Abstract: Methods, systems, and apparatuses for memory array bit inversion are described. A memory cell (e.g., a ferroelectric memory cell) may be written with a charge associated with a logic state that may be the inverse of the intended logic state of the cell. That is, the actual logic state of one or more memory cells may be inverted, but the intended logic state of the memory cells may remain unchanged. Different sets of transistors may be configured around a sense component of a cell to enable reading and writing of intended and inverted logic states from or to the cell. For instance, a first set of transistors may be used to read the logic state currently stored at a memory cell, while a second set of transistors may be used to read a logic state inverted from the currently stored logic state.

Abstract: In a conventional memory subsystem, a memory controller issues explicit refresh commands to a DRAM memory device to maintain integrity of the data stored in the memory device when the memory device is in an auto-refresh mode. A significant amount of power may be consumed to carry out the refresh. To address this and other issues, it is proposed to allow a partial refresh in the auto-refresh mode in which the refreshing operation may be skipped for a subset of the memory cells. Through such selective refresh skipping, the power consumed for auto-refreshes may be reduced. Operating system kernels and memory drivers may be configured to determine areas of memory for which the refreshing operation can be skipped.

Abstract: A semiconductor well of a non-volatile memory houses memory cells. The memory cells each have a floating gate and a control gate. Erasing of the memory cells includes biasing the semiconductor well with a first erase voltage having an absolute value greater than a breakdown voltage level of bipolar junctions of a control gate switching circuit of the memory. An absolute value of the first erase voltage is based on a comparison of a value of an indication of wear of the memory cells to a wear threshold value.

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register and a control logic circuit. The memory cell array includes a plurality of memory cell rows. The scrubbing control circuit generates scrubbing addresses for performing a scrubbing operation on a first memory cell row based on refresh row addresses for refreshing the memory cell rows. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection and correction operation on a plurality of sub-pages in the first memory cell row to count a number of error occurrences during a first interval and determines a sub operation in a second interval in the scrubbing operation based on the number of error occurrences in the first memory cell row.

Abstract: A memory control method, a memory storage device, and a memory control circuit unit are provided. The memory control method includes: programming multiple first memory cells in a first physical erasing unit in a rewritable non-volatile memory module; and applying an electronic pulse to at least one word line in the rewritable non-volatile memory module. The at least one word line is coupled to multiple second memory cells in the first physical erasing unit. The second memory cells include the first memory cells. The electronic pulse is not configured to read, program, or erase the second memory cells.

Abstract: A first write operation is performed to write a first portion of a set of host data to a first location of a memory device. It is determined whether a first elapsed time since the first operation is performed does not satisfy a time condition. Responsive to determining that the first elapsed time does not satisfy the time condition, a second write operation is performed to write a second portion of the set of host data to a second location of the memory device not adjacent to the first location.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of skipped refresh operations on a memory. Memory cells of memories may need to periodically perform refresh operations. In some instances, auto-refresh operations may be periodically skipped when charge retention characteristics of the memory cells of the memory exceed the auto-refresh frequency. To reduce peak current draw during refresh operations, the skipped refresh operations may be staggered across different portions of the memory. In one example, the skipped refresh operation may be staggered in time among memory dies of the memory to limit a number of memory dies that are performing an auto-refresh operation to a maximum number. In another example, the skipped refresh operation may be staggered in time among memory banks of a single memory array to limit a number of memory banks that are performing an auto-refresh operation to a maximum number.

Abstract: A drain programmed read-only memory includes a diffusion region that spans a width of a bitcell and forms a drain of a first transistor and a second transistor. A bit line lead in a metal layer adjacent the diffusion region extends across the width of the bitcell. A first via extends from an upper half of the bit line lead and couples to a drain of the first transistor. Similarly, a second via extends from a lower half of the bit line and couples to a drain of the second transistor.

Abstract: A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Abstract: A memory device includes a data storage circuit configured to access a cell array having first data stored therein when an arithmetic active operation is performed, output the first data when a first read operation is performed, access a cell array having second data stored therein when an active operation is performed, and output the second data when a second read operation is performed. The memory device also includes an arithmetic circuit configured to receive latch data generated through the first read operation and read data generated through the second read operation, and perform an arithmetic operation on the latch data and the read data.

