Abstract: An erasing method is used in a memory device. The memory device includes a string of memory cells and a controller, the string of memory cells including a plurality of special memory cells not for storing data and a plurality of main memory cells for storing data. The erasing method includes: the controller verifying if at least one special memory cell of the plurality of special memory cells has failed; the controller resetting the at least one special memory cell if the at least one special memory cell has failed; and the controller erasing the plurality of main memory cells.

Abstract: A memory device includes a plurality of memory cells each including a switching device and a storage device having a phase change material, a decoder circuit including a first bias circuit inputting a first bias voltage to a selected word line connected to a selected memory cell, a second bias circuit inputting a second bias voltage to a selected bit line, a first selection switching device and a first non-selection switching device connected between the first bias circuit and the selected word line, and a second selection switching device and a second non-selection switching device connected between an adjacent word line and the first bias circuit, a control logic sequentially turning off the first selection switching device and the second non-selection switching device, and a sense amplifier comparing a voltage of the selected word line with a reference voltage to determine data of a read operation.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of skipped refresh operations on a memory. Memory cells of memories may need to periodically perform refresh operations. In some instances, auto-refresh operations may be periodically skipped when charge retention characteristics of the memory cells of the memory exceed the auto-refresh frequency. To reduce peak current draw during refresh operations, the skipped refresh operations may be staggered across different portions of the memory. In one example, the skipped refresh operation may be staggered in time among memory dies of the memory to limit a number of memory dies that are performing an auto-refresh operation to a maximum number. In another example, the skipped refresh operation may be staggered in time among memory banks of a single memory array to limit a number of memory banks that are performing an auto-refresh operation to a maximum number.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.

Abstract: A memory includes (n?1) non-volatile cells, (n?1) bit lines and a current driving circuit. Each of the (n?1) non-volatile cells includes a first terminal and a second terminal. An ith bit line of the (n?1) bit lines is coupled to a first terminal of an ith non-volatile cell of the (n?1) non-volatile cells. The current driving circuit includes n first transistors coupled to the (n?1) non-volatile cells.

Abstract: A charge pump circuit that suppresses low boost efficiency is provided. The charge pump circuit 100 of the invention includes a main pump circuit CPn_M and a gate controlling pump circuit CPn_G controlling the main pump circuit CPn_M. The main pump circuit has the same basic configuration as the controlling pump circuit, which are both KER-type pump circuits. The controlling pump circuit controls the operation of a transistor of the main pump circuit after the main pump circuit is boosted, so that reverse current will not flow from the main pump circuit to the forward section of the pump circuit.

Abstract: A memory chip including a memory bank, an address decoder circuit and a control circuit is provided. The memory bank includes a first sub-bank coupled to a first word line and a first access line and a second sub-bank coupled to a second word line and the first access line. The first sub-bank outputs data to the first access line via a first path. The second sub-bank outputs data to the first access line via a second path. The address decoder circuit decodes an external address to generate a row address and a column address. The control circuit controls the first path and the second path according to the row address and the column address. In response to the row address indicating the first word line and the column address indicating the first access line, the control circuit turns on the first path and turns off the second path.

Abstract: A non-volatile memory system comprises a memory structure and a control circuit connected to the memory structure. The control circuit is configured to control the non-volatile memory structure to perform memory operations by generating and applying a set of control signals to the non-volatile memory structure The control circuit includes a programmable and reprogrammable microcontroller. For example, the microcontroller includes one or more processors that are programmed using software (e.g., firmware). The use of a programmable processor and software allows for updates and changes to be made easily. Additionally, to reduce the time taken to make some calculations, the microcontroller also includes one or more combinational logic circuits that are in communication with the one or more processors.

Abstract: There is provided a system comprising: a storage device having a storage portion comprising a plurality of bitcells coupled to respective first signal lines and second signal lines and control logic to alter a memory state of the plurality of bitcells via the first signal lines and second signal lines; a memory controller coupled to the storage device to transmit one or more initialisation signals to the storage device; wherein the storage device is to initialise the storage portion over a clock cycle in response to the one or more initialisation signals.

Abstract: Shift register includes input sub-circuit coupling input terminal to first node responsive to signal of first clock terminal in input stage, control sub-circuit transmitting signal of second clock terminal to intermediate output terminal according to level at first node and controlling potential of third node according to potential of intermediate output terminal and signal of third clock terminal in input, output and reset stages, pull-up sub-circuit coupling second level terminal to final output terminal responsive to potential of intermediate output terminal in output stage, first voltage stabilization sub-circuit stabilizing voltage between final output terminal and third node responsive to signal of next-stage node connection terminal, pull-down transistor having gate electrode coupled to third node, first electrode coupled to first level terminal, and second electrode coupled to final output terminal.

