Patents Examined by Timothy Thompson
  • Patent number: 10327348
    Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 18, 2019
    Assignee: Apple Inc.
    Inventors: James A. Wright, Guangtao Zhang, Raymund W. M. Kwok, Karl Ruben F. Larsson, Christopher S. Graham, Matthew D. Hill, Abhijeet Misra
  • Patent number: 10305240
    Abstract: Under compression by molds (31a, 31b), a wire (25), a covered area (27), and a crimping portion (5) are compressed and their cross-sectional areas decrease. Here, A1 is the cross-sectional area of the wire (25) after compression. That is, A1 is the sum of the cross-sectional area of the each strand after compression. Also, 131 is the cross-sectional area of the covered area (27) after compression. In the present invention, the compression rate for the wire (25) is set between 50% and 80%. Also, the compression rate for the covered area (27) is set between 40% and 90%. The amount of compression by the molds (31a, 31b) is set so that the compression rates are within these ranges. In the present invention, the compression rate is calculated by: (cross-sectional area after compression)/(cross-sectional area before compression). That is, 80% compression rate means that the cross-sectional area has decreased by 20% due to compression. That is, the relationships of 80%?(A1/A0)?50% and 90%?(B1/B0)?40% are satisfied.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: May 28, 2019
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yasushi Kihara, Yukihiro Kawamura, Takashi Tonoike, Takahito Nakashima, Hiroshi Kobayashi, Hiroyasu Taga
  • Patent number: 10295017
    Abstract: A wire fastening device, wherein two parallel wire guides, arranged oppositely are provided on the flat wire fastening device on a first and second guide sides, wherein two wire ends can be fixed permanently in the wire fastening device, which wire ends are guided movably in the wire guides against the wire fastening device, wherein for this purpose two flat sections of the wire fastening device can be fixed removably to one another by means of a fastening device provided to that effect, that the wire guides respectively of a wire end are deflected and run substantially parallel and opposite to one another, so that the guiding direction of the wire ends can be substantially reversed in the wire guiding device.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: May 21, 2019
    Assignee: X-CEN-TEK GmbH & Co. KG
    Inventors: Andreas Harms, Thomas Busch
  • Patent number: 10276515
    Abstract: Disclosed is a wiring substrate including: a first wiring layer, a second wiring layer disposed on the first wiring layer interposed by an insulating film, and a via conductor passing through the insulating film in a thickness direction, the via conductor electrically connecting the first wiring layer and the second wiring layer. The second wiring layer and the via conductor include a second sintered metal layer and a first sintered metal layer arranged to surround the second sintered metal layer, and an average particle diameter of first metal particles forming the first sintered metal layer is smaller than an average particle diameter of second metal particles forming the second sintered metal layer.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: April 30, 2019
    Assignee: DAI NIPPON PRINTING Co., Ltd.
    Inventors: Ryohei Kasai, Tsuyoshi Tsunoda, Yuichi Yamamoto, Shuji Sagara, Masaya Tanaka
  • Patent number: 10270190
    Abstract: A twist-on wire connector includes a connector cap and a tapered coil spring configured to be secured within the connector cap. The connector cap includes a peripheral wall extending between open and closed ends of the connector cap and defining a connector cap recess, top portion having the closed end, bottom portion having the open end, and asymmetrically opposed wings. The asymmetrically opposed wings are positioned to offset from a centerline of the connector cap to provide a comfortable grip while turning the twist-on wire connector during electrical wire installation.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: April 23, 2019
    Assignee: Thomas & Betts International, LLC
    Inventor: Ludovic Legault
  • Patent number: 10253549
    Abstract: An insulated glazing unit can include a spacer frame disposed between a first substrate from a second substrate and forming a portion of a sealed boundary and a flexible circuit extending through the sealed boundary. In an embodiment, the flexible circuit includes a flexible ribbon having a total length, LA, and an effective length, LE, and wherein LE is less than LA. In another embodiment, the flexible circuit includes an expandable portion adapted to expand a length of the flexible circuit to accommodate: relative movement between two or more portions of the insulated glazing unit, resizing of one or more portions of the insulated glazing unit, or any combination thereof.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: April 9, 2019
    Assignee: SAGE ELECTROCHROMICS, INC.
