Patents Examined by Thiem Phan
  • Patent number: 10277031
    Abstract: Techniques for provisioning energy generation and/or storage systems. In one embodiment, a method is provided that can comprise automatically determining, by a site gateway, information pertaining to one or more components of an energy storage system, where the site gateway and the one or more components are located at a customer site. The method can further comprise configuring, by the site gateway, the energy storage system based on the automatically determined information.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: April 30, 2019
    Assignee: SolarCity Corporation
    Inventors: Eric Daniel Carlson, Karthikeyan Varadarajan
  • Patent number: 10271428
    Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate, which comprises forming a hole in a laminate comprising a first conductor layer, a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant from 2.0 to 3.5, a second conductor layer, an adhesive layer and a layer (B) made of a cured product of a thermosetting resin laminated in this order, applying, to an inner wall surface of the hole, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: April 23, 2019
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Toru Sasaki, Nobutaka Kidera, Tatsuya Terada
  • Patent number: 10269585
    Abstract: Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: April 23, 2019
    Assignee: Corning Incorporated
    Inventor: Yuhui Jin
  • Patent number: 10262828
    Abstract: A fuse includes a fuse element and a fuse body. A portion of the fuse element is housed in a fuse body. The fuse element includes a first terminal and a second terminal disposed outside of the fuse body. The first terminal and the second terminal electrically connects the fuse element to a circuit to be protected and a power source. A first endbell and a second endbell is coupled to the fuse element. A predetermined amount of arc quenching material is disposed within the fuse body. The arc quenching material contacts at least a portion of the fuse element. The predetermined amount of the arc quenching material is less than a total volume size of the fuse tube. The arc quenching material is compacted. A remaining air gap in the fuse tube is filled with a liquid adhesive and cured to a solid state.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: April 16, 2019
    Assignee: Littelfuse, Inc.
    Inventors: Michael Schlaak, Gregory Stumpo, Ken Venhaus, Derek Lasini
  • Patent number: 10256586
    Abstract: The present disclosure relates to a G24 plug adaptor for use in retrofitting a traditional plug-in energy-saving luminaire, the traditional plug-in energy-saving luminaire initially adapted to receive a traditional energy-saving lamp, to be compatible with a non-traditional panel lamp such as, but not limited to, an energy-saving LED panel lamp. The G24 plug adaptor comprises a G24 plug base comprising a plurality of contact pins, an electrical connector adapted to couple to the non-traditional lamp, and an electrical supply line connecting the G24 plug base to the electrical connector. A method of retrofitting a traditional energy-saving luminaire to be compatible with a non-traditional panel lamp by using the G24 plug adaptor, the method comprising removing a reflector of the traditional plug-in energy-saving luminaire, is also disclosed herein.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: April 9, 2019
    Inventor: Siu Woo Lee
  • Patent number: 10237982
    Abstract: A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 ?m.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: March 19, 2019
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Christoph Hippin, Jenny Schone
  • Patent number: 10236598
    Abstract: A method of installing an electrical grounding system at a site can comprise the steps of inserting a hollow electrode into a hole formed into native soil at the site, the hollow electrode comprising an electrically conductive tube configured for communication with a fault current source, and a carbon fiber layer in conductive relationship with at least a portion of the electrically conductive tube; positioning the hollow electrode in the hole circumferentially around a ground member driven into native soil at a bottom of the hole; and electrically interconnecting the ground member and the hollow electrode.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: March 19, 2019
    Assignee: GLxT Holdings, LLC
    Inventors: Thomas Evan LaBarge, Gordon Wysong
  • Patent number: 10237983
    Abstract: A method for forming a hole plug in a laminate structure is provided. A laminate structure, is formed, including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than twenty (20) to one (1). In yet another example, the hole aspect ratio may be less than one (1) to one (1). Via fill ink may then be deposited in the hole. The via fill ink is then dried and/or cured to form a hole plug.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: March 19, 2019
    Assignee: SANMINA CORPORATION
    Inventors: Shinichi Iketani, Dale Kersten
  • Patent number: 10224790
    Abstract: In a method for the manufacture of actuators comprising an electric motor for driving an output shaft (10), a sensor device for generating a signal that is a function of the angle at which the output shaft is rotated, and a support surface (30a) with mounting points for mounting an actuator, a mechanical adjustment of at least one actuator component is carried out, which takes place depending on the deviation between an actual value and a setpoint such that the output shaft has an output end (40b), the angular position of which is adjusted to the setpoint.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: March 5, 2019
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Donat Andrey, Michael Watzek, Tanh Bui, Yvan Bourqui
  • Patent number: 10219420
    Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: February 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yongkang Hou, Yu Zhang, Jianlei Yang
  • Patent number: 10218139
    Abstract: A twist-on wire connector is releasably engageable with a tool. The connector and the tool are provided with complimentary driving features which allow the tool to be moved independent of and relative to the connector when the tool is moved in one rotational direction and which place the tool and connector into driving engagement when the tool is moved in the opposite rotational direction such that the connector is moved with the tool to apply the connector onto a plurality of electrical conductors. The complimentary driving features are provided to the tool and the connector by providing to each of the tool and the connector one or more engagement surfaces positioned adjacent to a slipping surface.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: February 26, 2019
    Assignee: IDEAL Industries, Inc.
