Patents Examined by Thiem Phan
  • Patent number: 10182500
    Abstract: In an imprint process in a gaseous atmosphere containing a condensable gas, the curable composition for photoimprint is difficult to cure, the pattern is not fully formed to cause defects. The present invention relates to a curable composition for photoimprint in a gaseous atmosphere containing a condensable gas. The curable composition for photoimprint at least comprises the following component (A) and component (B): (A) polymerizable compound, and (B) photopolymerization initiator. Component (B) has a saturated solubility of less than 1% by weight in the condensable gas in a liquid state at 5° C. and 1 atm or has a Hansen distance (Ra) of larger than 7.6 to the condensable gas.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: January 15, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takeshi Honma, Toshiki Ito, Shiori Yonezawa, Youji Kawasaki, Akiko Iimura
  • Patent number: 10170881
    Abstract: A method of manufacturing an insertion-type connector having at least two mutually electrically insulated conductor contacts with the conductor contacts cut from a metal sheet in such a way that they are connected together via a connecting part of the metal sheet, the conductor contacts being partly embedded in an electrically insulating material to form an electrically insulating housing which fixes the conductor contacts relative to one another, and the connecting part then separated off.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: January 1, 2019
    Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
    Inventor: Martin Zebhauser
  • Patent number: 10163565
    Abstract: The present invention is related to a method for winding a dual-layer flat wire coil, and to method for winding a multi-layer flat wire coil. Furthermore, the present invention is related to a device for winding such coils and to a dual-layer flat wire coil and to a multi-layer flat wire coil obtainable by performing the method of the present invention. Finally, the invention is related to a linear motor comprising such a dual-layer flat wire coil and/or multi-layer flat wire coil. According to the invention, an auxiliary winding core is used to temporarily store wire that is intended to form the odd layer of any pair of layers in the multi-layer coil.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: December 25, 2018
    Assignee: TECNOTION B.V.
    Inventors: Erwin Gerardus Bernardus Hofste, Roel Toon Hendrik Huinink
  • Patent number: 10163551
    Abstract: A method of manufacturing a coated conducting wire assembly includes forming a conducting wire assembly by twist-deforming a conducting wire bundle, forming a coated conducting wire assembly by covering the conducting wire assembly with an insulation coating, and annealing the coated conducting wire assembly. The conducting wire bundle is formed by bundling a plurality of conducting wires. The conducting wire assembly includes a parallel portion, a left-wound portion, and a right-wound portion. The annealing is performed by heating and holding the coated conducting wire assembly at an annealing temperature while applying tension to the covered conducting wire assembly.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: December 25, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yasuyuki Hirao, Hideki Manabe
  • Patent number: 10163047
    Abstract: A method for manufacturing a portable data carrier by means of a continuous manufacturing method, comprises the steps: providing at least one foil as a rolled good, unrolling at least one first foil, with at least a first foil being coated at least partly with an adhesive on at least one side, with at least the first foil being scored on at least one side along at least one creasing edge, with at least the first foil being folded up in precise fit along at least one creasing edge and bonded, with the foil being folded up in the direction of the side which is coated with adhesive, with the side coated with adhesive being arranged on the opposite side of the foil which has at least one scored creasing edge along which it is folded.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: December 25, 2018
    Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
    Inventors: Stefan Bannert, Peter Kaufmann, Lucas Perlitz, Thomas Tarantino, Robert Griesmeier, Tatjana Mosthof, Cordula Regensburger
  • Patent number: 10165718
    Abstract: Provided are a component replenishment support method, and a component replenishment support system of a component mounting line that are capable of preventing a decrease in facility operation rate due to component shortage, in which a component shortage time of each part feeder is predicted, a component replenishment work is started from the present time in a case where the component shortage time is earlier than the virtual work end time, a work end time of the work target selection feeders in sequence of early time by using the part feeder within the warning consideration start time as a target is predicted, and a worker is warned of the component replenishment to the selection feeder of which the work end time is within the warning start time, in a case where the selection feeder of which the component shortage time is earlier than the work end time is not present.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: December 25, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hisashi Maezono, Hideki Sumi, Yasuhiro Maenishi
  • Patent number: 10158275
    Abstract: A separation apparatus for a laminated core is configured to separate an annular laminated core, which includes a plurality of core pieces each of which includes a yoke portion and a tooth portion extending from the yoke portion in a direction intersecting the yoke portion and is integrated by the temporary connection of the adjacent core pieces at end portions of the yoke portions, into the respective core pieces. The separation apparatus includes a plurality of separation members that are movable in a radial direction of the laminated core and are disposed so as to be arranged in a circumferential direction of the laminated core, and an actuator that is configured to apply an outward force in the radial direction to the laminated core through the respective separation members by moving the respective separation members outward in the radial direction.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: December 18, 2018
    Assignee: MITSUI HIGH-TEC, INC.
    Inventors: Satoshi Matsubayashi, Hayato Nakayama
  • Patent number: 10149363
    Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: December 4, 2018
    Assignee: LedEngin, Inc.
