Patents Examined by Timothy Thompson
  • Patent number: 10144369
    Abstract: Provided is a curvature restricting member, allowing for a curvature of the wire harness in a predetermined allowable direction, and regulating the curvature of the wire harness in a regulating direction beyond a predetermined limit state or more, the curvature restricting member includes: a plurality of member pieces arranged along the wire harness; a flexible connecting portion connecting adjacent ones of the plurality of member pieces to each other, wherein the curvature is allowed in the allowable direction by adjacent ones among the plurality of member pieces at the curbed portions separating from each other on the side opposite to the connecting portion and the connection portion bending, and wherein the curvature is not allowed in the restricting direction beyond the limit state by adjacent ones among the plurality of member pieces at the curbed portion abutting against each other on the side opposite to the connecting portion.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: December 4, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Tsukasa Sekino, Mitsunobu Kato, Masaki Yokoyama, Tatsuya Otuka
  • Patent number: 10147514
    Abstract: A wire harness WH is provided with a pipe, through which wires are passed. The pipe has multiple split portions split in the longitudinal direction. The wires are branched in the longitudinal direction. The locations of branching of the wires are defined by locations corresponding to the split portions.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 4, 2018
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hidetoshi Sugino
  • Patent number: 10149384
    Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: December 4, 2018
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
  • Patent number: 10147517
    Abstract: A wire harness that includes an electric wire provided with a conductor and an insulator that coats an outer periphery of the conductor, a terminal connected to the conductor at a terminal end of the electric wire, and a molded resin portion that covers an outer periphery of the insulator at the terminal end of the electric wire and an outer periphery of an end portion on the electric wire side of the terminal. A storage modulus E? of the insulator that is measured using a dynamic viscoelasticity measurement device in a tensed mode at a temperature increase rate of 5° C./min and a frequency of 10. Hz is 100 MPa or less at 25° C. and 1 MPa or more at 250° C., and a starting temperature (T) of a rubbery plateau region (G) is 150° C. or less.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: December 4, 2018
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kazuo Nakashima, Katsufumi Matsui, Kouji Fukumoto, Kentaro Tachi
  • Patent number: 10148051
    Abstract: A modular structural member (100) comprising: at least two connection portions (102), and a structural portion (101), the connection portions arranged to provide electrical and mechanical connection to other structural members, and wherein, electronic componentry (125) is provided on the structural portion, and/or the connection portions are arranged to receive a fastener (240; 260), to connect multiple connection portions together, which is provided with electronic componentry, and further wherein, a plurality of the structural members arranged to be connected together to form a structure.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: December 4, 2018
    Assignee: University of Southampton, Research and Innovation Services
    Inventors: Reuben Wilcock, Thomas Redman
  • Patent number: 10143087
    Abstract: A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: November 27, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto
  • Patent number: 10135177
    Abstract: A cable termination including a cable terminal and a cable joint assembly. The cable terminal includes: a terminal conductor; a monitoring device including a capacitive voltage sensor around the terminal conductor; and an electrically insulating body fitted around the terminal conductor, including a bell-shaped end portion in which the voltage sensor is at least partially embedded. The cable terminal alternatively includes: a terminal conductor; a monitoring device including a capacitive voltage sensor around the terminal conductor; and an electrically insulating body fitted around the terminal conductor, including a bell-shaped end portion in which the voltage sensor is at least partially embedded and a stem end portion, the terminal conductor extending beyond the stem end portion.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 20, 2018
    Assignee: PRYSMIAN S.p.A.
    Inventors: Gerardo Sica, Paolo Boffi, Dario Quaggia
  • Patent number: 10134666
    Abstract: A package substrate including an insulating layer having a top surface and a bottom surface opposite to the top surface, at least one first copper pattern disposed in the insulating layer and adjacent to the top surface of the insulating layer, at least one second copper pattern disposed on the bottom surface of the insulating layer, and at least one embedded aluminum pad disposed on the at least one first copper pattern, the at least one embedded aluminum pad disposed in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer may be provided.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soojae Park, Kyujin Lee
  • Patent number: 10136541
    Abstract: An electronic device includes a Printed Circuit Board (PCB), a housing, an inner cover, and an outer cover. The PCB mounts a first socket and a second socket thereon. The housing includes a first slot disposed to correspond to the first socket and a second slot disposed to correspond to the second socket. The housing receives the PCB. The inner cover opens/closes the first slot. The outer cover opens/closes the second slot. The first socket and the second socket are open toward the first slot and the second slot, respectively. When the outer cover is open, the inner cover is exposed and is in an openable state.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: November 20, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Bong-Jae Rhee
  • Patent number: 10123776
    Abstract: A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: November 13, 2018
    Assignee: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD.
