Abstract: A processing element for processing a profile-shaped or flat metallic workpiece, with the processing element designed such that a plurality of similar processing elements can be arranged one behind the other on a supporting device in the longitudinal direction of the supporting device, the supporting device can be driven in a circulating manner and the plurality of processing elements can be guided past the workpiece for surface processing at least approximately linearly by means of the supporting device. A rectangular or block-shaped main body having bearing surfaces for bearing on the supporting device is provided, and oblong ribs protruding outward in a web-like manner are provided on the main body on opposite flat longitudinal sides and overlap the corresponding opposite flat longitudinal sides of the main body on an identically embodied processing element, which is arranged between the ribs.

Abstract: A machine tool of high-frequency vibration is provided. A main shaft structure of the machine tool comprises a rotating shaft, the end of which is provided with a tool holder chuck for fixing a tool holder; the upper portion of which is provided with a rotating coil portion; the main shaft structure is correspondingly provided with a stationary coil portion; and the tool holder is provided with a high-frequency vibration module. By non-contact coils, an external electric power/signal can be transmitted into the high-frequency vibration module to avoid a wear phenomenon in a contact-rotating electrode. Because the inductive coil is arranged outside of the tool holder, the manufacturing cost of the tool holder is reduced, and the convenience of changing the tool holder is increased. Moreover, the machining stability and efficiency of the tool holder are improved by a control method of sensing/feedback signals with wireless transmission.

Abstract: The invention pertains in general to devices, systems and methods for removing vapor and heat generated during a restoration cycle in an optical disc restoration device.

Abstract: A polishing apparatus capable of preventing wear of rollers which are to transmit a load to a retainer ring and capable of preventing wear particles from escaping outside is disclosed. The polishing apparatus includes: a retainer ring disposed so as to surround the substrate and configured to press the polishing surface while rotating together with a head body; a rotary ring secured to the retainer ring and configured to rotate together with the retainer ring; a stationary ring disposed on the rotary ring; and a local-load exerting device configured to apply a local load to a part of the retainer ring through the rotary ring and the stationary ring. The rotary ring has rollers which are in contact with the stationary ring.

Abstract: A sander especially suited for sanding curved surfaces. The sander has an elongate body and a grinding plate movably attached thereto. A power unit drives the grinding plate. At least two lever beams are attached to the elongate body. Each of the lever beams has two opposite ends. The grinding plate is attached to ends of lever beams using flexible connecting elements to allow the grinding plate to move relative to the sander body.

Abstract: Abrasive entrainment waterjet technology to cut objects located above or below ground or above the surface of a body of water. Abrasive is conducted to an abrasive waterjet cutting head under the control of an abrasive feed and metering system that monitors the flow rate of abrasive.

Abstract: A lens manufacturing method including a holding step of holding a lens in a lens holding fixture, and a machining step of machining a surface to be machined in the held lens. A reverse surface of the surface to be machined is machined into a non-planar shape with a first surface shape error. A lens holding surface of the lens holding fixture is machined into the same shape as the non-planar shape with a second surface shape error smaller than the first surface shape error. In the holding step, the reverse surface is brought into surface contact with the holding surface in imitation of the holding surface to correct the shape of the lens such that the reverse surface runs along the holding surface. In the machining step, the surface to be machined is machined in a state where the correction has been made by the holding step.

Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.

Abstract: Provided is a carrier head. The carrier head includes: a body having a ring shape, wherein a first locking part is formed on an external surface of the body; a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit; a regulating member located in a space between the first locking part and the second locking part; a retainer ring having a ring shape and located at the external bottom of the support unit; and an elevating unit coupling the retainer ring to the support unit to enable a height to be regulated relative to the support unit.

Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

Abstract: The present invention provides a method for fabricating a super mirror finish stainless steel sheet uses the following steps: 1) rough machining, wherein a 400-450 grit sandpaper or scouring pad is used to remove an oxide layer on a surface of a stainless steel decorative sheet; 2) finish machining, wherein a 240-1,000 grit graphite grinding wheel is used to perform finish grinding; and 3) polishing processing, wherein an abrasive material is used to perform polishing. For the finish grinding and the polishing that are performed by using the grinding wheel and the abrasive material respectively, a multi-shaft polishing system is used to drive a grinding wheel, and a cylinder is controlled to adjust a force of each polishing shaft, which enables a stainless steel decorative sheet to have a surface finish under 0.01 ?m and a reflectivity above 69%.

Abstract: The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 ?m to 25 ?m, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.

Abstract: A self-centering grinding wheel assembly that includes a spindle shaft including a conical-shaped end, a grinding wheel, and a grinding wheel adapter. The grinding wheel adapter affixed to the grinding wheel. A plurality of alignment members disposed radially within the grinding wheel adapter. Each of the plurality of alignment members include a tapered surface that conforms to a conical end of the spindle shaft. The plurality of alignment members slide radially with the grinding wheel adapter. The plurality of alignment members self-center the grinding wheel adapter on the spindle shaft in response to the grinding wheel adapter being assembled to the conical end of the conical shaft.

Abstract: A motion which creates an end relief and which is integrated into the plunging cycle of non-generated bevel gears. The tool, after feeding to the correct tooth forming position in case of non-generated gears, is swung sideways out of cutting or grinding contact with the slot instead of along a withdraw path which is identical to the plunge path but opposite in direction.

Abstract: A slide grinding machine having a turntable and a work container rotated by the turntable has an air pressure operated automatic gap setting feature having a zero gap width reference value to adjust the gap width between the turntable and the work container.

Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.

Abstract: A cutting apparatus includes a width measuring unit for measuring the width of a grooving groove formed in a wafer by laser grooving and the width of a cut groove formed by a cutting blade. The width measuring unit includes an imaging camera for imaging the grooving groove and the cut groove, and an illuminating unit for illuminating an area to be imaged by the imaging camera with light supplied in a predetermined light quantity. Therefore, when first light is radiated from the illuminating unit, a first image in which the grooving groove is sharply imaged can be imaged by the imaging camera, whereas when second light is radiated from the illuminating unit, a second image in which the cut groove is clearly imaged can be imaged by the imaging camera. Consequently, the grooving groove and the cut groove can be easily distinguished from each other.

Abstract: The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.

Abstract: The device for polishing optical lenses includes a lens holder; a device for positioning the lens holder; and a device for rotating the lens holder about an axis. There is also a polishing tool; a tool holder; a device for positioning the tool holder; and a device for rotating the tool holder about an axis. The device for polishing also includes a ball joint arranged between a shaft secured to the tool holder and the device for positioning the tool holder, or between a shaft secured to the lens holder and the device for positioning the lens holder, so as to enable a spherical movement of the polishing tool and of the lens. The invention also relates to a method for polishing using the device according to the invention.

Abstract: A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.