Patents Examined by Timothy J. Dole
  • Wiring member with resin molded portions and bracket
    Patent number: 11342096
    Abstract: A wiring member includes wires, a resin molded portion that covers the wires, and a bracket attachment that is attached to the resin molded portion. The resin molded portion includes a bracket attachment portion that is formed with at least one flat surface portion. The bracket includes a first attachment portion that is configured to be attached to an attachment location, and a second attachment portion that is connected to the first attachment portion and is crimped to the bracket attachment portion while being in surface contact with at least one of the at least one flat surface portion.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 24, 2022
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hironobu Yamamoto, Moriyuki Shimizu
  • Water-proof lock structure, electric connection box, and apparatus
    Patent number: 11329465
    Abstract: A lock structure includes: an engaged body; and an engaging body capable of inserting and removing the engaged body along insertion and removal directions opposite to each other. An engaged body includes first and second engaged walls disposed opposite to each other at an interval, a connection wall which connects end portions on the insertion direction side thereof, and an engaged protrusion protruding from an outer wall surface of the second engaged wall. An engaging body has first and second engaging walls in which a space between the respective inner wall surfaces is defined as an accommodation space of the engaged body, an engaging protrusion protruding from the inner wall surface of the second engaging wall and capable of locking the engaged protrusion on the removal direction side, and a third engaging wall disposed between the first and second engaging walls.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: May 10, 2022
    Assignee: YAZAKI CORPORATION
    Inventor: Yukihiro Kawamura
  • Multilayer ceramic electronic parts with conductive resin
    Patent number: 11315733
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
  • Ceramic electronic device with varying roughness terminal electrode
    Patent number: 11302480
    Abstract: A ceramic electronic device including a ceramic body having ceramic layers and internal electrode layers stacked in alternating manner and a terminal electrode formed at an end face of the ceramic body. The terminal electrode includes a base electrode including a metal component and a glass component, an intermediate electrode layer including Ni and formed at an outer face of the base electrode layer, and an upper electrode layer including Pd or Au and formed at an outer face of the intermediate electrode layer. Also, a surface roughness Ra1 of the base electrode layer in the terminal electrode is 5.0 ?m or less; or the surface roughness Ra1 of the base electrode layer, a surface roughness Ra2 of the intermediate electrode layer, and a surface roughness Ra3 of the upper electrode layer satisfy a relationship of Ra1>Ra3?Ra2.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 12, 2022
    Assignee: TDK CORPORATION
    Inventors: Tetsuhiro Takahashi, Tomohisa Fukuoka
  • Information handling system high density motherboard
    Patent number: 11294435
    Abstract: An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: April 5, 2022
    Assignee: Dell Products L.P.
    Inventors: Yong-Teng Lin, Jeffrey D. Kane
  • Multilayer ceramic electronic component having effective coverage of external electrode
    Patent number: 11282646
    Abstract: A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In Kyung Jung, Dong Hwi Shin
  • High-speed flat cable having better bending/folding memory and manufacturing method thereof
    Patent number: 11282618
    Abstract: A high-speed flat cable includes a plurality of shielded signal units, one or more bendable composite layers, and an adhesive layer. The shielded signal units are substantially coplanar, spaced apart from each other or adjoining each other. The one or more bendable composite layers includes an inner insulating film layer, a bendable aluminum foil layer, and an outer insulating film layer. The one or more bendable composite layers composed of the inner insulating film layer, the bendable aluminum foil layer, and the outer insulating film layer increase its mechanical bending/folding property to improve the bending/folding memory. The one or more bendable composite layers allows the flat cable to be bent with ease without rebounding, thereby enhancing production efficiency.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 22, 2022
    Assignee: Amphenol AssembleTech (Xiamen) Co., Ltd
    Inventors: Wen Chu Yang, Zhi Ming Huang, David Rosenboom, Jesus Jaramillo
  • Wire harness
    Patent number: 11282617
