Patents Examined by Tim Phan
  • Patent number: 7389581
    Abstract: A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the substrate and at least another portion integral with the fixed portion, laterally unsupported within a thickness of the substrate and extending beyond a side thereof. Dual-sided compliant contact structures, methods of forming compliant contact structures, a method of testing a semiconductor device and a testing system are also disclosed.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: June 24, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Charles M. Watkins, Kyle K. Kirby
  • Patent number: 7373717
    Abstract: Provided is a manufacturing method of self-sustaining center-anchor microelectromechanical switch driven by an electrostatic force used for controlling a signal transmission in an electronic system, which can suppress deformation of a movement plane generated during manufacturing and operation process by inserting the self-sustaining center-anchor, and improve a ground line contact phenomenon of an upper electrode, thereby enhancing reliability and signal isolation feature while maintaining an existing insertion loss feature compared to the microelectromechanical switch of the prior art.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: May 20, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jae Woo Lee, Sung Weon Kang, Youn Tae Kim
  • Patent number: 7370413
    Abstract: An electrical connector has a hard base part forming at least one rearwardly and forwardly open seat and formed with a transverse passage extending across the seat generally at the rear seat end, a respective contact in the seat having a front end and a rear end, a respective wire projecting into the rear end of the seat and connected there to the rear contact end, and a soft jacket encapsulating a rear end of the base part and front ends of the wires and extending at least partially into the rear seat ends. This connector is made by fitting a flow-blocking bar through the passage into a position blocking forward flow in the seat to the front contact end. The rear end of the part and the bar are then enclosed in a cavity of a mold to be filled with hardenable resin.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: May 13, 2008
    Assignee: Hirschmann Automotive GmbH
    Inventors: Marcel Perle, Martin Kopf
  • Patent number: 7367120
    Abstract: A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: May 6, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Mutsuo Tsuji, Kouichi Yamauchi
  • Patent number: 7363696
    Abstract: A sealed type motor-driven compressor includes a cylindrical motor housing and an annular stator core fastened to the interior of the motor housing. A method of assembling the compressor includes fastening the stator core to the motor housing by mechanically deforming at least one of the motor housing and the stator core. It is thus possible to set the fastening interference between the motor housing and the stator core to a sufficiently great level for suppressing loosening of the stator core with respect to the motor housing, which may otherwise be caused by a relatively high pressure produced by refrigerant gas.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: April 29, 2008
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Kazuya Kimura, Izuru Shimizu, Takeshi Kawata
  • Patent number: 7356912
    Abstract: The present invention is directed towards a method of forming a ventilated seat. More specifically, in one aspect, the present invention is directed towards providing an insert in fluid communications with an air mover and a seating surface, wherein the system optionally includes a thermoelectric device for providing heating or cooling of air flowing through the insert.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: April 15, 2008
    Assignee: W.E.T. Automotive Systems, Ltd.
    Inventors: Syed R. Iqbal, Corina S. Alionte, Goran Bajic, Shaun C. Howick, Zoran Panic, Valerija Drobnjakovic, Marinko Lazanja, Simone Köhler, Peter Nägele, Stefan Stoewe, Boris Zlotin, Piter Ulan, Vladimir Gerasimov, Vladimir Proseanik
  • Patent number: 7356913
    Abstract: A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element attached, at opposite ends, to the substrate so that there is a natural deflection without stress with respect to a surface of the substrate opposite it, this natural deflection determining the first state of functioning, the second state of functioning being caused by the thermal sensor which, under the influence of temperature variation, induces a deformation of the deformable element which diminishes the deflection by subjecting it to a compressive force which shifts it in a direction opposite to its natural deflection by buckling.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: April 15, 2008
    Assignee: Commissariat A l'Energie Atomique
    Inventor: Yves Fouillet
  • Patent number: 7353595
    Abstract: A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands for testing the driver IC mounted on the tape substrate, and a plating terminal used for plating the land. The test lands are arranged in a matrix. The plating terminal is disposed so as to surround the IC lands, the circuit board terminal lands, and the test lands.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: April 8, 2008
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Koji Ito
  • Patent number: 7353597
    Abstract: A method of forming a conductive gasket material by layering at least one conductive web layer having a blended mixture of conductive fibers and low melting point nonconductive fibers onto a foam core, and needlepunching the conductive web layer and the foam core forming a conductive composite gasket material having a plurality of conductive fibers interspersed through the foam core.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: April 8, 2008
    Inventor: Joseph J. Kaplo
  • Patent number: 7353586
    Abstract: The present invention provides a method for the horizontal stacking of laminations 10 and donuts to form a stator core. A stator generator frame 2 has multiple keybars 6 that run the axial length of the frame. The laminations 10 have grooves 12 there-in that engage the keybars to provide a secure fit of the laminations to the generator frame. By extending two or more of the keybars 6, these extensions 7 may be used as rails on which the laminations may be horizontally inserted into the stator frame.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: April 8, 2008
    Assignee: Siemens Power Generation, Inc.
