Patents Examined by Timothy V. Eley
  • Patent number: 10226849
    Abstract: A handheld grinder includes an elongated housing, an electric motor, an output shaft, a wall, a planar circuit board, and a motor drive circuit. The elongated housing defines a cavity therein and includes a motor case disposed at a front end and a handle portion to a rear end. The electric motor has a drive shaft that is mounted within the motor case. The output shaft is drivably coupled to the drive shaft of the electric motor. The wall separates the cavity between the motor case and the handle portion of the housing. The planar circuit board is disposed in the handle portion of the housing. The motor drive circuit is accommodated entirely within the handle portion of the housing on the planar circuit board.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: March 12, 2019
    Assignee: BLACK & DECKER INC.
    Inventors: Zollie W. Privett, Jr., Craig A. Oktavec, David J. Smith, Matthew J. Velderman, Colin C. Crosby, Pradeep M. Pant, Kyle Christophersen, Daniel F. Nace, James H. Stiles, III, Floyd E. Moreland, IV
  • Patent number: 10220490
    Abstract: A knife sharpener may comprise a main body, and a suction cup formed on a lower surface thereof is operated by an operating handle. By cooperating the main body with the operating handle and the suction cup, the knife sharpener is configured to easily adhere to a flat surface, which avoids a damage formed on the flat surface during the sharpening process. Moreover, since the knife sharpener comprises various sharpening units, it can be used to sharpen different kinds of knives, even a scissors comprising a pair of blades, which greatly enhances the practicability thereof.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: March 5, 2019
    Assignee: Jiin Haur Industrial Co. Ltd.
    Inventor: Shih-Piao Wu
  • Patent number: 10213904
    Abstract: This grinding wheel tool is provided with a cylindrically shaped head unit comprising a hollow area passing through the inside, and abrasive grains adhered across the entire outer peripheral surface of the head unit. A fluid is supplied in the hollow area, and in the head unit, communication holes are formed which communicate between the hollow area and the outer peripheral surface and which, from the radial direction of the head unit, are angled forwards in the direction of rotation. Hereby, it is possible to provide a grinding wheel tool which can greatly reduce clogging even in cases where a high amount of cutting chips are generated per unit time, such as in high-feed processing.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: February 26, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
    Inventor: Hideaki Arisawa
  • Patent number: 10207384
    Abstract: The present disclosure provides a flexible device for burr removing, which is composed of a frame (1), lower flanges (2), guide posts (3), thrust cylinders (4), guide sleeves (5), thrust shafts (6), sleeves (7), a movable plate (8), upper flanges (9), a dust guard (10), cylinder housings (11) and the like. The flexible device for burr removing in use can meet the requirement for brushing burrs on wheels having two different sizes in one burr brusher, has the characteristics of ideal effect, high efficiency, safety and reliability in work and high degree of automation, and is particularly suitable for batch production on production lines.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: February 19, 2019
    Assignee: CITIC DICASTAL CO., LTD
    Inventors: Yao Zheng, Jiandong Guo, Lei Yang, Xiaoguang Huang, Xuesong Wang, Huiying Liu, Zhiyuan Yu, Weimin Cai, Yongwang Zhao
  • Patent number: 10211084
    Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: February 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doojin Kim, Youngsik Kim, Kunho Song, Yongdae Ha
  • Patent number: 10195714
    Abstract: Provided is a polishing pad which is capable of providing a high flatness to a polishing workpiece and suppressing the formation of scratches, and a method therefor. The polishing pad comprises a foamed urethane sheet on the surface which includes closed cells and open cells and which satisfies the following requirements: (1) an open cell ratio is 20-80 vol % where the total volume of closed cells and open cells is taken as 100 vol %, (2) the ratio [tan ? (wet/dry) ratio] of a loss factor tan ? in a water-absorption state to that in a dry state is 1.3-1.7, the loss factors being measured according to JIS K7244-4 with an initial load of 20 g at a measuring frequency of 1 Hz at a temperature of 26° C. in a tensile mode over a strain range from 0.01 to 0.1%, and (3) the Shore DO hardness according to ASTM D2240 is 60-80.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: February 5, 2019
    Assignee: FUJIBO HOLDINGS, INC.
    Inventors: Kouki Itoyama, Daisuke Takahashi
  • Patent number: 10195718
    Abstract: An abrasive grinding wheel (20) comprising an annular body (200) defining an abrasive front face (202) at least partly made of a layer of an abrasive mixture (21) and an opposite rear face (203), which grinding wheel (20) comprises an annular damping element (23) made of a resilient yielding material and fixed to the annular body (200), wherein the damping element (23) comprises a first face (231) facing towards the abrasive front face (202) and an opposite free second face (232) which defines at least a portion of the rear face (203) of the annular body (200).
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 5, 2019
    Inventor: Paolo Ficai
  • Patent number: 10189144
    Abstract: A water-abrasive suspension cutting facility with at least one high-pressure source (2) which provides a carrier fluid at a high pressure, with at least one exit nozzle (6), with a high-pressure conduit (4) connecting the high-pressure source (2) to the exit nozzle (6), as well as with an abrasive agent feed lock (16). The abrasive agent feed lock (16) is connected to the high-pressure conduit (4) and includes an entry side shut-off element (26) and an exit-side shut-off element (24). A lock chamber (18) is arranged between the entry side shut-off element (26) and an exit-side shut-off element (24). A suction device (30) is configured for producing a reduced pressure in the lock chamber (18) and is connected to the lock chamber (18).