    Abstract: A wire harness that includes an electric wire that includes a core wire, an insulating inner cover that covers an outer circumference of the core wire, and a conductive shield that covers an outer circumference of the insulating inner cover; a conductive bracket including a plate that includes an insertion hole through which the electric wire is inserted and a protrusion protruding from an edge of the insertion hole in the plate; a fastener that fastens a folded-back portion of the shield that is folded back to an outer circumferential side of the protrusion to the protrusion; and a body made of resin that sandwiches the plate in a thickness direction.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 22, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Masashi Hayashi
  • Wire harness with short-long sides overlapping flat wires
    Patent number: 11273774
    Abstract: A wire harness, including: a first wire including a first core wire and a second wire including a second core wire, the first core wire and the second core wire being joined together, wherein the first core wire includes a first flat surface extending along an entire length of the first core wire in a length direction, the second core wire includes a second flat surface extending along an entire length of the second core wire in a length direction, and the first flat surface and the second flat surface are overlapped and joined.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: March 15, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Nakai
  • Composite cable and composite harness
    Patent number: 11264148
    Abstract: A composite cable includes a pair of first electric wires, a twisted pair wire formed by twisting a pair of second electric wires having a smaller outer diameter than the first electric wires, a tape member wound into a spiral around an assembly that is formed by twisting the pair of first electric wires and the twisted pair wire together, and a sheath covering an outer periphery of the tape member. The tape member and the sheath includes an inwardly projecting part formed in a spiral along a cable longitudinal direction and formed so as to enter inward at least one of a valley part between the two first electric wires and valley parts between the first electric wires and the twisted pair wire. The inwardly projecting part has a projecting length of not less than 3% of an outer diameter of the first electric wires.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 1, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Yoshikazu Hayakawa, Tomoyuki Murayama, Hirotaka Eshima, Fumihito Oka, Takahiro Futatsumori
  • Multilayer ceramic capacitor with interposing molybdenum (Mo) ground layer
    Patent number: 11264168
    Abstract: A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two end faces; wherein: the pair of external electrodes have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and at least a part of a surface of the ground layer on a side of the plated layer includes an interposing substance including Mo.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 1, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Haruna Ubukata, Satoko Namiki, Atsuhiro Yanagisawa, Tomonori Yamatoh
  • Wiring harness with a reinforcing layer that includes polyurea resin
    Patent number: 11222736
    Abstract: A wiring harness (10) includes wires (20), an exterior material, such as a pipe (30), through which the wires (20) are inserted, and a reinforcing layer (40) formed to cover at least either the wires (20) or the exterior material. The reinforcing layer (40) is constituted by a resin film made of one or more materials selected from polyurea resin, polyurethane resin and mixed resin of the polyurea resin and the polyurethane resin.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 11, 2022
    Inventors: Hikaru Omae, Masashi Hayashi
  • Electrical component-attached wire harness for vehicle dashboard and assembly structure of electrical component-attached wire harness
    Patent number: 11208058
    Abstract: An electrical component-attached wire harness includes a base material disposed in a vehicle, a wire harness disposed along the base material, and at least one electrical component to which an end portion of the wire harness is connected. For example, the at least one electrical component may include an electronic control unit.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 28, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koji Yamaguchi, Housei Mizuno, Shinya Sadohara, Hiroki Hirai, Shinya Itou, Yutaka Matsumura
  • Joint, termination or cross-connection arrangement for a cable and method for providing a joint, termination or cross-connection arrangement
    Patent number: 11201458
    Abstract: A joint, termination or cross-connection arrangement for a cable includes a first cable and a protective casing. The arrangement further includes a transition sleeve. The transition sleeve, at a first longitudinal end surface thereof, is welded to the metallic sheath of the first cable around the whole circumference of the metallic sheath. The transition sleeve is furthermore welded to the protective casing around the whole circumference of the transition sleeve. A method of providing such an arrangement includes: welding the transition sleeve, at the first longitudinal end surface, to the metallic sheath of the first cable around the whole circumference of the metallic sheath; and welding the transition sleeve to a first tubular end portion of the protective casing around the whole circumference of the transition sleeve.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 14, 2021
