Patents Examined by Tim Phan
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Patent number: 7216426Abstract: A method for forming a separable electrical connector having an electrical interface surface includes the steps of molding an interface shell from a thermoplastic, placing the interface shell against an electrical interface portion of a mold cavity and molding a housing within the mold cavity. When placed in the mold cavity, the interface shell provides a barrier to the mold cavity interface portion, wherein the housing is isolated from the electrical interface potion of the mold cavity by the interface shell. The shell has an inner surface and an outer surface and the housing is bonded to one of the inner and outer surfaces, wherein the other of the inner and outer surfaces of the shell defines the electrical interface surface of the electrical connector.Type: GrantFiled: March 22, 2006Date of Patent: May 15, 2007Assignee: Thomas & Betts International, Inc.Inventors: Alan D. Borgstrom, Frank M. Stepniak
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Patent number: 7213324Abstract: A number of embodiments of rotating electrical machines and methods for winding them that provides a high space utilization and very effective winding with less likelihood of damage to the insulation of the wire of the winding during the winding process. The arrangement basically does not require the winding needle to be moved back and forth in the slot between the poles but rather employs insulating inserts that are positioned on the axial faces of the poles outside of the gaps for guiding the wire from one end to the other so as to provide the high space utilization.Type: GrantFiled: March 3, 2003Date of Patent: May 8, 2007Assignee: Kabushiki Kaisha MoricInventor: Tadashi Takano
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Patent number: 7213327Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.Type: GrantFiled: August 7, 2004Date of Patent: May 8, 2007Inventors: Sung-Ling Su, Zhiqiang Xu
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Patent number: 7210224Abstract: An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate having a plurality of longitudinal members arranged substantially parallel to a second axis, the top plate formed over the dielectric layer. Multiple edges formed at the interfaces between the top and bottom plates result in regions of localized charge concentration when a programming voltage is applied across the antifuse. As a result, the formation of the antifuse dielectric over the comers of the bottom plates enhance the electric field during programming of the antifuse. Reduced programming voltages can be used in programming the antifuse and the resulting conductive path between the top and bottom plates will likely form along the multiple edges.Type: GrantFiled: April 13, 2004Date of Patent: May 1, 2007Assignee: Micron Technology, Inc.Inventor: Jigish D. Trivedi
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Patent number: 7210214Abstract: A method of insulating the proximal portions of the coil edges of the stator. The insulation sheet has a folding portion for folding one or more coils of the same phase and two insertion portions extending from the folding portion so that distal ends are positioned away from a centerline of the folding portion. One or more coils of the same phase are folded by the folding portion and the two inserting portions are inserted into the slot or slots from which the one or more coils project. The inserting portions are drawn from inside of the stator core so that the folding portion spreads to fold the proximal portions of the coils. The inserting portions are securely held between the wall of the slots and the coils to prevent the insulation sheet from displacement, inclination and slip off to securely insulate the coils of different phases.Type: GrantFiled: January 11, 2005Date of Patent: May 1, 2007Assignee: Fanuc LtdInventors: Kiyoshi Tagami, Yukio Katsuzawa, Michi Masuya, Hideki Oka, Masamoto Fukuda
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Patent number: 7210222Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.Type: GrantFiled: January 16, 2004Date of Patent: May 1, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keizo Izumida, Takeshi Takeda, Kazuyuki Nakano
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Patent number: 7207101Abstract: A wire processing apparatus includes a microwave generator, a microwave transmitter, a waveguide coaxial converter and a wire insertion pipe, and the wire insertion pipe is disposed in the wireguide coaxial converter. In wire recycling process, after a tip end of a coated wire is inserted into the wire insertion pipe, microwave is launched into the inside of the waveguide coaxial converter. The tip end of the coated wire is separated into a decomposed coating insulator and a molten electric conductor by microwave. In wire cross-linking process, after microwave is launched into the inside of the waveguide coaxial converter, the coated wire is inserted into the wire insertion pipe. The coated wire is cross-linked by high frequency heat and a coating insulator is adhered well to an electric conductor by heat shrinking.Type: GrantFiled: February 13, 2004Date of Patent: April 24, 2007Assignee: Yazaki CorporationInventors: Tatsuya Kato, Masashi Kando
