Abstract: Device and method for the finishing machining of an internal face of a workpiece, such as the track of a ball screw, including a workpiece holder and a finishing tool held on a finishing tool holder. A rotary drive is provided, by which the workpiece holder and the finishing tool is rotationally driven relative to one another about a rotational axis. A linear drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in a translatory manner relative to one another along the rotational axis. An oscillating drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in an oscillating manner relative to one another in the direction parallel to the rotational axis and wherein the finishing tool is pivotably held on the finishing tool holder about a pivot axis.

Abstract: In some embodiments, the present disclosure relates to a method of performing a planarization process. The method may be performed by placing a wafer between a carrier head and an upper surface of a polishing pad. The carrier head has a retainer ring configured to surround the wafer, and the retainer ring has an abrasive structure configured to contact the upper surface of the polishing pad. Pressures within one or more chambers surrounded by the carrier head are independently regulated. The one or more chambers have one or more interior surfaces having a flexible membrane. The flexible membrane has a lower surface configured to contact the wafer. At least one of the carrier head or the polishing pad are moved relative to the other, and a roughness of the upper surface of the polishing pad is maintained within a predetermined range by using the abrasive structure of the retainer ring.

Abstract: A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.

Abstract: The present disclosure relates to a method for the gear manufacturing machining of a workpiece by a diagonal-generating method, in which the workpiece is subjected to gear tooth machining by the rolling off of a tool, wherein an axial feed of the tool takes place during the machining with a diagonal ratio given by the ratio between the axial feed of the tool and the axial feed of the workpiece. According to the present disclosure, the tool has a conical basic shape.

Abstract: A polisher may include a polishing pad, a motor, a transmission device, and a mode selection device. The transmission device can transmit a rotational drive force of the motor to the polishing pad in a plurality of different modes with respect to a motion of the polishing pad. The mode selection device may be used for selecting a desired motion mode of the output member. Additionally, a motor and handle housing with an accompanying power cord may be constructed to aid in ease of manipulation of the polisher by the user with minimal interference.

Abstract: Disclosed is a method for dressing a single- or multi-thread grinding worm (34) in which a main rolling movement between the grinding worm and a gear-like dressing tool (90) is brought about. In order to create flank modifications on the grinding worm, an additional relative movement is superimposed on the main rolling movement. In addition, an auxiliary drive specifically designed for such a method, a correspondingly designed machine tool and a dressing tool for carrying out the method are disclosed.

Abstract: A painting-installation cleaning system is provided for cleaning at least one component of a painting installation, in particular at least one component of a painting robot or of a handling robot, characterized by at least one dry-ice nozzle for producing a dry-ice jet which cleans the component.

Abstract: A grinding machine comprising a housing having a base for supporting the grinding machine, a shaft for holding a grindstone, a motor for rotating the shaft and a trough holder for holding a trough for grinding liquid, the through holder being arranged below the shaft, wherein the trough holder is movable in vertical direction between the base of the housing and the shaft for holding a grindstone and that the grinding machine comprises a lifting/lowering arrangement for moving the trough holder in said vertical direction.

Abstract: A power tool is provided including an elongated housing. The housing includes a motor case disposed at a front end thereof and a handle portion extending along a longitudinal axis of the housing from the motor case to a rear end of the housing. The handle portion includes two elongated walls extending from the motor case along the longitudinal axis of the housing to form a planar opening within the handle portion. A partition wall is arranged along an axis substantially perpendicular to the longitudinal axis of the housing, separating the handle portion from the motor case. An electric motor having a drive shaft is mounted within the motor case, and a module casing supporting a planar circuit board is received within the planar opening and supported by the elongated walls within the handle portion of the housing axially along the longitudinal axis of the housing.

Abstract: One variation of a method for automatically re-sharpening a knife includes: receiving a knife at a vice; during a scan cycle, scanning the grind head along a blade of the knife from an initial longitudinal position proximal the vice toward a longitudinal end position and recording a sequence of vertical positions of segments of an edge of the blade at various longitudinal positions of the grind head based on outputs of a sensor arranged in the grind head; calculating a blade profile for the knife based on the sequence of vertical positions; and, during a grind cycle, actuating a grind wheel in the grind head and pitching the grind head while driving the grind head longitudinally along the blade to maintain an axis of the grind wheel substantially parallel to segments the blade profile corresponding to longitudinal positions of the grind head, relative to the vice.

