Patents Examined by Timothy V. Eley
  • Patent number: 10173916
    Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: January 8, 2019
    Assignee: Corning Incorporated
    Inventors: Jonas Bankaitis, Kevin William Uhlig
  • Patent number: 10173295
    Abstract: A machining device includes: a spindle unit including a spindle that rotates a workpiece; and a device base having the spindle unit mounted thereon. The spindle unit includes upper and lower rolls that rotate the workpiece by contacting the workpiece, upper and lower rotary shafts that rotate integrally with the upper and lower rolls and serves as the spindle, and a support member that supports the workpiece. The device base has mounted thereon the spindle unit, a motor that rotates the upper and lower rotary shafts, and a grindstone to be brought into contact with the workpiece. The spindle unit is detachably mounted on the device base.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: January 8, 2019
    Assignee: JTEKT CORPORATION
    Inventors: Kenichiro Kitamura, Shinsaku Kozakai, Fumikazu Hirakawa, Naoya Okubo
  • Patent number: 10166653
    Abstract: The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: January 1, 2019
    Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Seh Kwang Lee, Joo Han Lee
  • Patent number: 10166645
    Abstract: A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 1, 2019
    Assignee: KOYO MACHINE INDUSTRIES COMPANY LIMITED
    Inventors: Shizuki Sasakura, Naohiko Wakayama
  • Patent number: 10160084
    Abstract: A tire pre-conditioning system includes a first mandrel, a second mandrel spaced apart from the first mandrel, and a controller in communication with the first mandrel and the second mandrel. The first mandrel is fixedly attached to a first shaft and including a first tapered sidewall. The second mandrel is fixedly attached to a second shaft and including a second tapered sidewall. The controller is operable to axially move the first mandrel and the second mandrel toward one another until the first and second tapered sidewalls are opposing respective beads of a tire, and supply pressurized fluid into an internal cavity of the tire to inflate the tire. The inflating causing the beads to move relative to the mandrels while contacting the opposing respective tapered sidewalls to burnish the beads of the tire.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: December 25, 2018
    Assignee: Android Industries LLC
    Inventors: Barry Allan Clark, Donald Graham Straitiff, David Paul Donnay
  • Patent number: 10160086
    Abstract: A method of, and apparatus for, urging blades of a gas turbine engine radially outwardly is disclosed. The method may be used to grind blade tips of blades of a rotor stage of a gas turbine engine. The method comprises locating a fluid-tight bag which is in a radial gap formed between a radially inner surface of a respective blade root and a slot in a disc which the blade root cooperates. The method comprises inflating the fluid-tight bag and rotating the rotor stage relative to a grinding surface so as to grind any blade tips that contact the grinding surface during rotation. This results in more accurate positioning of the blades during the grinding process and/or during operation.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: December 25, 2018
    Assignee: ROLLS-ROYCE plc
    Inventor: Daniel Kempf
  • Patent number: 10160098
    Abstract: A cleaning apparatus, including a body; a tip connected to a first end of the body, the tip including a support extending in a direction away from the body; a polishing member including a first surface including a polishing surface and a second surface opposite to the first surface; and a fixer to adhere and fix the polishing member to the support so that the polishing surface is brought in contact with a cleaning target surface.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: December 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jun-suk Lim
  • Patent number: 10160095
    Abstract: Dressing tool including a main body having a working surface covered with hard-material grains distributed on the main body. Recesses for accommodating the hard-material grains are created in the main body and then filled with an adhesive, the excess adhesive is removed across the main body, and thereafter the hard-material grains are flung onto the main body so that only the grains located in the recesses remain adherent to the working surface of the tool. The hard-material grains can then be bonded to the main body by a physical and/or chemical bond. Thus, a distribution of the grains over the working surface of the tool that can be precisely defined in advance is ensured.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: December 25, 2018
    Assignee: Reishauer AG
    Inventors: Christoph Rudolf, Florian Hänni
  • Patent number: 10160097
    Abstract: Provided are buffing pads that have intertwined seams such that any hard or unyielding edges are covered and not exposed during a buffing or polishing process. A double-sided buffing pad for polishing surfaces comprises a backing plate; two fibrous buffing media with filaments of textiles extending therefrom that are affixed one media to each face of the backing plate; and a seam that is intertwined by a portion of the filaments from each media are intertwined. The filaments may be intertwined by needle-tacking, air entanglement, or hydro-entanglement.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: December 25, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Aaron C. Krause, Aleksandrs Titovs
  • Patent number: 10160090
    Abstract: A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Lung Cheng, Yu-Ming Kuo, Li-Ming Hsu
  • Patent number: 10155296
    Abstract: The disclosed subject matter provides a polishing pad and a monitoring system for monitoring the polishing pad. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: December 18, 2018
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Chao Shi
  • Patent number: 10150203
    Abstract: Reduced noise abrasive blasting assemblies and systems are described. The new assemblies and systems are comprised of standard blast hose, accelerator hose, couplings and nozzle. The improved abrasive blasting system maintains abrasive particle velocity while decreasing the exit gas velocity and consequently decreasing sound production. This is accomplished through an acceleration section with reduced inner diameter and sufficient length to provide the necessary abrasive particle velocity. The new system maintains the productivity and efficiency of conventional abrasive blasting systems but with greatly reduced acoustic noise production and reduces operator fatigue due to the lower weight of the carried portion of the system.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: December 11, 2018
    Assignee: OCEANIT LABORATORIES, INC.