    Inventors: Tom Majernik, James Bauer, Barry Sargeant, George Dailey
  • Patent number: 7350283
    Abstract: A method for making a rotor for a permanent magnet electric motor comprising the steps of providing an annular permanent magnet and an annular back-up member. Affixing the magnet to the inner surface of the back-up member in an un-magnetized condition and overmolding both in an injection molding process while controlling the flow of the molten plastic so as to cause the plastic to engage the opposite sides of the magnet at substantially the same time resulting in a knit line intermediate the magnet sides on the inner surface of the magnet. Magnetizing the magnet.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: April 1, 2008
    Assignee: The Bergquist Torrington Company
    Inventors: Bumsuk Won, Russel H. Marvin, Gary Peresada
  • Patent number: 7350296
    Abstract: Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: April 1, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Sup Ryu, Myung Sam Kang
  • Patent number: 7350285
    Abstract: A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the movable contact so that the residual magnetic flux density is smaller than the operation magnetic flux density of the magnetic sensor. In manufacturing the movable contact, elastic metal plate material is processed into a downwardly opening dome shape to form the movable contact. In a method of manufacturing a switch panel, the movable contact unit is overlaid on a wiring board having a contact, including pair an outer fixed contact and a central fixed contact, that corresponds to the movable contact so that the lower end of the outer periphery of the movable contact is mounted on the outer fixed contact.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Mitsuoka, Hiromichi Koyama
  • Patent number: 7350297
    Abstract: A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece having the plating foundation layer in the portion where the punch is inserted. A second plating foundation layer is formed by printing on a rear face of the sheet-shaped insulating substrate. A first and second wiring layers composed of a metal plating layer are formed by performing electroless plating, and at the same time, a metal plating layer connecting between the first and second wiring layers is formed in the through hole using the plating foundation layer on the piece.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: April 1, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naoko Yamaguchi, Hideo Aoki
  • Patent number: 7346983
    Abstract: A spark plug is provided, for a provisional bending process for manufacturing the spark plug, as a work in a condition where an earth electrode is straight and substantially in parallel with an axial line of a center electrode. In the provisional bending process, two searchers individually facing the tip of the center electrode with the tip located therebetween are arranged, positions of the searchers in a first direction perpendicular to the axial line being adjusted for every spark plug. Then a bending punch is driven to press a second end-surface of the other end of the earth electrode down to the searchers so that the earth electrode is provisionally bent at a substantially perpendicular angle to the axial line, the second end-surface being opposite to the first end-surface. Preferably, before the provisional bending process, positioning the work and correcting the position and tilt of the work are performed.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: March 25, 2008
    Assignee: Denso Corporation
    Inventors: Syushi Oda, Shigeki Tamura
  • Patent number: 7346975
    Abstract: A method of manufacturing a stator core for an inner rotor type of motor. The core back of the stator core in the motor has an arc shaped inner circumferential surface therein that is offset from the center thereof. The stator core is produced from a laminated body having a stator core, a chuck frame that is integral with and surrounds the stator core, and connector arms that connect the stator core and the chuck frame and integral therewith. After the windings are wound around the stator teeth, the stator core is cut from each connecting arm and the stator core is removed from the chuck frame.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: March 25, 2008
    Assignee: Nidec Corporation
    Inventors: Yoshio Fujii, Susumu Terada
  • Patent number: 7343671
    Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: March 18, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
  • Patent number: 7343675
    Abstract: A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 18, 2008
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Paul B. Jaynes, Charles J. Newton, Travis L. Kerby
  • Patent number: 7340828
    Abstract: There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: March 11, 2008
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Hideyo Osanai, Makoto Namioka, Susumu Ibaraki
  • Patent number: 7340829
    Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: March 11, 2008
    Assignee: Phoenix Precision Technology Corporation
    Inventor: Ying-Tung Wang