald A. Kapusta, Jr., Jianrong Chen
  • Patent number: 10845498
    Abstract: The subject matter of this specification can be embodied in, among other things, an unmanned aerial vehicle system includes a first loop airframe structure having a transmitter loop antenna and defining a plane, a second loop airframe structure having a receiver loop antenna having a diameter smaller than the transmitter loop antenna and oriented substantially parallel to the plane, a plurality of vertical thrusters configured to provide lift substantially perpendicular to the plane and elevate the system above a ground surface, at least one lateral thruster configured to provide thrust substantially parallel to the plane, a controller affixed configured to control the plurality of vertical thrusters and the lateral thruster, and an electromagnetic sensing system (such as ground-penetrating radar) configured to transmit electromagnetic signals using the transmitter loop antenna and receive secondary electromagnetic signals of secondary eddy currents caused by interactions between the EM signals and undergroun
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 24, 2020
    Assignee: Saudi Arabian Oil Company
    Inventors: Daniele Colombo, Ersan Turkoglu, Gary W. McNeice
  • Patent number: 10838011
    Abstract: A method for estimating a state of charge of a battery includes: estimating, by an electronic control unit, a third state of charge used for control of the battery based on a first state of charge and a second state of charge, the first state of charge being a state of charge estimated with reference to an electric current integrated value obtained by integrating detected electric current values of the battery, the second state of charge being a state of charge estimated with reference to a detected voltage value of the battery; and correcting, by the electronic control unit, the first state of charge based on the second state of charge estimated when the state of charge of the battery is in the non-hysteresis region.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: November 17, 2020
    Assignee: TOYOTDA JIDOSHA KABUSHIKI KAISHA
    Inventor: Kenji Takahashi
  • Patent number: 10838033
    Abstract: In one embodiment, a tester calibration device includes a first board to be installed on one of a plurality of sockets of a tester for testing a semiconductor device, when the tester is to be calibrated. The device further includes a plurality of first pins provided on a first face of the first board, and to be made contact with the one socket when the tester is to be calibrated. The device further includes a wiring configured to electrically connect some of the plurality of first pins with each other.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 17, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Kazuhito Hayasaka
  • Patent number: 10830613
    Abstract: Aspects of the present disclosure relate to decoding the output of a multi-turn magnetic sensor using a successive approximation technique to detect a number of turns of a magnetic target. A decoder circuit can decode a turn count of the multi-turn magnetic sensor by obtaining measurements at nodes that are determined from values of previous measurements.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 10, 2020
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Peter James Tonge, Monsoon Dutt
  • Patent number: 10823546
    Abstract: An apparatus includes a strand of compliant material with a center axis. The apparatus further includes a multi-region angular displacement sensor connected to the strand. The multi-region angular displacement sensor includes a first angular displacement unit in a first sense region of the stand. The first angular displacement unit is used to determine a first angular displacement in response to deformation of the first angular displacement unit. The multi-region angular displacement sensor also includes a second angular displacement unit disposed in a second sense region of the strand. The second angular displacement unit is used to determine a second angular displacement in response to deformation of the second angular displacement unit. The multi-region angular displacement sensor also includes a reinforcement structure that restricts movement of the first and second angular displacement unit with respect to the center axis.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: November 3, 2020
    Assignee: BEND LABS, INC.
    Inventors: Shawn P. Reese, Jared K. Jonas, Matt W. Ball, Colton Allen Ottley
  • Patent number: 10823702
    Abstract: A built-in S-typed array eddy current testing probe and a method for detecting defects of a tubular structure are provided. The probe includes an exciting coil part and a plurality of pick-up coil parts, wherein: the exciting coil part includes multiple bundles of exciting coil wires helically wound on a columnar coil former with a same interval; two bundles of exciting coil wires with an interval of 180° are connected at an end of the columnar coil former, actually being a same group of exciting coil wire bundles; each pick-up coil part consists of two rows of pancake coils; each four pancake coils which are closely arranged in a square shape form one differential eddy current testing pick-up unit; a final output signal is a result of additions between signals of opposite pancake coils and subtractions between signals of adjacent pancake coils in each differential eddy current testing pick-up unit.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: November 3, 2020
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Zhenmao Chen, Yingsong Zhao, Shejuan Xie, Hongen Chen, Xiaojie Yu
  • Patent number: 10816364
    Abstract: An inductive position sensor including at least two secondary windings consisting of a plurality of turns that are formed on two opposite faces of a printed circuit board and divided into first and second sectors. The first and second sectors are divided, in one turn width, into a first portion on one face of the printed circuit board and a second portion on an opposite face. The second portion of the first sector is extended by a first portion of the second sector and the first portion of the first sector is connected to the second portion of the second sector of a neighboring turn. The portions are connected pairwise by a respective via passing through the printed circuit board.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: October 27, 2020
    Assignees: Continental Automotive France, Continental Automotive GmbH
    Inventor: Alain Fontanet
  • Patent number: 10816573
    Abstract: A mounting mechanism comprising: a first end and a second end; and a shaft extending from the first end to the second end, the shaft including: a peripheral wall; threading extending along at least a portion of the peripheral wall of the shaft; a first port hole opening and a second port hole opening; a through-hole extending from the first port hole opening to the second port hole opening to provide a via for wiring to pass within the shaft from the first port hole opening to the second port hole opening.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: October 27, 2020
    Assignee: Fischer Block, Inc.
    Inventors: Margaret Paietta, Gregory Wolfe