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Patent number: 7204011Abstract: A method for assembling machines using multiple, structurally equivalent components. The characteristics of each component are tested. The tested components are sorted into component classes using the test information. Individual components are selected from the classes and combined in a manner that, when combined, will provide desired price/performance characteristics in the machine. Machines with improved price/performance characteristics may be assembled without requiring change to the quality of the components, or the manner in which the components are manufactured.Type: GrantFiled: February 5, 2004Date of Patent: April 17, 2007Assignee: Matra Manufacturing & Services SASInventor: Boris A. Maslov
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Patent number: 7200920Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.Type: GrantFiled: October 25, 2001Date of Patent: April 10, 2007Inventor: Israel Schuster
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Patent number: 7197811Abstract: A technique for separating the stator leads of an electric motor during the manufacturing process. The technique comprises a system having a lead gathering assembly, a lead separator, and a drive mechanism. The lead gathering assembly is adapted to gather together a plurality of stator windings extending from a stator. The lead separator having a plurality of teeth adapted to separate a stator winding from the plurality of stator windings gathered together by the lead gathering assembly. The drive mechanism is adapted to drive the lead separator into the plurality of stator windings. The lead separator has teeth to separate each of the stator windings gathered together by the lead gathering assembly.Type: GrantFiled: February 18, 2004Date of Patent: April 3, 2007Assignee: Reliance Electric Technologies, LLCInventor: Hobart DeHart
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Patent number: 7194794Abstract: An electrical machine has a base body provided with conductors fixed in grooves of the base body by a material which limits a groove slot at both sides, and the conductors in the grooves are deformed by a stamping punch introducible through the groove slot into the corresponding groove so that a conductor cross-section is adjusted to a groove cross-section in a region of the corresponding conductor.Type: GrantFiled: June 22, 2004Date of Patent: March 27, 2007Assignee: Robert Bosch GmbHInventors: Dieter Arendes, Christian Werthmann, Maik Seidel, Lars Blenkle, Mirko Bunzel
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Patent number: 7191509Abstract: The invention relates to a method for adjusting the switch-gap between the overlapping metal tongues of a reed switch contained in a glass envelope, in which a beam of radiation energy is directed through the envelope onto a localised area of at least one of the tongues for a specific period of time, thereby effecting thermally-induced bending of the tongue in question about the irradiated area, wherein a radiation source is used which delivers radiation energy having a wavelength in a range in which the radiation is absorbed by the glass envelope to a considerable extent, and wherein the beam of radiation energy is focussed and measured in such a manner that the proportion between the irradiated glass volume of the envelope and the irradiated metal area of at least one of the tongues that is obtained is such that the temperature of the glass undergoes a temperature increase of less than 100 Kelvin during the time required for heating the metal to the melting point.Type: GrantFiled: March 10, 2003Date of Patent: March 20, 2007Assignee: Kearney-National Netherlands Holding B.V.Inventor: Gerardus Judocus Cornelus Van Gastel
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Patent number: 7188411Abstract: A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity furthermore has an internal wall with at least one region made of an initial material (for example, silicon). A metal is deposited close to the region of initial material. The circuit is then heated to form a portion of the compound material (for example, a silicide) in the region of initial material inside the cavity. The compound material is formed from elements of the initial material and from some of the metal deposited. The excess metal that has not formed some of the compound material is then removed from the cavity.Type: GrantFiled: September 8, 2003Date of Patent: March 13, 2007Assignee: STMicroelectronics S.A.Inventors: Philippe Coronel, Christophe Regnier, François Wacquant, Thomas Skotnicki
