Abstract: An apparatus for positioning and press-fitting press-fit portions of roughly L-shaped legs of contacts arranged in multiple rows in a connector into a substrate includes a press-fitting head and an alignment plate. The press-fitting head is rotatable between a rest position and a press-fitting position and has vertical grooves for receiving the contacts in the press-fitting position. The alignment plate is arranged proximate the press-fitting head when the press-fitting head is in the press-fitting position and aligns the press-fit portions of the contacts with press-fitting apertures in the substrate. The alignment plate is retracted from the press-fitting head when the press-fitting head press-fits the press-fit portions into the substrate.

Abstract: An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.

Abstract: A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

Abstract: A method for producing probes for atomic force microscopy comprises producing, on a surface of one side of a semiconductor substrate, one or more moulds for the production of one or more probe tips. One or more probe configurations and at least one set of a probe tip and a cantilever are also produced on the side of the substrate, wherein each configuration comprises a contact region for attachment of a holder. The surface area of each contact region is smaller in size than the surface area of the holder. The method further includes attaching one or more holders to the contact region(s), and releasing the probe configuration and the holder from the substrate by under-etching the probe configuration from the side of the substrate on which the probe configuration is produced.

Abstract: What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.

Abstract: The present invention relates to an electrical relay in which a solid slug is moved within a channel and used to make or break an electrical connection. The solid slug is moved by electromagnets. In the preferred embodiment, the slug is wetted by a conducting liquid, such as liquid metal, that also adheres to wettable contact pads within the channel to provide a latching mechanism. The relay is amenable to manufacture by micro-machiningtechniques.

Abstract: In wire cross-linking process, after microwave is launched into the inside of the waveguide coaxial converter, the coated wire is inserted into the wire insertion pipe. The coated wire is cross-linked by high frequency heat and a coating insulator is adhered well to an electric conductor by heat shrinking.

Abstract: Disclosed is a method of manufacturing a BPF (bandpass filter) for GHz bands of the structure that an input signal line (2) and an output signal line (3) run with a small gap on one surface of a sheet (1) made by dispersing soft magnetic metal powder in a sheet-formed polymer matrix, an internal line (6) bridges on the signal lines, and a GND line (4) runs on the reverse surface of the sheet. The method comprises inserting an intermediate product made by disposing on both the sides of an insulating film (5) the above-mentioned input signal line (2), output signal line (3) and internal line (6), on one side of the cavity of a mold for injection, and inserting a metal piece for the GND line (4) on the other side of the cavity; and injecting a polymer compound to obtain a molded article.

Abstract: In a method for marking a fuse in order to allow for the rapid visual identification of certain characteristics of that fuse, the fuse is provided with: a first color-coded visual indicia indicative of an amperage rating of the fuse; a second color-coded visual indicia indicative of an action value of the fuse; and/or a third color-coded visual indicia indicative of a voltage rating of the fuse.

Abstract: A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and the ceramic substrate. The ceramic substrate has a surface thereof having a recess formed therein. The first and second electrodes are provided on the surface of the ceramic substrate so that the recess is located between the first and second electrodes. The component is located over the recess and spaced from the ceramic substrate with a space including the recess. The space including the recess is filled with the resin. The module allows each component to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes on the substrate and improving the operation reliability.

Abstract: A mandrel, useful in high voltage cable splicing and termination operations, having a tapered surface and longitudinal ribs for assembly onto a high-voltage cable to be connected to a premolded or extruded high-voltage component. As the premolded high-voltage component is passed over the mandrel, the mandrel expands the internal cavity of the high-voltage component and may further reduce the loss of lubrication within the internal cavity of the high-voltage component thereby allowing for the high voltage component to be easily installed onto the high-voltage cable. After the high voltage component passes over the apparatus, the high-voltage component may return to a lesser-expanded shape providing a snug fit around the cable member. The high-voltage component may then compress around the cable, with a uniform layer of lubricant remaining in between interior cavity of the high-voltage component and the outer layer of the cable.

Abstract: An inner terminal installation jig used to install an inner electrode terminal mount formed on an inner peripheral surface of a hollow cylindrical sensor element of a gas sensor.

Abstract: An intermediate portion of the outer insulation of a shielded electrical cable is removed near an end of the cable. A remaining small segment of the outer insulation at the cable end is moved axially inward along the cable to bunch up an exposed conductive braid of the cable. The bunched up braid is pinched to form a flattened, bell-shaped element on two opposite sides of inner conductive wires of the cable. The inner wires are attached to electrical terminals and the terminals are inserted into an insulator mounted within a conductive connector shield. The flattened elements are simultaneously aligned between opposite crimp arms extending from sides of the connector shield. The arms are crimped onto the flattened elements using an ultrasonic/vibration type crimping process or a shear lock crimping process. Since the flattened braid elements extend away from the cable, the crimping process is offset from the inner wires.

Abstract: In a method for manufacturing an electric motor, a cylindrical stator core circumferentially dividable into a plurality of core components is inserted into a circular internal surface of a motor housing. In this case, the motor housing is heated to be expanded thermally thereby enlarge circular internal surface thereof. Then, the stator core is fit over the external surface of an, insertion guide head of a generally cylindrical shape, and the insertion guide head is moved ward toward the thermally expanded motor housing secured on a fixed table to insert the stator re inside the motor housing. When the insertion guide head reaches a predetermined axial position inside the motor housing, a pressing mechanism incorporated in the insertion guide head is operated to press the core components on the circular internal surface of the motor using.

Abstract: A driver IC and passive parts, which convert a direct current voltage into a three-phase voltage, and an FP coil for cyclically generating a magnetic field through the driver IC are mounted on a flexible substrate, which constitutes a small vibration motor. The driver IC is a so-called bare chip in which a circuit section is exposed and is not molded with resin and the like. Magnets and an unbalance weight are installed on a yoke having a shaft. The FP coil and the magnet are placed so as to face each other. A cover is caulked to fixed to a bottom plate. Thus, the vibration motor can be miniaturized and thinned. Moreover, the vibration motor can be automatically manufactured, and installing them to an electronic apparatus can be automatically performed.

Abstract: To produce bus bars, a conductive metal plate is stamped out into a plurality of strips simultaneously by press molding. Each strip has a tab having an L-shaped cross-section defined by a curved section and a distal end. The plurality of strips are bent in a thickness direction to obtain a plurality of rings, respectively. The rings are mutually different in diameter and have substantially the same center. The L-shaped tab of each of the rings is disposed such that the distal end of each tab is disposed substantially at a same distance from the center.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: A method for the repair of the overbraid for metal overbraided wiring harness is provided. The method requires no special wiring harness design, uses readily available materials and can be accomplished without removing the wiring harness. The method involves trimming around the damaged area, spreading the braid to expose a repair area, covering the repair area with a metal cover and then covering the repair area with wire screen mesh. Finally, the mesh is secured onto the wiring harness. Also provided is a metal overbraid wiring harness having been repaired with the method of the present invention.

Abstract: A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project above the setting resin and ink cells can be formed.

Abstract: The present invention relates to a method for forming an active area or flat panel in an X-ray detector device. The method comprises forming at least one flat form factor panel in a first size on a substrate of a second size and extending at least one contact of the at least one flat form factor panel. The method further comprises trimming the substrate to the first size forming the at least one flat panel.