Abstract: Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs.

Abstract: The present application discloses a chip socket for testing a semiconductor chip. The chip socket includes a pedestal and a fastener. The pedestal accommodates a chip to be tested. The fastener includes a top body and a base body. The top body includes a probing window, wherein a first opening area of the probing window at an outer surface of the top body is larger than a second opening area of the probing window at an inner surface of the top body. The base body is attached to the pedestal and locked to the top body when the top body covers the base body and clamps the chip. When the top body covers the base body, the probing window reveals a surface of the chip, allowing a probe to contact the surface of the chip through the probing window.

Abstract: The present disclosure provides a detection system that includes a first sensing device configured for sensing an acoustic wave and an electromagnetic wave and generating a first combined signal and a signal processing device configured to determine the occurrence and properties of an electrical discharge.

Abstract: A sensing arrangement for detection of electrical discharges in an electrical apparatus is described. The sensing arrangement includes an acoustic sensor and a signal enhancing structure with a funnel region. The acoustic sensor is positioned outside the funnel region on an apex side of the funnel region. An electrical switchgear is described. The electrical switchgear includes a sensing arrangement for detection of electrical discharges in an electrical apparatus. The sensing arrangement includes an acoustic sensor and a signal enhancing structure with a funnel region.

Abstract: Provided are a method, apparatus and system for measuring a resistance parameter of a grounding system, and a monitoring network. The method comprises: inputting a driving current into a plurality of sections of a grounding system path (S602), wherein the grounding system path comprises at least a grounded apparatus, a grounding body, and a downlead connecting the grounded apparatus and the grounding body; measuring response voltages generated by the plurality of sections, and acquiring a response current flowing through the downlead (S604); and determining a resistance parameter of the grounding system path according to the driving current, the response voltages and the response current (S606).

Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Abstract: A burn-in board includes: a board; sockets mounted on the board; a connector mounted on the board; and wiring systems disposed in the board and connecting the sockets and the connector. The wiring systems comprise: a first wiring system that transmits a first signal; and a second wiring system that transmits a second signal different from the first signal, and a type of a first connection form of the first wiring system is different from a type of a second connection form of the second wiring system.

Abstract: The present disclosure relates to a compact antenna test range (CATR) system. The CATR system comprises a measurement chamber, at least one feed antenna which is configured to transmit a radio frequency, RF, signal, at least one reflector which is arranged to reflect the RF signal towards a measurement area in the measurement chamber, and at least two preferably metallic calibration surfaces which can be arranged at two or more positions in the measurement area, wherein the calibration surfaces are configured to reflect a respective reflection of the RF signal back to the at least one reflector which is, in turn, configured to reflect the reflections of the RF signal back to the at least one feed antenna. The CATR system further comprises a measurement unit which is configured to receive the respective reflections of the RF signal and to determine and/or visualize a time difference between the reception of the respective reflections of the RF signal.

Abstract: A method includes processes of (a processing part 8) calculating an estimated heat generation temperature by using drive conditions (22, a storage part 6) at least including drive timing information (18) and drive current value information (20), and temperature change characteristic information (24) of a capacitor, calculating state change information (28) of the capacitor after elapse of a reference time by using the estimated heat generation temperature, and calculating a lifespan estimation value (lifespan estimation result 30) of the capacitor by using the state change information. This enables capacitor lifespan estimation corresponding to fluctuations of a drive current value flowing through the capacitor, the applicability of the capacitor is confirmed, and the safety of equipment using the capacitor is improved.

Abstract: A contact resistance test method and related devices are provided. When a MOS transistor working in a linear region is tested, a functional relationship between the channel width of the MOS transistor and total resistances of the MOS transistor at sampling temperatures is determined, to determine the contact resistance of the MOS transistor at the sampling temperatures. A calibration coefficient of the contact resistance at a current ambient temperature is determined based on the contact resistance of the MOS transistor at the sampling temperatures. A measurement result of the contact resistance is further adjusted based on the calibration coefficient of the contact resistance at the current ambient temperature, to obtain an accurate contact resistance at the current ambient temperature.