    Inventors: Zhenyu Chen, Ming Tang
  • Patent number: 10124521
    Abstract: The tube (1) has a multi-layered tube body (3), with a tube liner (19) enclosed by a seamless tube shell (21). An electronic device (17) having an energy store for the delivery of the requisite service voltage for operation is protectively arranged between the tube liner (19) and the tube shell (21), and is not visible from the exterior.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: November 13, 2018
    Assignee: HOFFMANN NEOPAC AG
    Inventor: Andreas Geiger
  • Patent number: 10129975
    Abstract: A reconfigurable electronic component comprising a channel having first and second ends and outer walls defining a lumen; a liquid phosphonic acid within the lumen; and a liquid metal within the lumen. A first electrical contact at the first end of the channel and a second electrical contact in communication with the lumen at the second end of the channel. A predetermined amount of a solvent and a liquid metal may be within the lumen, and the solvent may comprise ethanol. The liquid metal may be selected from the group consisting of eutectic gallium indium (EGaIn) and eutectic gallium-indium-tin alloys. The phosphonic acid may be selected from the group consisting of decylphosphonic acid (DPA), fluorobenzylphosphonic acid (FPA), and difluorobenzylphosphonic acid (DFPA). The first and second electrical contacts comprise copper. An overflow channel and a reservoir for the liquid metal and phosphonic acid may be in fluid communication with the lumen.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 13, 2018
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Christopher Tabor, Nahid Ilyas
  • Patent number: 10122159
    Abstract: An electric connection box includes: a main body case; and an upper cover which engages with the main body case. The main body case includes a base wall which has an electric component mounting portion; a peripheral wall which is disposed on the base wall and partitions an inside and an outside of the main body case; a main body interior drainage port which is disposed at a place with possibility of water infiltration into an inside of the peripheral wall along a gap portion between the upper cover and the peripheral wall and passes through the base wall; and at least one main body interior drainage wall which is erected on the base wall and extends toward an opening edge of the main body interior drainage port on a surface of the base wall.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: November 6, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Eiji Okada, Tomoyasu Murakami
  • Patent number: 10121569
    Abstract: A cable includes electric wires, an outer cover, a first cover, and a second cover. Each of the electric wires includes a conductive core and an insulator covering the conductive core. The outer cover covers the electric wires and extends from a first atmosphere to a second atmosphere less explosive than the first atmosphere. An outer surface of the outer cover is supported by a partition separating the first atmosphere from the second atmosphere. The first cover includes a thermosetting resin and covers an exposed portion of the electric wires, which is not covered by the outer cover in the second atmosphere. The second cover covers the first cover and includes a material higher in fracture strength than the thermosetting resin.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: November 6, 2018
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Naoyuki Otsubo, Tsuyoshi Ito, Kazunori Yamamoto
  • Patent number: 10123415
    Abstract: A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: November 6, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro Hayashi, Seiji Mori, Tatsuya Ito
  • Patent number: 10123409
    Abstract: A flexible printed circuit board, configured to receive electronic components, comprising an electrically insulating flexible element, configured to bear conductive component-connecting tracks, the flexible element being further configured to be bent according to a curvature, the board further comprising an electrically insulating reinforcing element, mechanically secured to the flexible element, extending on one side of the curvature, and comprising two parts: a first part being substantially planar and a second part exhibiting a predefined curvature, arranged on the side of the curvature of the flexible element, the reinforcing element being arranged so as to leave a free part for the flexible element to be bent according to the curvature.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: November 6, 2018
    Assignee: Valeo Vision
    Inventor: Olivier Badia
  • Patent number: 10118712
    Abstract: The disclosure provides in one embodiment an electrical conductor pathway system for diverting an electric charge. The electrical conductor pathway system includes a substrate having a first surface to be printed on and having one or more grounding points. The electrical conductor pathway system further includes a direct write conductive material pattern printed directly onto the first surface via a direct write printing process. The direct write conductive material pattern forms one or more electrical pathways interconnected with the one or more grounding points. The one or more electrical pathways interconnected with the one or more grounding points divert the electric charge from the first surface to the one or more grounding points.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: November 6, 2018
    Assignee: The Boeing Company
    Inventors: Victoria L. Garcia, Mark J. Gardner, Otis F. Layton, Jeffrey Lynn Duce, Joseph A. Marshall, IV
  • Patent number: 10122160
    Abstract: A tap off box (22) for use with a busbar trunking system (24) comprising at least one conducting bar (26), the tap off box (22) comprising: an inlet contact (34); a movable sheath (36) for the inlet contact (34); and an electrical outlet (50) in electrical communication with the inlet contact (34), wherein, when the tap off box (22) is in a mounted position on the busbar trunking system (24), movement of the sheath (36) to a first position breaks an electrical connection between a conducting bar (26) and the electrical outlet (50).
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: November 6, 2018
    Assignee: IBAR (EMEA) Limited
    Inventors: Wayne Lewis, Paul Richard Lippiatt, Martin Peter Timbrell
  • Patent number: 10116116
    Abstract: Provided are a printed circuit board configured to achieve reduction in impedance of a differential transmission line extending in a stacking direction, and an optical module. The printed circuit board includes a stacking-direction differential transmission line extending in the stacking direction, including: a differential signal via pair including a first signal via and a second signal via; and a plurality of conductor plate pairs each including a first conductor plate expanding outward from the first signal via, and a second conductor plate expanding outward from the second signal via. With respect to a perpendicular bisector of a center-of-gravity line segment connecting centers of gravity of the first and second signal vias, in each of the plurality of conductor plate pairs, centers of gravity of contours of the first and second conductor plates are located on inner sides of the centers of gravity.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: October 30, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Osamu Kagaya, Koyu Takahashi, Hiroyoshi Ishii
  • Patent number: 10116125
    Abstract: A cold shrinkable termination for an electric power cable that includes an insulation tube and stress control glue. When the cold shrinkable termination is mounted on the electric power cable, the stress control glue fills a gap between the electric power cable and the insulation tube so as to prevent local electric field concentration from occurring at an exposed end of the electric power cable. The stress control glue has a dielectric constant within a range of 5 to 100. In this cold shrinkable termination, a stress control glue with high dielectric constant is provided to optimize the electric-field distribution on an insulation surface of the electric power cable. Thereby, the structure of the cold shrinkable termination is simplified and the cost thereof is reduced. The cold shrinkable termination may be adapted to an electric power cable used to transmit voltage less than 26/35 kV.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: October 30, 2018
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Yugang Li, Lizhang Yang, Haowei Yang, Peng Li, Song Xue