    Inventors: Rino Messere, Christian Müller, Robert J. Anglemier, Bryan D. Greer, Clifford Lee Taylor
  • Patent number: 10246243
    Abstract: A method is provided. The method comprises: receiving thermal energy at a heat resistant container; converting all or a portion of the received thermal energy into electric energy; converting the electric energy into electromagnetic energy; and radiating the electromagnetic energy.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: April 2, 2019
    Assignee: Honeywell International Inc.
    Inventors: David Lowell Miller, Gary Kersten, Kendall McAdams
  • Patent number: 10239473
    Abstract: A wiring guide of a vehicle door includes: an outside guide slidably disposed on one of a vehicle body and a door of a vehicle, and having an inner portion which has a hollow and circular arc shape; and an inside guide slidably disposed on the other side of the vehicle body and the vehicle door, having an inner portion which has a hollow and circular arc shape, slidably disposed in the inner portion of the outside guide, and having a wiring penetrating therein. The outside guide and the inside guide expand and shrink in a circular arc shape upon opening and closing of the door.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: March 26, 2019
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hyong-Don Kim, Yong-Hyun Nam, Jeong-Hyeon Kim
  • Patent number: 10242766
    Abstract: A highly bendable insulated electric wire includes a conductor part that has a plurality of non-compressed strands made of a copper alloy, each of the non-compressed strands having a cross-sectional area of 0.13 sq. mm, and a covering part that is provided on the conductor part, wherein the conductor part has an elongation of 7% or more and a tensile strength of 500 MPa or more, and the covering part is made of 100 degree Celsius heat-resistant polyvinyl chloride and has an elongation of 100% or more at a temperature of ?40 degree Celsius.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 26, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Takeshi Oshima, Yuki Tosaya
  • Patent number: 10231328
    Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: March 12, 2019
    Assignee: KARDIUM INC.
    Inventors: Daniel Robert Weinkam, Shane Fredrick Miller-Tait, Fernando Luis de Souza Lopes
  • Patent number: 10224704
    Abstract: A welding sleeve for armored cables including a first sleeve part arranged to receive an armored cable, wherein the first sleeve part has a perimeter surface for welding armoring wires of an armored cable thereto, a second sleeve part arranged to receive an armored cable, wherein the second sleeve part has a perimeter surface for welding armoring wires of an armored cable thereto, wherein the first sleeve part is arranged to receive the second sleeve part, the second sleeve part being axially displaceable relative to the first sleeve part, along a common central axis, between an extended position and a retracted position, in which retracted position the first sleeve part receives a greater portion of the second sleeve part than in the extended position, and a rotation preventing arrangement arranged to prevent rotational motion of the first sleeve part relative to the second sleeve part.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: March 5, 2019
    Assignee: NKT HV Cables GmbH
    Inventors: Anders Hansson, Andreas Tyrberg, Johan Hedlund
  • Patent number: 10196014
    Abstract: A seal mold divided structure for combination cable is characterized in that it comprises the following structures: a first cable and a second cable separated from the combination cable; a connector provided at the end of said first cable; a division molding portion that molds the division part between said first cable and second cable and keeps said first cable and second cable separated from each other; a connector molding portion that molds the connection part between said connector and said first cable; a protection tube that protects said first cable, with its ends respectively fixed to said division molding portion and said connector molding portion; and isolation portions, which are respectively inserted from the inner sides of both ends of said protection tube and wrap the exterior of said first cable, capable of preventing inflow of a molding compound.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: February 5, 2019
    Assignee: Continental Teves AG & Co. oHG
    Inventor: YongWoon Cho
  • Patent number: 10199809
    Abstract: An integral, unitary pre-expanded cover assembly unit for covering an electrical connection between first and second electrical cables each having a primary conductor and a neutral conductor includes a cover assembly, a holdout and a holdout support. The cover assembly includes an elastomeric sleeve and a duct. The elastomeric sleeve defines a cable passage to receive the electrical connection and the primary conductors of the first and second cables. The duct overlies the elastomeric sleeve. The duct defines a duct passage configured to receive at least one of the neutral conductors therethrough. The holdout is removably mounted within the cable passage of the elastomeric sleeve. The holdout defines a holdout passage. The holdout maintains the elastomeric sleeve in an expanded state. The holdout support is removably mounted within the holdout passage. The holdout support reinforces the holdout.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: February 5, 2019
