Patents Examined by Timothy J. Dole
  • Patent number: 11665825
    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: May 30, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chui Shin, Ji Hong Jo
  • Patent number: 11658470
    Abstract: A cable passthrough includes a first layer having a first edge and an aperture, and a second layer overlapping the first layer. The passthrough is configured to be installed on a roof deck, such that the aperture is configured to align with an aperture formed within the roof deck. The passthrough is configured to receive at least one cable having a first end and a second end. The second end of the cable is capable of extending outwardly from the first edge of the first layer and the first edge of the second layer of the passthrough. The cable is configured to be positioned intermediate the first layer and the second layer.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: May 23, 2023
    Assignee: GAF Energy LLC
    Inventors: Thierry Nguyen, Evan Wray, Duncan Cleminshaw, Ryan Lemon Devine, Jonathan Hewlett, Brian Edward Atchley
  • Patent number: 11653450
    Abstract: A power distributor of an electrical system of a motor vehicle, including a circuit board, which has a main connection to a main circuit and multiple secondary connections. Each secondary connection is assigned to one secondary circuit and electrically contacted with the main connection via a respective circuit breaker that has two connections. The two connections of each circuit breaker are electrically contacted directly with the circuit board.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: May 16, 2023
    Assignee: Ellenberger & Poensgen GmbH
    Inventors: Manuel Engewald, Sascha Hoenig, Dietmar Koops, Ewald Schneider, Wolfgang Ullermann
  • Patent number: 11651904
    Abstract: A multilayer structure includes a first insulating layer including a first body of an anodized oxide material, a first via conductor penetrating through the first body, and a first internal wiring layer electrically connected to the first via conductor, a second insulating layer including a second body of the anodized oxide material, a second via conductor penetrating through the second body, and a second connection pad electrically connected to the second via conductor, and a solder hump provided on one of the first internal wiring layer and the second connection pad and between the first insulating layer and the second insulating layer. The first via conductor, the first internal wiring layer, the second connection pad, and the second via conductor are electrically connected to each other through the solder bump.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: May 16, 2023
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11640934
    Abstract: Techniques for fabricating a package substrate comprising a via, a conductive line, and a pad are described. The package substrate can be included in a semiconductor package. For one technique, a package substrate includes: a pad in a dielectric layer; a via; and a conductive line. The via and the conductive line can be part of a structure. Alternatively, the conductive line can be adjacent to the via. The dielectric layer can include a pocket above the pad. One or more portions of the via may be formed in the pocket above the pad. Zero or more portions of the via can be formed on the dielectric layer outside the pocket. In some scenarios, no pad is above the via. The package substrate provides several advantages. One exemplary advantage is that the package substrate can assist with increasing an input/output density per millimeter per layer (IO/mm/layer) of the package substrate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: May 2, 2023
    Assignee: Intel Corporation
    Inventors: Meizi Jiao, Chong Zhang, Hongxia Feng, Kevin Mccarthy
  • Patent number: 11603054
    Abstract: A line arrangement for assembly, for at least partial insertion inside a component and/or for guiding through the inside of a component, particularly a chamber of a bodywork component of a vehicle, includes at least one line which is designed in a non-rigid manner with a plurality of rigid segments and with flexible connection elements that connect to the rigid segments.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: March 14, 2023
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Oliver Haff, Christian Hipf-Buffi, Jan Mueller-Brincken, Martin Schuster
  • Patent number: 11582538
    Abstract: A horizontal cable manager that includes a body with a back and a plurality of fingers extending from the back of the body. The distal end of at least one finger includes a hinge pin holder. The horizontal cable manager also includes a door hingedly attached to the fingers extending from the body. The door has a front, a back, a top edge, a bottom edge, and at least one hinge pin receptacle positioned along the top edge or the bottom edge of the door. The hinge pin receptacle houses a magnet to enable the door to attach to the hinge pin holder of the at least one finger to hold the door in a closed position.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: February 14, 2023
    Assignee: Panduit Corp.
