Abstract: Systems and methods are disclosed herein for dressing and trueing grinding wheels. A laser may be directed substantially tangential to a grinding surface of a grinding wheel. The laser may be a continuous wave laser and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface profiles into the grinding surface.

Abstract: A handheld AC power tool is provided. The power tool is comprised generally of: a brushless DC motor; a power cord connectable to an AC power socket; a converter circuit configured to receive input power from the power cord and operable to output a DC bus voltage, a switching arrangement interposed between the electric motor and the converter circuit; a motor drive circuit interfaced with the motor switches; and a power switch operable by a user to selectively energize the motor drive circuit and thereby power on the tool. The converter circuit includes a rectifier and a capacitor electrically coupled across the rectifier, such that the capacitor has capacitance sized to produce a DC bus voltage whose magnitude from an AC power source is substantially same as magnitude of voltage from a DC power source.

Abstract: The present disclosure relates generally to a machining tool and method for using the machining tool. The machining tool includes a machining arm including a first arm section, a second arm section, a proximate end, a distal end, and a machining arm longitudinal axis, a belt disposed around the machining arm; and a first motor operably coupled to the machining arm, wherein at least a portion of the machining arm is configured to pivot such that an angle is formed between the distal end and the machining arm longitudinal axis. The method includes the steps of placing the pivotable machining arm in a first orientation, inserting the pivotable machining arm in the desired location, determining whether the belt is in a desired position relative to the raised surface, operating the motor to rotate the belt around the pivotable machining arm, and placing the belt in contact with the raised surface.

Abstract: A blade sharpening system may include a sharpening tool for sharpening a workpiece. The system may also include a sharpening fixture having a mounting surface for mounting a workpiece to be sharpened by the sharpening tool. The mounting surface may be disposed on a sled that is movable along a sharpening path that passes under a sharpening implement that may be mounted to a movable arm of the sharpening tool when the arm is in an engaged position. The movement of the sled may be coupled to the movement of the arm such that moving the arm from a disengaged position to the engaged position initiates the sled to move in a first direction along the sharpening path and moving the arm from the engaged position to the disengaged position initiates the sled to move along the sharpening path in a second direction.

Abstract: A method is provided for corner contouring of flat glass substrates in a continuous feed-through process by a contouring tool. The method includes the steps of: synchronization of the movement of the contouring tool to the continuous feed-through movement of the flat glass substrate, contouring of a corner of the flat glass substrate, wherein a relative movement between the contouring tool and the flat glass substrate is performed so as to overlap the continuous feed-through movement.

Abstract: The invention pertains in general to a latching mechanism for maintaining desired friction levels on an optical disc in an optical disc restoration device. In particular the invention pertains to devices, systems and methods for easily maintaining friction levels between pads and an optical disc in an optical disc restoration device for ease of adjusting friction settings during quality control, repair operation or when optimization settings are being set in an optical disc restoration device by a user.

Abstract: A grinding tool, such as a cutting disc, includes a matrix, in particular a sintered metal matrix, and diamonds embedded in the matrix. At least the majority of the diamonds are each assigned at least one wear-promoting particle. The at least one wear-promoting particle is likewise embedded in the matrix.

Abstract: A mounting element for holding a self-adhesive and/or flexible abrasive includes a supporting plate, and a distributing body. The supporting plate includes a plurality of suction openings which penetrate the supporting plate from a first side to a second side opposite the first side. A first side of the distributing body is in contact with the second side of the supporting plate, and a second side of the distributing body is configured to hold an abrasive. The distributing body includes a plurality of cavities which penetrate the distributing body from the first side of the distributing body to the second side of the distributing body, and which are mutually separated by a plurality of walls. At least one of the walls has at least one aperture which connects at least two adjacent cavities to each other.

Abstract: A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.

Abstract: Abrasive entrainment waterjet technology to cut objects located above or below ground. Abrasive is conducted to an entrainment abrasive waterjet cutting head under the control of an abrasive feed and metering system that monitors the flow rate of abrasive.

Abstract: The use of abrasive entrainment waterjet technology to cut objects located at the bottom of a body of water. Abrasive is conducted to an abrasive waterjet cutting head under the control of an abrasive feed and metering system that monitors the differential pressure between the cutting head and reservoir of abrasive material and maintains the pressure at the abrasive reservoir greater than the pressure hydrostatic pressure at the cutting head.

Abstract: When decoating a glass panel (3), a decoating tool (6) with a circular-cylindrical grinding element (8) is used, which element is set to rotate around its axis. In the end face of the grinding element (8) that is used when the active face (9) is decoated, a hole (10) and at least one radial groove (11) are provided. The decoating tool (6) is placed at a spot (A) on the glass panel (3) in a movement (arrow 13) that is oriented at an acute angle to the plane of the glass panel (3), which lies between the ends (B) and (C) of the strip-shaped decoating area (14) and moves first to the one end (B) (arrow 15) and then to the other end (C) (arrow 16) in order to strip coating from the glass panel (3) in the decoating area (14).

Abstract: A floor processing system for a skid steer loader includes a shroud having an attachment device configured to removably engage with the skid steer loader; a central motor secured to the shroud and rotatably attached to an arm; a first rotary assembly secured to the arm; and a second rotary assembly secured to the arm. The first rotary assembly includes a first disc rotatably attached to a first motor via a first shaft; and a plurality of first cutters extending from the first disc. The second rotary assembly secured to the arm includes a second disc rotatably attached to a second motor via a second shaft; and a plurality of second cutters extending from the second disc.

Abstract: A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

Abstract: Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.

Abstract: A tool for generating tooth systems by grinding when the maximum tool diameter is limited by collision contours on the workpiece has a dressable grinding tool that is tightly connected to the tool holder. In one preferred arrangement, the dressable grinding tool is glued on the tool holder.

Abstract: A single station shaper sander that uses a quick change retractable shaper and a quick change retractable profile sander is described. The shaper generates a profile in a substrate, and then the sander sands the profile in the substrate without intermediate removal of the substrate. Both the shaper and sander are retractable, moving away from the substrate when retracted, and are moved into contact with the substrate when engaged. Either an operator or automatic controls may be used to engage and retract the shaper or sander, so as to minimize operator access to dangerous moving surfaces on either. Further, each sander or shaper may have removable tools that are temporarily affixed to a spindle, affording tool changes of 15 seconds or less.

Abstract: Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units each having first support blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units each having second support blocks (215) for compressing downward upper portions of the compression line springs and thus supporting the compression line springs. The grinding units grind seat surfaces formed on opposite ends of the compression line springs that are moved by the upper and lower chain conveyors. A V-shaped depression (115a) is formed in each first support block so that each of the compression line springs is seated onto the corresponding V-shaped depression. A lower surface (215a) of the second support block that compresses the compression line springs has a planar structure.

Abstract: Magnetic apparatuses and systems for shaping parts are described. One or more magnets can be used to direct a magnetically responsive fluid having magnetically responsive particles around surfaces of a part. The magnetically responsive fluid can include abrasive particles that follow movement of the magnetically responsive fluid across surfaces of the part and remove material from the part until the part takes on a desired shape. The magnetic apparatuses can be configured to provide a rough cut, similar to machining process, and/or a fine cut, similar to polishing or buffing process, to the part.

Abstract: A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.