    Inventors: Christopher Sullivan, Daniel Kokubun
  • Patent number: 10144112
    Abstract: According to one implementation, a blast treatment device includes at least one nozzle that injects media toward a workpiece, a first tank that supplies the media to the at least one nozzle, a movement structure that moves the at least one nozzle and the first tank, and a second tank that supplies the media to the first tank. The second tank is not moved by the movement structure.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: December 4, 2018
    Assignee: SUBARU CORPORATION
    Inventors: Yoshihiko Kondo, Hirotsugu Takazawa, Shinya Matsuo, Tatsuo Nakahata
  • Patent number: 10137555
    Abstract: A machine tool includes a spindle retaining a tool, a spindle motor, a feed device relatively moving a workpiece and a tool with a feed motor, a spindle motor control unit, and a feed motor control unit. In a method of machining a workpiece with the machine tool, the spindle motor control unit continuously varies a rotational speed of the spindle in a periodic or non-periodic manner with a predetermined amplitude with respect to a target rotational speed. The feed motor control unit continuously varies a relative moving speed between the tool and the workpiece in synchronization with the spindle motor such that a ratio of the rotational speed of the spindle to the moving speed does not become constant at least in a predetermined time zone in which a spindle speed reaches a maximal value and a predetermined time zone in which the spindle speed reaches a minimal value.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: November 27, 2018
    Assignees: THE UNIVERSITY OF TOKYO, DMG Mori Co., Ltd.
    Inventors: Hiroshi Fujimoto, Satoshi Fukagawa, Shinji Ishii, Yuki Terada
  • Patent number: 10131819
    Abstract: A polishing liquid comprising abrasive grains, an additive, and water, wherein the abrasive grains include a hydroxide of a tetravalent metal element, produce absorbance of 1.00 or more for light having a wavelength of 400 nm in a first aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass %, and produce light transmittance of 50%/cm or more for light having a wavelength of 500 nm in the first aqueous dispersion, and a NO3? concentration of a second aqueous dispersion obtained by retaining the first aqueous dispersion at 60° C. for 72 hours is 200 ppm or less.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: November 20, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD
    Inventor: Tomohiro Iwano
  • Patent number: 10124459
    Abstract: According to this lens-centering method, a state in which a lens is sandwiched at prescribed pressing force between a lens holder and a lens processing dish is brought about. Next, the lens-processing dish is rotated at slow speed about a rotation axis line that passes through the center and the spherical center of the lens-processing surface thereof, and is made to oscillate at a slight angle about the spherical center of the lens-processing surface as the center of oscillating action. The spherical center of a first lens spherical surface of the lens is guided to the spherical center of a lens-retaining surface of the lens holder, and the spherical center of a second lens spherical surface is guided to the spherical center of the lens-processing surface. A lens mounted in the spherical center-type processing machine can be set to an accurately centered state thereby.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: November 13, 2018
    Assignee: Kojima Engineering Co., Ltd.
    Inventors: Hideo Kojima, Hiroshi Fukuzawa
  • Patent number: 10118271
    Abstract: Device for blocking a spectacle lens blank that has a finished surface and a machining surface, situated opposite the finished surface, for machining in a machining device. The device includes a receiving component having a convex, planar or concave receiving surface for blocking the finished surface of the spectacle lens blank, wherein the receiving component has an essentially flat counter-surface that is arranged opposite the receiving surface, and wherein the normal of the counter-surface is inclined by 1° to 10° counter to the normal at the middle point of the receiving surface.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: November 6, 2018
    Assignee: Rodenstock GmbH
    Inventor: Karl Huber
  • Patent number: 10118275
    Abstract: According to one implementation, a blast treatment device includes an injection part and a circulating system. The injection part injects media toward a workpiece made with a composite material. The media each has a weight difference from a resinic particle dropping from the composite material. The weight difference is not less than a threshold or more than the threshold. The circulating system recovers the injected media and supplies the recovered media to the injection part. The circulating system has an impurity separation part that removes at least one of impurities and media, of which particle sizes have become small, each included in the recovered media.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: November 6, 2018
    Assignee: SUBARU CORPORATION
    Inventors: Yoshihiko Kondo, Hirotsugu Takazawa, Shinya Matsuo, Tatsuo Nakahata
  • Patent number: 10118276
    Abstract: A media-bearing polisher and restorer removes surface and subsurface contaminants from one or more vehicle surfaces. In one or more embodiments, the media-bearing polisher and restorer comprises a body having a hemispherical shape. The body comprises a resilient or rigid material and one or more flutes for receiving one or more user fingers. One or more mediums, which absorbs and extracts contaminants from the surface, are attached to a bottom of the hemispherical body. A variety of media may be used with the media-bearing polisher and restorer.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: November 6, 2018
    Inventor: Timothy D. Miller
  • Patent number: 10118272
    Abstract: The present invention provides a method for evaluating a polishing pad by which a life of a polishing pad to polish a wafer is evaluated, the method being characterized in that a quantity of polishing residues deposited on the polishing pad is measured, and the life of the polishing pad is evaluated based on a measurement value provided by the measurement. Consequently, it is possible to provide the method for evaluating a polishing pad and the method for polishing a wafer that enable immediately evaluating the life of the polishing pad and also enable suppressing a reduction in productivity and a yield ratio at the time of polishing the wafer.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: November 6, 2018
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Yuki Tanaka, Kazuya Sato, Syuichi Kobayashi