    Assignee: TE Connectivity Corporation
    Inventors: Kok Chywn Chuang, Edward O'Sullivan, Mahmoud K. Seraj
  • Patent number: 10201079
    Abstract: A flexible electronic device including a substrate and a line layer disposed on the substrate. The line layer includes a first conductive layer disposed on the substrate, a plurality of polymer walls disposed on the first conductive layer and spaced apart from each other in a horizontal direction parallel to the substrate, and a second conductive layer including first portions disposed between the polymer walls and a second portion disposed on the polymer walls. A portion of the first conductive layer contacts the first portions.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: February 5, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jaeneung Kim, Jungha Son, Yong-hwan Ryu
  • Patent number: 10197190
    Abstract: A cable guard (20) for enclosing and protecting at least one cable (34) extending alongside a tube (28) comprising, a base (22), a ring (24), and a u-bolt (124), the base (22) has hinge receivers (72 and 74) to receive hinge pins (106 and 108) for rotatably and removably connecting base (22) and ring (24), and the ring (24) includes u-bolt receivers (70 and 71) for rotatably and removably connecting u-bolt (124) and ring (22), the ring (22) includes ring rotational stops (200 and 202) to prevent over rotation and uncontrollable detachment of the base (22) and ring (24); the base (22) includes u-bolt slots (116 and 118) and the ring (24) includes u-bolt leg receivers (144 and 146) for cooperating with the u-bolt slots (116 and 118) and receiving the u-bolt legs (140 and 142) in the base (24), whereby the cable guard (20) is assembled, at least one cable (34) is enclosed, the cable guard (20) is mounted, and the u-bolt (124) is tensioned by tightening the nuts (148 and 150) and as tension increases along with r
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: February 5, 2019
    Inventor: Scott E. Neff
  • Patent number: 10194568
    Abstract: Semi-finished product made from composite material comprising a thermoplastic or thermosetting matrix and reinforcement fillers. The semi-finished product comprises an electromagnetic shielding film positioned in the thickness of the semi-finished product, the electromagnetic shielding film comprising holes.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: January 29, 2019
    Assignee: Compagnie Plastic Omnium
    Inventors: Gerald Andre, Hugues Cheron
  • Patent number: 10194530
    Abstract: A microelectronic system includes a base and a semiconductor package mounted on the base. The base includes an internal conductive layer and a build-up layer on the internal conductive layer. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P, and the power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: January 29, 2019
    Assignee: MEDIATEK INC.
    Inventors: Sheng-Ming Chang, Chia-Hui Liu, Shih-Chieh Lin, Chun-Ping Chen
  • Patent number: 10189422
    Abstract: A wire harness which electrically connects high-voltage devices includes a conductive path that is used as a trunk cable, a branch cable that branches from the trunk cable, and a branch connecting portion which connects the trunk cable with the branch cable, wherein the trunk cable has a trunk cable-side conductor exposed portion where a cover of the trunk cable lying in a predetermined position of the trunk cable is removed, the branch cable has a branch cable-side conductor exposed portion where a cover of the branch cable lying a predetermined position of the branch cable is removed, the trunk cable-side conductor exposed portion is connected with the branch cable-side conductor exposed portion at the branch connecting portion, and the branch connecting portion has an insulating and waterproofing portion which functions as an insulating portion and a waterproofing portion.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: January 29, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Hideomi Adachi, Hidehiko Kuboshima
  • Patent number: 10192684
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park
  • Patent number: 10193314
    Abstract: A power panel and modules for use in a power panel are disclosed. One disclosed chassis includes a top, a bottom, a front, a rear, and left and right sides, and an input power bus having a plurality of connection apertures therethrough. A plurality of circuit modules are mounted within the chassis. Each circuit module includes a circuit protection element including first and second bullet-nosed connectors, and a body element having first and second holes positioned to receive the first and second bullet-nosed connectors. The body element includes a bullet-nosed input connector sized to be received by one of the plurality of connection apertures. Each circuit element also includes an output terminal extending rearwardly from the body element.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: January 29, 2019
    Assignee: CommScope Technologies LLC
    Inventor: David J. Johnsen