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Patent number: 7188414Abstract: A flat electrical cable and a modular rotary anvil for assembling a flat electrical cable wherein the flat cable includes an upper and lower layer. The upper layer has ribs protruding along its length that are substantially parallel to one another, and continuous substantially parallel and adjacent seams formed therebetween. Conductors are placed between the upper and lower layers adjacent the seams. The present invention may have upper and lower polyester layers having copper conductors therebetween and the seams ultrasonically welded in order to provide a flat electrical cable for various applications such as incorporation in an automobile clockspring. The modular rotary anvil includes multiple removable and interchangeable segments or inserts which provide the ability to impart a smooth or knurled textured surface pattern to the work-piece. piece. Other inserts include cutting inserts which provide for a seam on the work-piece while a the same time cuts the work-piece along a seam.Type: GrantFiled: May 21, 2003Date of Patent: March 13, 2007Assignee: Methode Electronics, Inc.Inventors: Tom Schilson, Steve Kamps
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Patent number: 7188404Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.Type: GrantFiled: January 18, 2005Date of Patent: March 13, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masato Hashimoto, Yoshiro Morimoto, Akio Fukuoka, Hiroaki Kaito, Hiroyuki Saikawa, Toshiki Matsukawa, Junichi Hayase
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Patent number: 7185428Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.Type: GrantFiled: December 16, 2003Date of Patent: March 6, 2007Assignee: International Business Machines CorporationInventors: Frank D. Egitto, Kevin T. Knadle, Andrew M. Seman
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Patent number: 7185427Abstract: The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The electrically conductive structure may include a contact pad on a first side of the printed circuit board and two or more connection pads on the first side of the printed circuit board. The two or more connection pads are in close physical proximity to the contact pad and electrically connected to the contact pad. The element on the printed circuit board is directly connected to one the two or more connection pads electrically. The structure permits various engineering changes to the electrical connections of elements on the printed circuit board by desoldering electrical connections to the two or more connection pad, by severing traces to the connection pads, or by severing the electrical connection between the connection pads and the contact pad.Type: GrantFiled: April 28, 2003Date of Patent: March 6, 2007Assignee: Agilent Technologies, Inc.Inventors: Stephen Willard, Philip N King
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Patent number: 7185414Abstract: An apparatus in which wave windings with a defined number of waves are cut from a continuously formed wave winding band. In forming with a wire guide, the wave winding band is laid in alternation around the outer side faces of forming protrusions, offset from one another on the circumference of two disks. The two disks can be driven to rotate. In the angular range in which the wave winding band is driven on the circumference of the disks or roller, the spacing between one forming protrusion of one row and the next forming protrusion in the other row is increased by such an amount that the outer side faces of the forming protrusions form the winding heads of the wave windings. The wave windings cut from the wave winding band are introduced into radially outwardly open slots of a lamination packet or a rotorlike transfer tool.Type: GrantFiled: August 7, 2003Date of Patent: March 6, 2007Assignee: Elmotec Statomat Vertriebs GmbHInventor: Sadik Sadiku
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Patent number: 7185413Abstract: A motor manufacturing method includes: a coil formation step of forming a unipolar coil, having coil inserting portions at two positions and coil end portions at two positions, in to a shape that changes such that a size in a height direction parallel to the coil inserting portion is larger in an inner peripheral side corresponding to a diametrical direction of a motor core along a direction of a winding axis center, than in an outer peripheral side; and a coil insertion step of disposing the unipolar coil in such a manner that the coil inserting portions in the unipolar coil respectively face toward inner peripheral opening portions of slots and are substantially parallel to an axial direction of the motor core, and inserting the coil inserting portions of the unipolar coil into the slots by moving the unipolar coil toward the motor core substantially linearly, while holding the motor core such that protrusion dimensions at both ends protruding from both end surface positions in an axial direction of the motType: GrantFiled: July 30, 2002Date of Patent: March 6, 2007Assignee: Aisin Aw Co., Ltd.Inventors: Tooru Kuroyanagi, Tsuyoshi Yamaguchi, Shingo Hashimoto
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Patent number: 7181831Abstract: A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.Type: GrantFiled: September 10, 2004Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Toshiro Otobe