Abstract: A method for conducting a read-verification operation on a target memory cell in a three-dimensional (3D) memory device includes removing fast charges of the target memory cell at a read-prepare step and measuring a threshold voltage of the target memory cell at a sensing step. Removing the fast charges of the target memory cell includes applying a prepare voltage (Vprepare) on an unselected top select gate (Unsel_TSG) of an unselected memory string, applying a first off voltage (Voff) on a selected word line (Sel_WL) associated with the target memory cell, and applying a pass voltage (Vpass) on an unselected word line (Unsel_WL).

Abstract: A system performs analog memory sanitization by forcing voltage levels in memory cells to substantially the same voltage level so that they are indistinguishable regardless of the data that has been previously stored in the cells. In some embodiments, a special programming operation for sanitizing a plurality of memory cells forces the charge in the cells to approximately the same voltage level by increasing the voltage level of all cells regardless of the data currently stored in the cells. As an example, each cell may be programmed to a logical high bit value (e.g., a “0”) by increasing the charge in each cell to a voltage level that is greater than the voltage level for writing the same logical bit value in a normal programming operation. Thus, after the programming operation is performed, the voltage levels of cells storing one logical bit value (e.g., a “0”) prior to the programming operation may be indistinguishable from voltage levels of cells storing a different logical bit value (e.g.

Abstract: A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

Abstract: A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Abstract: A voltage calibration scan is initiated. A first value of a data state metric measured for a sample block of a memory device based on associated with a first bin of blocks designated as a current is received. The first value is designated as a minimum value. A second value of the data state metric for the sample block is measured based on a set of read voltage offsets associated with a second bin of blocks having an index value higher than the current bin. In response to determining that the second value exceeds the first value, the first bin is maintained as the current bin and the voltage calibration scan is stopped.

Abstract: A semiconductor storage device of an embodiment includes a wiring layer M1 and a wiring layer M2. The wiring layer M1 includes a signal line through which a data signal is transferred, and a plurality of dummy patterns formed of a material same as a material of the signal line. The wiring layer M2 includes a voltage supply line through which voltage Vdd is supplied and another voltage supply line through which voltage Vss is supplied. Each of the dummy patterns is electrically connected with any one of the voltage supply lines. In a dummy pattern disposed adjacent to the signal line, a surface facing the signal line is constituted by a first surface positioned at a first distance to the signal line and a second surface positioned at a second distance to the signal line, the second distance being different from the first distance.

Abstract: A memory device can comprise an array of memory cells comprising a plurality of vertically stacked tiers of memory cells, a respective plurality of horizontal access lines coupled to each of the plurality of tiers, and a plurality of vertical sense lines coupled to each of the plurality of tiers. The array of memory cells can further comprise a plurality of multiplexors each coupled to a respective vertical sense line and configured to electrically couple the respective vertical sense line to a horizontal sense line. The memory device can also comprise a semiconductor under the array (SuA) circuitry, comprising a plurality of sense amplifiers, each sense amplifier coupled to a respective subset of the plurality of multiplexors.

Abstract: A method and solid-state storage device are disclosed for validating erasure status of data blocks on a solid-state drive. The method includes assigning each data block of a plurality of data blocks on the solid-state drive, a block identifier and an erasure status, the block identifier being system data, user data, or unmapped data, and the erasure status being erased or not erased.

Abstract: Embodiments of the disclosure are drawn to apparatuses, systems, and methods for direct access hybrid testing. A memory device, such as a high bandwidth memory (HBM) may include direct access terminals. During a testing procedure, test instructions may be provided to the memory through the direct access terminals. The test instructions include a data pointer which is associated with one of a plurality of test patterns pre-loaded in the memory and an address. The selected test pattern may be written to, and subsequently read from, the memory cells associated with the address. The read test pattern may be compared to the selected test pattern to generate result information. The test patterns may be loaded to the memory, and the result information may be read out from the memory, in an operational mode different than the operational mode in which the test instructions are provided.

Abstract: A method of manufacturing an anti-fuse device includes forming an anti-fuse structure on a substrate, forming a first transistor at a first position away from the anti-fuse device in a first direction, and forming a second transistor at a second position away from the anti-fuse device in a second direction opposite the first direction. Forming the anti-fuse structure includes forming first and second S/D structures in an active area, the first transistor includes the first S/D structure, and the second transistor includes the second S/D structure. The method includes constructing a first electrical connection between gate structures of the first and second transistors and a second electrical connection between a third S/D structure of the first transistor and a fourth S/D structure of the second transistor.