    Inventors: Xiantao Yan, Kachun Lee, David Tahmassebi
  • Patent number: 10148157
    Abstract: A method of manufacturing a stator for a rotary electric machine by disposing coils in a plurality of phases on a plurality of teeth of a stator core, one coil on one tooth, wherein in sequentially disposing the coils in the plurality of phases on the teeth, one coil on one tooth, toward one side in the circumferential direction of the stator core, the one end portion of each of the coils in each phase is inserted from the one side in the axial direction of the stator core, or from a direction that is orthogonal to the axial direction of the stator core, to be disposed between the one end portion and the other end portion of the immediately preceding coil in a separate phase disposed on the tooth so as to be aligned with the other end portion of the coil in the same phase.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: December 4, 2018
    Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shingo Hashimoto, Hiroyuki Tanaka, Takanori Ota, Osamu Nakagawa, Shingo Sato, Hirotaka Kawaura, Norihiko Akao, Tetsuya Sugimoto
  • Patent number: 10148055
    Abstract: A wire harness production system includes an electric wire sequential production portion that sequentially manufactures terminal-fitted electric wires from an electric wire, and a temporarily-storing and handling portion that temporarily stores the terminal-fitted electric wires before supplying them to a post process. The electric wire sequential production portion includes a coloring unit that colors a sheath of the electric wire or sheaths of the terminal-fitted electric wires by a colorant, and a cutting and crimping unit that manufactures the terminal-fitted electric wires by cutting the electric wire to a predetermined length and fitting a metal terminal at an end of the cut electric wire. The temporarily-storing and handling portion includes plural temporarily-storing portions that temporarily store the terminal-fitted electric wires in a production order before supplying them to the post process.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: December 4, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Akiyuki Hirata, Koichi Nakahara
  • Patent number: 10143084
    Abstract: A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: November 27, 2018
    Assignee: NXP USA, INC.
    Inventors: Michael B. Vincent, Zhiwei Gong, Scott M. Hayes
  • Patent number: 10141087
    Abstract: The wiring harness production mounting, includes: at least one screen for displaying data aiding in the production of wiring harnesses, and at least one attachment surface associated with the at least one display screen, the at least one attachment surface being configured to receive at least one cable-routing element.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: November 27, 2018
    Assignee: LASELEC
    Inventors: Stephane Rougier, Michel Viault
  • Patent number: 10128615
    Abstract: A variable-clocking terminal assembly includes a crimp barrel, a terminal lug, and a locking collar. The crimp barrel includes a crimp portion having a crimp portion cavity sized and configured to receive a cable end of an electrical cable. The crimp barrel includes a conical portion extending axially from the crimp portion. The terminal lug has a cylindrical portion and a terminal tongue extending outwardly from the cylindrical portion. The cylindrical portion has a conical cavity configured complementary to the conical portion. The locking collar has collar threads configured to engage threads formed on one of the crimp barrel and the terminal lug for drawing the conical portion into direct physical engagement with the conical cavity in a manner locking an orientation of the terminal lug relative to the crimp barrel and establishing electrical continuity between the conical portion and the conical cavity.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: November 13, 2018
    Assignee: The Boeing Company
    Inventors: Daniel S. Thomas, Daniel M. Grippe
  • Patent number: 10121684
    Abstract: The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: November 6, 2018
    Inventors: Bin Wu, Tsung-Yu Li
  • Patent number: 10121606
    Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: November 6, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
  • Patent number: 10109972
    Abstract: A terminal crimping device that crimps a terminal to a component includes a terminal feeder feeding one or more pre-formed terminals on a generally horizontal feed plane and a ram moving a drive crimper along a generally vertical crimp stroke. The drive crimper engages the pre-formed terminal at the feed plane and transfers the terminal to a crimp zone below the feed plane and remote from the terminal strip to crimp the terminal to the component.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: October 23, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Thomas Emery Backenstoes, Mark Andrew Ondo
  • Patent number: 10109924
    Abstract: Systems and methods for assembling different multi-element items with different specifications using a reconfigurable apparatus are provided. One embodiment includes a base plate, a back plate coupled to the base plate in a predetermined angle relationship. The exemplary back plate comprises a plurality of alignment pins adapted to engage with alignment locations of multiple element assembly items. The exemplary base plate and alignment mounting structures couple to end cap parts disposed on opposing ends of the multiple element assembly items holding the items together. A clamping mechanism maintains/releases pressure on the multiple element assembly items against the back plate. The back plate holds alignment pins in a first back plate location in a first orientation for one type of multiple element assembly items and hold the alignment pins in a second location when the back plate is in a second orientation for a different type of multiple element assembly items.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: October 23, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventor: Jeffrey M. Waters
  • Patent number: 10111343
    Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: October 23, 2018
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, YongShan Zhang
  • Patent number: 10104784
    Abstract: A method for making an electronic product. The method includes processing a flexible substrate (e.g., a web) with the use of a tensioner having a vacuum plate and an indexer that intermittently moves the flexible substrate for processing. While a designated location of the flexible substrate is stopped at a processing location, a process is performed on the designated location. Wherein while the designated location is stopped at the processing location, the vacuum plate of the tensioner moves in an opposite direction of the transport direction.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: October 16, 2018
    Assignee: NXP B.V.
    Inventors: Jozep Petrus Wilhelmus Stokkermans, Thomas Markus Kampschreur, Theodorus Ter Steeg, Patrick J. M. Houben
  • Patent number: 10103493
    Abstract: A method of manufacturing a connector and assembly of a cabling category and comprising two mating zones connected by an intermediate zone. Each of the zones is manufactured such that Near End Cross Talk (NEXT) resulting from transmission of the high frequency signal across each zone is below a specified amount chosen such that NEXT introduced by a high frequency signal transmission between via all the zones is below a level as specified for the cabling category.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: October 16, 2018
    Assignee: BELDEN CANADA INC.
    Inventors: Virak Siev, François Beauregard, Michael Bodzay, Luc Milette, Vincent Pilon, Jean-Sébastien Plamondon