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: January 29, 2019
    Assignee: ANT APPLIED NEW TECHNOLOGIES AG
    Inventor: Marco Linde
  • Patent number: 10189181
    Abstract: The present invention is a method for slicing a workpiece, including: forming a wire row by a wire spirally wound between a plurality of wire guides and traveling in an axial direction, and pressing a workpiece against the wire row while supplying a processing liquid containing abrasive grains to a contact portion between the workpiece and the wire, wherein a used portion of the abrasive grains are subjected to a treatment with a mixed liquid of sulfuric acid and hydrogen peroxide, and the abrasive grains subjected to the treatment are reused for the slicing of a workpiece. This makes it possible to slice a workpiece with suppressing contamination of a wafer with metal impurities when abrasive grains are reused in slicing a workpiece by use of a wire saw.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 29, 2019
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventor: Keiichi Kanbayashi
  • Patent number: 10189143
    Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: January 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Chi-Hao Huang, Hsuan-Pang Liu, Yuan-Chun Sie, Pinyen Lin, Cheng-Chung Chien
  • Patent number: 10183372
    Abstract: Thread repair tools having (i) a disc-shaped member with an axis of rotation extending through and dissecting first and second major surfaces of the disc-shaped member, (ii) a shaft fixedly connected to or fixedly connectable to the disc-shaped member, with the shaft extending from the second major surface of the disc-shaped member along the axis of rotation; and (iii) an abrasive surface along an outer periphery of the disc-shaped member are disclosed. Methods of making the thread repair tools, and methods of using the thread repair tools are also disclosed. Methods of using the thread repair tools include a method of: (i) connecting the thread repair tool to a hand-held powered device capable of rotating the thread repair tool along the axis of rotation of the thread repair tool, and (ii) abrading an object with the disc-shaped member of the thread repair tool as the thread repair tool is rotated along the axis of rotation by the hand-held powered device.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: January 22, 2019
    Inventors: Terry A. Lewis, Travis R. Lewis, David M. Lewis
  • Patent number: 10186419
    Abstract: Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 22, 2019
    Assignee: Semes Co., Ltd.
    Inventors: Kihoon Choi, In-Il Jung, Seong-Soo Kim, Yoon-Jong Ju
  • Patent number: 10183373
    Abstract: A honing tool (1) for honing a cylindrical external surface (2) of a rod (3). The tool comprises a plurality of honing inserts (4), adapted to hone a metal, and a support (5) for the honing inserts. The inserts (4) are carried by the support (5) and define a passage (6) around which the inserts (4) are to be found and in which the cylindrical external surface (2) of the rod (3) is insertable. The tool (1) includes a plurality of sliding skids (7) carried by the support (5), the sliding skids (7) and the honing inserts (4) being arranged to be capable of coming simultaneously into contact against the cylindrical external surface (2) of the rod (3) when the rod is placed inside the passage (6) and so as to be able to center the cylindrical external surface (2) inside the passage (6).
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: January 22, 2019
    Assignee: MESSIER-BUGATTI-DOWTY
    Inventors: Normand Labelle, Alan Caceres, Nhu Nguyen
  • Patent number: 10183350
    Abstract: The present disclosure relates to a machining head for a gear manufacturing machine having at least one driven motor spindle and at least one counter-spindle, wherein a tool arbor having at least one tool arranged thereon is mounted between the motor spindle and the counter-spindle, and wherein at least one balancing device is integrated within the driven motor spindle and at least one balancing device is integrated within the counter-spindle.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: January 22, 2019
    Assignee: Liebherr-Verzahntechnik GmbH
    Inventor: Matthias Plessing
  • Patent number: 10173295
    Abstract: A machining device includes: a spindle unit including a spindle that rotates a workpiece; and a device base having the spindle unit mounted thereon. The spindle unit includes upper and lower rolls that rotate the workpiece by contacting the workpiece, upper and lower rotary shafts that rotate integrally with the upper and lower rolls and serves as the spindle, and a support member that supports the workpiece. The device base has mounted thereon the spindle unit, a motor that rotates the upper and lower rotary shafts, and a grindstone to be brought into contact with the workpiece. The spindle unit is detachably mounted on the device base.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: January 8, 2019
    Assignee: JTEKT CORPORATION
    Inventors: Kenichiro Kitamura, Shinsaku Kozakai, Fumikazu Hirakawa, Naoya Okubo
  • Patent number: 10173916
    Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: January 8, 2019
    Assignee: Corning Incorporated
    Inventors: Jonas Bankaitis, Kevin William Uhlig
  • Patent number: 10166645
    Abstract: A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 1, 2019
    Assignee: KOYO MACHINE INDUSTRIES COMPANY LIMITED
    Inventors: Shizuki Sasakura, Naohiko Wakayama
  • Patent number: 10166653
    Abstract: The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: January 1, 2019
    Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Seh Kwang Lee, Joo Han Lee
  • Patent number: 10160098
    Abstract: A cleaning apparatus, including a body; a tip connected to a first end of the body, the tip including a support extending in a direction away from the body; a polishing member including a first surface including a polishing surface and a second surface opposite to the first surface; and a fixer to adhere and fix the polishing member to the support so that the polishing surface is brought in contact with a cleaning target surface.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: December 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jun-suk Lim
  • Patent number: 10160090
    Abstract: A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Lung Cheng, Yu-Ming Kuo, Li-Ming Hsu