    Inventors: Jason O'Young, Kevin M. Zumbek
  • Patent number: 11577675
    Abstract: A cable system for power distribution including a first connection and a second connection each connected respectively to a first cable and a second cable, the first and second connections to be connected to a battery; said second cable being split into a set of two distinct wires connected to a circuit protector, wherein each of the first cable and the second cable are connected respectively to a third connection and a fourth connection each configured to connect to a first load, wherein each of the first cable and the second cable are additionally connected to a fifth connection and a sixth connection each configured to connect to a second load; and wherein the first cable and the second cable are configured to bypass another circuit protector for a difference power distribution connect to the battery.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: February 14, 2023
    Assignee: Sea Clear Power Inc.
    Inventor: Nathan Martin
  • Patent number: 11569648
    Abstract: A joint-use bracket (JUB) for installing multiple communication lines in a joint-use section on a utility pole is disclosed. The JUB includes a curved plate having a generally rectangular shape elongated in a longitudinal direction and curved along a lateral direction. The curved plate is formed to have one or more attachment holes, one or more slots, and multiple threaded receiving holes. The JUB also has multiple hooks formed contiguous to the front surface of the curved plate, each hook having a threaded through hole, wherein multiple bolts are associated with the multiple hooks, respectively. Each hook is configured to hold a wire or a cable through a D-shaped opening that is formed by the hook and the bolt when the bolt is screwed in through the threaded through hole to have the end portion engaged with the threaded receiving hole.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: January 31, 2023
    Assignee: VAF Industries, LLC
    Inventors: Glenn Sailer, Raymond Tai
  • Patent number: 11569003
    Abstract: A composite cable is composed of a plurality of power supply wires, a plurality of signal wires, two or more of which are configured to be connected to a common terminal member, and a sheath provided to cover the plurality of power supply wires and the plurality of signal wires together. The two or more of the plurality of signal wires being configured to be connected to the common terminal member are provided adjacent to each other.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: January 31, 2023
    Assignee: HITACHI METALS, LTD.
    Inventors: Yoshikazu Hayakawa, Tomoyuki Murayama, Hirotaka Eshima, Takahiro Futatsumori
  • Patent number: 11562858
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)?(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Yoon Kim, Man Su Byun
  • Patent number: 11557434
    Abstract: A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle ? between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle ? between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: January 17, 2023
    Assignee: TAIYO YUDEN CO., LTD
    Inventors: Satoshi Kobayashi, Takahisa Fukuda, Tomoaki Nakamura, Mikio Tahara, Naoki Saito, Kiyoshiro Yatagawa
  • Patent number: 11539177
    Abstract: A relay assembly comprises a vital relay used in a vital circuit and configured to be rack-installed in an equipment room in a railroad case or a railroad housing for providing a modular solid-state current-limiting. The relay assembly further comprises a plurality of vital relay contacts to which a current flow is restricted by a single supply solid-state current limiter. The relay assembly further comprises a relay socket base assembly coupled to the vital relay. The relay socket base assembly includes a relay socket base including a plurality of vital relay contact prongs, a plug assembly including a plurality of printed circuit board (PCB) mounted contact terminals, and a plurality of contact terminals that provide a connection between the plurality of vital relay contact prongs and the plurality of printed circuit board (PCB) mounted contact terminals. The relay assembly further comprises an ancillary electrical control module.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: December 27, 2022
    Assignee: Siemens Mobility, Inc.
    Inventor: Matthew Dingman
  • Patent number: 11527875
    Abstract: A mounting bracket assembly including at least one mount configured to be connected to a structure, a distribution harness configured to mount at least one electrical receptacle, and at least one bracket. The at least one bracket is configured to at least partially extend around the distribution harness and removably connect the distribution harness to the at least one mount.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: December 13, 2022
    Assignee: Group Dekko, Inc.