Abstract: A method of simulating an effect of interactions between a device under test and a scattering object by of a hybrid over-the-air (OTA) test system is described. The method includes the steps of determining at least one radiation parameter of the device under test, wherein the at least one radiation parameter is associated with electromagnetic waves emitted by the device under test; determining an equivalent source on a Huygens surface based on the at least one determined radiation parameter, wherein the equivalent source is associated with the device under test; assigning material properties to a Huygens box confined by the Huygens surface, wherein the material properties are associated with at least one of reflection of electromagnetic waves and absorption of electromagnetic waves; and simulating an electromagnetic interaction between the device under test and the scattering object based on the determined equivalent source and based on the assigned material properties.

Abstract: Systems, methods, and apparatus for corona detection using audio data are provided. In one example embodiment, the method includes obtaining, by one or more computing devices, audio data indicative of audio associated with an electrical system for at least one time interval. The method includes partitioning, by the one or more computing devices, the audio data for the time interval into a plurality of time windows. The method includes determining, by the one or more computing devices, a signal indicative of a presence of corona based at least in part on audio data collected within an identified time window of the plurality of time windows relative to audio data collected for a remainder of the time interval.

Abstract: A mask fitting level determination device includes a mask inner pressure detection unit inserted between a mask covering a mouth, nose and a face surface of a person to measure a pressure inside the mask. A circuit control unit derives information of a pressure value measured by the mask inner pressure detection unit and generates display information for the person wearing the mask. A determination display unit shows the person the display information generated by the circuit control unit. A battery unit supplies electricity to the circuit control unit and the determination display unit. A power supply switch starts and stops the supply of the electricity to the circuit control unit and the determination display unit. A start switch starts the mask inner pressure detection operation.

Abstract: Systems and methods are provided for detecting and analyzing changes in a body. A system includes an electric field generator, an external sensor device, a quadrature demodulator, and a controller. The electric field generator is configured to generate an electric field that associates with a body. The external sensor device sends information to the electric field generator and is configured to detect a physical change in the body in the electric field, where the physical change causes a frequency change of the electric field. The quadrature demodulator receives the electric field from the electric field generator and is configured to detect the frequency change of the electric field and to produce a detected response. The controller, coupled to the electric field generator, is configured to output a frequency control signal to the electric field generator and to modify the frequency of the electric field by adjusting the frequency control signal.

Abstract: Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

Abstract: An object is to provide a semiconductor device capable of accurately detecting a temperature of a transistor part and a temperature of the diode part, and improving an overheat protection function. A semiconductor device includes a semiconductor chip having a cell region made up of a plurality of cells including cells corresponding to a transistor part and a diode part, respectively, a temperature detection part detecting a temperature of the transistor part, and a temperature detection part detecting a temperature of the diode part, the temperature detection part is disposed in the cell corresponding to the transistor part, and the temperature detection part is disposed in the cell corresponding to the diode part.

Abstract: A microfluidic flow sensor may include a substrate having a microfluidic channel, an inert particle source to supply a fluid carrying an inert particle to the microfluidic channel and a sensor element along the microfluidic channel and spaced from the inert particle source. The sensor element outputs a signal based upon a sensed passage of the inert particle with respect to the sensor element. Portions of the microfluidic channel proximate the sensor element have a first size and wherein the inert particle provided by the inert particle source is to have a second size greater than one half the first size.

Abstract: A method of performing a measurement of a device under test by using an antenna array.

Abstract: A test system is disclosed. The test system includes a programmable switching array including input terminals, output terminals, and an array of programmable switches configured for selectively connecting any one of the input terminals to any one of output terminals; and a current supply device comprising a multiplexed digital bus and a plurality of a power supplies connected in parallel between the multiplexed digital bus and the input terminals of the programmable switching array.

Abstract: Methods and systems for detecting partial discharge in a stator for an electric motor are provided. An exemplary method includes applying a high voltage AC sinewave input signal to the stator and energizing at least one winding therein. The method includes sensing a first resulting load signal occurring in the stator with a first device and filtering the first resulting load signal to form a first high frequency signal indicating any partial discharge (PD) voltage occurring in the stator. The method also includes sensing a second resulting load signal occurring in the stator with a second device and filtering the second resulting load signal to form a second high frequency signal indicating any partial discharge voltage occurring in the stator. Further, the method includes processing the first and second high frequency signals to form a processed signal indicating whether partial discharge occurred.