Abstract: Techniques for accessing multi-level cell (MLC) crosspoint memory cells are described. In one example, a circuit includes a crosspoint memory cell that can be in one of multiple resistive states (e.g., four or more resistive states). In one example, to perform a read, circuitry coupled with the memory cell applies one or more sub-reads at different read voltages. For example, the circuitry applies a first read voltage and detects if the memory cell thresholds in response to the first read voltage. If the memory cell thresholded in response to the first read voltage, the state of the memory cell can be determined without further reads. If the memory cell did not threshold in response to the first read voltage, a second read voltage with a greater magnitude is applied across the memory cell. If the memory cell thresholded in response to the second read voltage, the state of the memory cell can be determined without further reads.

Abstract: An apparatus is provided which comprises: an interconnect comprising poly extending in a first direction; a power supply rail extending in a second direction, wherein the second direction is parallel to the first direction; and a memory array organized in rows and columns, wherein the rows are orthogonal to the columns, wherein the first and second directions are parallel to the rows of the memory array, wherein the memory array comprises bit-cells (e.g., 6T SRAM bit-cells) that are organized such that there are no gap bit-cells in the array.

Abstract: A semiconductor memory device may include a plurality of banks; a plurality of address storage circuits respectively corresponding to the plurality of banks, and suitable for storing refresh addresses of corresponding banks; an output control circuit suitable for, based on a refresh command signal and a test mode signal, generating an output clock and selectively outputting, as output data, a refresh address outputted from any one of the address storage circuits or bank data provided from the banks; an output buffer suitable for outputting the output data to a plurality of data input/output pads based on the output clock; and a strobe signal generation circuit suitable for generating a data strobe signal based on the output clock and outputting the data strobe signal through a data strobe pad.

Abstract: The present disclosure includes apparatuses, and methods for data state synchronization. An example apparatus includes performing a write operation to store a data pattern in a group of resistance variable memory cells corresponding to a selected managed unit having a first status, updating a status of the selected managed unit from the first status to a second status responsive to performing the write operation, and providing data state synchronization for a subsequent write operation performed on the group by placing all of the variable resistance memory cells of the group in a same state prior to performing the subsequent write operation to store another data pattern in the group of resistance variable memory cells.

Abstract: A charge pump circuit that suppresses low boost efficiency is provided. The charge pump circuit 100 of the invention includes a main pump circuit CPn_M and a gate controlling pump circuit CPn_G controlling the main pump circuit CPn_M. The main pump circuit has the same basic configuration as the controlling pump circuit, which are both KER-type pump circuits. The controlling pump circuit controls the operation of a transistor of the main pump circuit after the main pump circuit is boosted, so that reverse current will not flow from the main pump circuit to the forward section of the pump circuit.

Abstract: A semiconductor storage apparatus of high convenience, which improves utilization efficiency of a memory region, is provided. A flash memory provided in the disclosure includes a memory controller and an NAND memory device. The memory controller includes an SRAM, an RRAM, and a write/selector. The SRAM stores a conversion table that converts a logical address into a physical address. The RRAM temporarily stores a small amount of data which should be programmed. The write/selector selectively writes the to-be-programmed data into the RRAM or an NAND memory unit of the NAND memory device.

Abstract: A reprogrammable dot product engine ternary content addressable memory (DPE-TCAM) is provided. The DPE-TCAM comprises a TCAM crossbar array comprising a plurality of match lines and a plurality of search lines. Each search line and match line are coupled together by a memory cell. A plurality of search line drivers are configured to apply a voltage signal to the search lines representing bits of a search word. Current sensing circuitry is coupled to the output of the plurality of match lines and configured to sense a current on the match lines, the sensed current indicating whether the search word and a stored word matched and, if not, the degree of mismatch between the two words.

Abstract: Disclosed herein is an apparatus that includes a memory cell army, a plurality of TSVs penetrating a semiconductor chip, an output circuit configured to output a data to the TSVs, an input circuit configured to receive a data from the TSVs, a pad supplied with a data from outside, and a control circuit configured to write the data to the memory cell array, read the data from the memory cell array, and transfer the data from the memory cell array to the input circuit via the output circuit and the TSVs.

Abstract: A resistive memory apparatus and an operating method thereof are provided. In the method, a set operation having a first enhanced bias is performed on at least one memory cell in a resistive memory array of the resistive memory apparatus, in which the first enhanced bias is larger than a bias used in a normal execution of the set operation. A heat process is performed on the memory cell. A set operation having a second enhanced bias is performed on the memory cell, in which the second enhanced bias is larger than or equal to the first enhanced bias.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.