Abstract: The present invention in one or more embodiments provides a roller tool for roughening a friction ring of a brake disk, the roller tool including a roller body including inner and outer ends and a casing surface positioned therebetween, the inner end differing in cross-section dimension than the outer end, the casing surface including thereupon one or more protrusions for contacting the friction ring. The roller tool may further include a support frame supporting the roller body. The support frame may include a short leg connected to the outer end of the roller body and a long leg connected to the inner end of the roller body.

Abstract: A polishing processing method using a CMP method for polishing a surface of a crystal material to be smooth by using a loose polishing abrasive grain type polishing pad in the presence of a polishing liquid and a plurality of polishing abrasive grains, in which the crystal material is a single crystal of GaN, and the polishing liquid is an oxidizing polishing liquid having an oxidation-reduction potential between Ehmin (determined by Eq. (1)) mV and Ehmax (determined by Eq. (2)) mV and pH between 0.1 and 6.5: Ehmin (mV)=?33.9 pH+750 . . . (1) Ehmax (mV)=?82.1 pH+1491 . . . (2).

Abstract: A chemical mechanical polishing system includes a platen, a slurry introduction device and at least one polishing head. The platen is configured to allow a polishing pad to be disposed thereon. The slurry introduction device is configured to supply slurry onto the polishing pad. The polishing head includes a main body and at least one grinding piece. The main body has an accommodation space for accommodating a wafer. The grinding piece is disposed on the main body. The grinding piece has a grinding surface configured to grind against the polishing pad.

Abstract: A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material.

Abstract: A grinding machine includes a plane grinding mechanism carrying a workpiece, an electrically controlled device mounted on the plane grinding mechanism, a grinder unit rotatably mounted on the plane grinding mechanism to grind the workpiece, and a smart working control system mounted on the plane grinding mechanism and electrically coupled to the electrically controlled device. The smart working control system includes a smart coder and a smart driver. When a load and a cutting force produced between the grinder unit and the workpiece reach preset parameters during the grinding process, the smart driver executes the working sequence or parameter setting program edited by the smart coder, to shorten a movement distance of the workbench of the plane grinding mechanism along the X-axis (leftward and rightward), and to produce an optimum lapping path.

Abstract: Disclosed herein are systems and methods for improving the performance of a fluid jet cutting system by testing and adjusting characteristics of the system based on the effect of the characteristics on forces imparted by the system to a workpiece being cut. Also disclosed are systems and methods for monitoring and validating the performance of fluid jet cutting systems, and for diagnosing such systems. In some cases, the technologies described herein can be used to determine whether components of a fluid jet system require maintenance, or that characteristics of the system require adjustment.

Abstract: A method of polishing an outer surface of a ceramic coated gas turbine engine component includes applying a rotating diamond brush to the outer surface. The brush is configured to achieve a uniform finish of 150 microinches Ra or less over the surface. The brush contains diamond impregnated bristles, and is affixed to a rotary head of a robotic arm. A force sensing controller limits brush forces against the component. The component disclosed is a hot section turbine vane designed for directional control of high temperature, high-pressure combustion gases, but the method may be applied to other components contained within such aerospace applications. The polished coating provides an improved thermal barrier for maintaining structural integrity of the component in environments having temperatures ranging up to 2,000 degrees Celsius. The method limits abrasive removal of ceramic material to only 0.0005 to 0.00075 inch, and saves time and expense over past practices.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: The present invention is a CMP polishing agent, including polishing particles, a protective film-forming agent, and water, wherein the protective film-forming agent is a copolymer of styrene and acrylonitrile, and an average molecular weight of the copolymer is 500 or more and 20000 or less. This provides a polishing agent which can polish an insulation film with few polishing scratches and has high polishing selectivity of an insulation film to a polishing stop film in a CMP step, a method for manufacturing the polishing agent, and a method for polishing a substrate by using the polishing agent.

Abstract: The present invention provides a long-bladed bolster 1, comprising a substantially planar cutting body 2 having one edge formed as a blade 3 of sufficient length so that the blade 3 is arranged in use to be positioned substantially centrally on a concrete masonry unit (CMU) to enable the block to be divided without the bolster 1 requiring repositioning, the bolster having a striking body on a second long edge of the cutting body opposite to the cutting blade configured to receive repeated blows from a striking implement in use and to transmit these through the cutting body to the blade and the bolster having an integral handle that extends from the cutting body and/or striking body of the bolster substantially centrally along the length of the cutting body 2 and substantially orthogonally to the plane thereof.