    Inventor: Raymond H. Riner
  • Patent number: 11521764
    Abstract: A wire harness includes: an electrical wire including a core wire and an insulating covering for covering the core wire; and a sheet material in which the electrical wire is disposed on a resin main surface, and a part of the main surface having contact with the electrical wire is thermally processed with the insulating covering of the electrical wire, thereby forming an electrical wire fixing part. A part of the sheet material including the electrical wire fixing part is softer than the insulating covering.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 6, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Housei Mizuno, Hiroki Hirai, Makoto Higashikozono, Yasuyuki Otsuka, Satoshi Murao, Toyoki Furukawa
  • Patent number: 11515696
    Abstract: An enclosure and method for an electrical component having a base portion and a cover portion. The base portion has a first channel which extends about at least a portion of a periphery of the base portion. The cover portion has a second channel which extends about at least a portion of a periphery of the cover portion. The second channel is aligned with the first channel to form a sealant receiving channel. A sealant is provided in the sealant receiving channel. The cover portion has at least one inlet opening configured to receive the sealant as the sealant is injected into the sealant receiving channel. The cover portion has at least one outlet opening configured to allow excess sealant of the sealant to escape from the sealant receiving channel as the sealant is injected into the sealant receiving channel.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: November 29, 2022
    Inventor: Zachary Wood Lyon
  • Patent number: 11508499
    Abstract: A grommet includes: a water stop portion that has an annular shape and is inserted to a through hole formed in an attachment panel for stopping water; and a first partition wall portion and a second partition wall portion that are unit arranged to project toward a radially inner side of the water stop portion. The water stop portion includes: a first contact portion that is capable of coming into contact with a first side surface of a circumference edge portion of the through hole; a second contact portion that is capable of coming into contact with the first side surface; a groove portion formed in an annular shape between the first contact portion and the second contact portion; and a recess/protrusion portion that is formed on a circumferential wall inside the groove portion.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: November 22, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Hirotaka Kiyota, Masaru Kiuchi, Takeshi Onoda
  • Patent number: 11502489
    Abstract: An outer cover body for electrical wires, which is formed by bending a resin sheet and to be attached to an outer periphery of an electrical wire, includes a plurality of wall parts extending along an extending direction of the electrical wire and forming an accommodating part for accommodating the electrical wire. At least one of the plurality of wall parts includes a wall surface overlapping part having an outer side wall surface having a first notch, and an inner side wall surface overlapping the outer side wall surface and having a second notch. A branch line through-hole is formed by overlapping the first notch and the second notch.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: November 15, 2022
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems Inc.
    Inventors: Takashi Oshino, Koichi Maeno, Naoyuki Kojima, Hideyuki Ikeda, Yoshikazu Kamei
  • Patent number: 11491935
    Abstract: The present invention provides a novel power distribution harness system provided as a unit for distribution of power from a primary power source including a first closed end lug and second closed end lug each independently connected to respective multi connector cables with the second multi connector cable being split into two distinct wires with each connected to a blade fuse, whereby the two distinct wires are independently connected to respective lock connectors and a second set of distinct cable wires are each connected independently to a second opening of firsthand lock connector and a second opening of secondhand lock connector, with each multi connector cable ultimately connected respectively independently to terminating hand lock connectors.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: November 8, 2022
    Assignee: Sea Clear Power Inc.
    Inventor: Nathan Martin
  • Patent number: 11479187
    Abstract: A bearing structure includes a base-side unit structure provided on a bearing member side, a rotary member-side unit structure relatively rotatable with respect to the base-side unit structure, an arcuate or circumferential conductor provided in one of the base-side unit structure and the rotary member-side unit structure, and a contactor provided in the other of the unit structures and configured to retain an electric conduction state with the conductor and includes a power feeding path configured by a power feeding harness for feeding electric power from a power feeding device of a vehicle to an electric device of the rotary member via the conductor and the contactor.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 25, 2022
    Assignee: TACHI-S CO., LTD.
    Inventor: Tsuyoshi Yumoto