    Inventors: Alan Emad Zantout, Pryce L. Nutting
  • Patent number: 10212866
    Abstract: An electronic component system includes an electronic component mounting line mounting an electronic component on a board (exposure managing board) for which management of exposure time is necessary, a package ID reader (recognition unit) which recognizes a package code (identification information) that is applied to a package bag, and a storage unit which stores an exposure time limit which is permissible from an open time before reaching a management release in which management of the exposure time is unnecessary. In the electronic component mounting system, the package code is read while the package bag is open, the read time is stored as the open time, an expected duration is calculated which is necessary from a predetermined point of time before reaching the management release, and it is determined whether or not the exposure time limit is exceeded before the board which is exposed in the atmosphere reaches the management release.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: February 19, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hiroaki Kurata
  • Patent number: 10207439
    Abstract: An apparatus or assembly for forming injection molded magnets in permanent magnet rotors or laminations for such rotors. The assembly includes a plurality of platens defining an axial boundary of a die cavity and a plurality of support shoes that are radially moveable between a closed position defining a radial boundary of the die cavity, and an open position creating a gap between the rotor core and the plurality of support shoes. The assembly has an injection system for filling at least one of the plurality of voids of the rotor core with a magnetic slurry, and a plurality of alignment magnets configured to magnetically align the magnetic slurry.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: February 19, 2019
    Assignee: GM Global Technology Operations LLC
    Inventors: Edward L. Kaiser, Amanda Luedtke, Peter J. Savagian, Sinisa Jurkovic
  • Patent number: 10205308
    Abstract: A method of removing a metallic cable core that extends through an outer cable sheath of a length of data transmission cable is disclosed. The core is surrounded by a filler material contained within the outer cable sheath as an integral part of the cable. The method comprises the steps of resistively heating the core by supplying electric current to it to reduce the viscosity of the surrounding polymer material; and pulling the core out of one end of the outer cable sheath while the viscosity of the filler material is in a reduced state.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: February 12, 2019
    Assignee: DEFLUX HOLDINGS LIMITED
    Inventor: Laslo Nusbaum
  • Patent number: 10199792
    Abstract: An RJ-45 insertion and extraction tool is disclosed that allows a user to plug and unplug an RJ-45 connector from an RJ-45 socket in a quick and easy way that does not disturb other cables plugged into adjacent sockets.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: February 5, 2019
    Assignee: DISH Technologies L.L.C.
    Inventors: Jason B. Mitchell, Martin S. Foegelle
  • Patent number: 10199058
    Abstract: A method according to one embodiment includes recessing a portion of a media facing side of a module, the module having first and second transducers of different magnetic transducer types positioned towards the media facing side of the module, wherein the different transducer types are selected from a group consisting of data reader transducers, servo reader transducers, write transducers, piggyback read-write transducers and merged read-write transducers; wherein the recess is positioned towards one of the first transducers, wherein the recess forms a first protection structure for protecting the first transducer; and wherein the second transducer has either no protection or is protected by a second protection structure that is different than the first protection structure.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Robert G. Biskeborn, W. Stanley Czarnecki, Philipp Herget, Calvin S. Lo
  • Patent number: 10192846
    Abstract: In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: January 29, 2019
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Marcus Pawley, Andrew Roberts, Robert Clarke
  • Patent number: 10186823
    Abstract: According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 22, 2019
    Assignee: Cisco Technology, Inc.
    Inventor: Robert Gregory Twiss
  • Patent number: 10181776
    Abstract: There is provided a winding to be wound at a stator of a rotary electric machine. The winding is produced from a flat wire having a rectangular cross section along a plane perpendicular to a length-wise direction. The flat wire is coated with an electric insulating layer and is bent to have curves at given portions of the flat wire in the length-wise direction. The curves are located on an axial outer side of the stator. The cross section of the flat wire has four corners, among which mutually-adjacent two corners are lager in curvatures than remaining mutually-adjacent two corners. The mutually-adjacent two corners whose curvatures are smaller are positioned on a circumferential outer side of each of the curves and the mutually-adjacent two corners whose curvatures are larger are positioned on a circumferential inner side of each of the curves.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: January 15, 2019
    Assignee: DENSO CORPORATION
    Inventor: Takashi Tokizawa
  • Patent number: 10179555
    Abstract: A method for making electrical connection to a mirror reflective element for a vehicular rearview mirror assembly includes providing a mirror reflective element having a front substrate and a rear substrate with an electro-optic medium disposed therebetween and in contact with a transparent conductive coating and a third surface reflector. A metallic electrical connector is provided that includes an attachment portion and a wire receiving portion. An electrical wire is inserted in the wire receiving portion such that at least one tang of the wire receiving portion engages the electrical wire to secure the electrical wire in the wire receiving portion and to make electrically-conductive connection with the electrical wire. The attachment portion is attached at the front or rear substrate to attach the electrical connector at the mirror reflective element such that the attachment portion electrically conductively connects to the transparent conductive coating or the third surface reflector.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: January 15, 2019
    Assignee: MAGNA MIRRORS OF AMERICA, INC.
    Inventors: John T. Uken, Michael J. Baur, Ian A. McCabe, Hamid Habibi