    Assignee: NKT HV Cables AB
    Inventors: Henrik Ekholm, Johan Jäderberg
  • Intermediate busway support
    Patent number: 11183827
    Abstract: An apparatus for providing support to a first vertical busway extending between a floor surface and a ceiling surface, the first busway having first and second lateral faces, includes a frame having first and second vertical struts, wherein the first and second vertical struts are attached to the floor surface adjacent the first and second lateral faces; a lower pair of hangers each attached to the floor surface, wherein one of the lower pair of hangers is attached to the first lateral face, and wherein the other of the lower pair of hangers is attached to the second lateral face; and an upper pair of hangers vertically spaced apart from the lower pair of hangers, wherein the upper pair of hangers are attached to the first and second vertical struts and to the first and second lateral faces.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: November 23, 2021
    Inventors: Daniel Richard Butala, Cory James Holmes, Noah G. Pepin, Ralf R. Kelm
  • Wire harness with elastic tube
    Patent number: 11183791
    Abstract: A wire harness including an electric wire that has a core wire and a core wire coating that coats the core wire, a connector that is attached to an end of the electric wire, and a seal that is interposed between the electric wire and the connector, wherein a tube with a modulus of elasticity higher than that of the core wire coating, and an outer coating that coats the tube from an outer side are provided between the electric wire and the seal.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: November 23, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomoya Kawaguchi, Masaharu Suetani
  • Electrical cable passthrough for photovoltaic systems
    Patent number: 11177639
    Abstract: A cable passthrough includes a first layer having a first edge and an aperture, and a second layer overlapping the first layer. The passthrough is configured to be installed on a roof deck, such that the aperture is configured to align with an aperture formed within the roof deck. The passthrough is configured to receive at least one cable having a first end and a second end. The second end of the cable is capable of extending outwardly from the first edge of the first layer and the first edge of the second layer of the passthrough. The cable is configured to be positioned intermediate the first layer and the second layer.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: November 16, 2021
    Assignee: GAF Energy LLC
    Inventors: Thierry Nguyen, Evan Wray, Duncan Cleminshaw, Ryan Lemon Devine, Jonathan Hewlett, Brian Edward Atchley
  • Space-efficient electrical junction box for vehicles
    Patent number: 11165234
    Abstract: An electrical junction box is provided in which a wire that is drawn from a lower surface of an upper electric component block is accommodated with an excess length in an extensible tube capable of being extended and contracted in the length direction of the wire. In the extended state of the extensible tube, the upper electric component block can be separated from an upper surface of the lower electric component block by extending the excess length of the wire in the extensible tube. In the contracted state of the extensible tube, the extensible tube is accommodated between the upper electric component block and the lower electric component block in a state in which the wire meanders in the extensible tube and the excess length is absorbed.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 2, 2021
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Kazuki Hikosaka, Hironari Tanaka
  • Features for cable managers and other electronic equipment structures
    Patent number: 11162615
    Abstract: A cable manager includes a backbone assembly and at least one side wall extending from the backbone assembly. The at least one side wall optionally includes one or more cable finger units. The backbone assembly includes a spine member having an extruded construction. The spine member includes one or more channels extending substantially an entire length thereof to facilitate easy attachment, removal and/or repositioning of a structure relative to the spine member. The cable manager optionally includes an accessory rod, a half-spool assembly, a cable finger accessory, a strap/buckle accessory, and/or a door assembly having an interference-free hinge set.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: November 2, 2021
    Assignee: Chatsworth Products, Inc.
    Inventors: Preston Ellis Hennrich, James I. Lawrence, John W. Robertson, Johnny C. Fraga
  • Electronic component with SA/BW ratio and board having the same mounted thereon
    Patent number: 11166376
    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo