Abstract: Sharpening device for sharpening blades mounted on cutting machines, comprising two grinding wheels (2, 3) supported by respective movable supports (20, 30) adapted to move said grinding wheels (2, 3) from a standby or rest configuration in which the grinding wheels (2, 3) are positioned at a predetermined distance from the blade (4) to an active configuration in which the grinding wheels (2, 3) are in contact with a cutting edge (40) of the blade (4) and vice-versa along a predetermined trajectory (R2, R3). The movable supports (20, 30) are adapted to move said grinding wheels (2, 3) along respective arcuate trajectories, such that the contact of each grinding wheel (2, 3) with a respective side of the cutting edge (40) of the blade (4) is progressive, whereby the contact between the grinding wheels and the blade increases progressively when the device passes from the standby rest configuration to the active configuration.

Abstract: A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.

Abstract: A grinder guard assembly disclosed for a grinder blade includes a rotatable and adjustable indexed grinder guard defining a plurality of indexed and chamfered holes adjacent to an inner ring thereof and an “L” edge configured on an outer circumference thereof to form a guard by retaining grinding debris and preventing outside intervention. The grinder guard assembly also includes an annulus forming a single member with an inside washer and an outside washer and a space there between configured to slidably retain the indexed grinder guard in a common plane with the washers, the annulus configured to axially attach to a hub of the grinder. The grinder guard assembly further includes torque sensitive protrusions mounted from the outside washer, the protrusions configured to lock with the chamfered holes of the indexed grinder guard and retract therefrom based on a torque force applied to the indexed grinder guard relative to the annulus.

Abstract: Device for controlling the sharpening state of a blade (2) having a cutting edge (20) delimited by two sides (21, 22) converging towards a plane (X) that contains the cutting edge itself. The device comprises two control surfaces each of which is in contact with a corresponding side (21, 22) of said cutting edge (20) and is connected with at least one transducer (R1, R2, R4), which produces an electrical displacement signal (S1, S2; S4) proportional to a displacement of the control surface with respect to said plane (X). Furthermore, the device comprises a processing unit (E) that receives said displacement signals (S1, S2, S4) and compares them, emitting an error signal if the comparison produces a value that exceeds a predetermined limit. The processing unit is connected to means (101, 102) for supporting and moving sharpening means (100).

Abstract: Device for controlling the sharpening state of a blade (2) having a cutting edge (20) delimited by two sides (21, 22) converging towards a plane (X) that contains the cutting edge itself. The device comprises two control surfaces each of which is in contact with a corresponding side (21, 22) of the cutting edge (20) and is connected with a transducer (R4), which produces an electrical displacement signal (S4) proportional to a displacement of the control surface with respect to said plane (X). Furthermore, the device comprises a processing unit (E) that receives said displacement signals (S4) and compares them, emitting an error signal if the comparison produces a value that exceeds a predetermined limit. The control surfaces are the surfaces that delimit an external groove (40) of a roller (4) that is free to translate along an axis (A4) perpendicular to said plane (X) and spaced from the blade (2) by an amount such that said cutting edge (20) passes in said groove (40).

Abstract: Device for sharpening blades of cutting-off machines, comprising two grinding wheels (1) each positioned on a corresponding side of a cutting edge (20) of a blade (2) of a cutting machine. The device comprises means adapted for controlling the symmetry of said cutting edge (20), with a sensor (3) placed at a predetermined distance from a corresponding side of the cutting edge (20. The sensor (3) is adapted to detect possible differences (d) between the lengths (n, p) of the two sides of the cutting edge (20). The sensor (3) is connected to a programmable unit (4) that processes the said difference (d) possibly detected by the sensor (3).

Abstract: The present invention discloses a wheel deburring device, including a rack, gears, gear racks, servo motors, cylinders and hair brushes and the like. In the use of the wheel deburring device, one servo motor can be used for achieving simultaneous rotation of left and right hair brushes and also adjusting the distance between the left and right hair brushes, and a clamping system can automatically adjust the position of radial blocks to make the distance between the left hair brush and the right hair brush adapt to wheels with different sizes; meanwhile, the wheel deburring device has the advantages of high degree of automation, advanced process, strong universality and safe and stable performance.

Abstract: The present invention relates to a smart BGA chip maintenance device comprising a base, a moving worktable, a horizontal slide, a vertical slide, a grinding knife, an electronic microscope and a mini-sized air compressor, wherein the base comprises a platform and a portal frame. The moving worktable is propelled by a first driving mechanism, wherein the horizontal slide is propelled by a second driving mechanism, wherein the vertical slide is propelled by a third driving mechanism. Both a grinding knife and an electronic microscope are provided on the vertical slide. An air pipe is disposed at the side of the grinding knife, wherein the grinding knife is propelled by a fourth driving mechanism to rotate, wherein the device can automatically perceive the flatness of the chip, ensuring a horizontal grinding process and avoiding the damage to the soldering pad of the circuit board.

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract: A chamfering apparatus including chamfering part for removing notch, cleaning part for cleaning and drying wafer, and chamfered-shape measuring part for measuring chamfered shape, each of chamfering and cleaning part, and chamfered-shape measuring part including rotatable stage for holding wafer and control unit for controlling rotational positions of rotatable stage and wafer, rotatable stage having reference position serving as reference of rotational positions at beginning of rotation, wherein wafer is held wherein rotational position of wafer at beginning of rotation relative to reference position is at same rotational position on all rotatable stages, and control unit to control rotational position of wafer to be at predetermined position at beginning and end of rotation.

Abstract: A vibratory tumbler. The vibratory tumbler includes a bowl having one or more engagement hooks and a latching hook; a base; and a connection platform coupled to the base and removably coupled to the bowl. The connection platform further comprises a vibration source; one or more openings capable of engaging the one or more engagement hooks; and a locking mechanism capable of engaging the latching hook. The locking mechanism can further comprise a latching opening capable of receiving the latching hook; a spring clip substantially within the latching opening and capable of engaging the latching hook; and a locking lever rotatably coupled to the spring clip whereby the spring clip engages the latching hook when the locking lever is in a locked position and releases the latching hook when the locking lever is in an unlocked position.

Abstract: A method for operating a polishing head is provided. The method includes keeping a stator of at least one electromagnetism actuated pressure sector stationary with respect to a carrier head, and electromagnetically and linearly moving an active cell of the electromagnetism actuated pressure sector with the stator to linearly move the active cell with respect to the carrier head.

Abstract: A chemical mechanical polishing system includes a carrier head having a flexible membrane and a chamber to apply pressure to the flexible membrane, a pressure control unit, a pressure supply line connecting the pressure control unit to the chamber, and a sensor located along the pressure supply line to detect a contaminant in the pressure supply line.

Abstract: An abrasive jet apparatus configured to machine features into an inner diameter of bored structures. In the abrasive jet apparatus, an abrasive mixture of pressurized liquid and abrasive particles is propelled as an abrasive jet in a direction other than the direction in which the abrasive jet apparatus extends. The abrasive jet apparatus may be implemented in an automated boring system and boring method for machining rifling grooves and other features into bored structures. The boring system and boring method use an iterative process of mapping a target surface of the bored structure and adjusting parameters of the boring system in between successive passes of the abrasive jet on the target surface.

Abstract: A polishing system includes a support to hold a substrate having a substrate surface to be polished, a conditioning system for conditioning a polishing pad, the conditioning system comprising one or more conditioning heads, a movable support structure, and a carrier to hold a polishing pad. The carrier is suspended from the movable support structure, and the support structure is configured to move the carrier between the support to hold the substrate and the conditioning system.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major sides, an adhesive make coat on the second major side, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and an exposed laminated non-slip layer on the first major side. Methods of making and using such sandpaper are also provided.

Abstract: A sanding tool is adapted to be attached to an existing wood board molding machine. The sanding tool provides a rotating sanding drum which removes imperfections from the profile of the molding as it exits the molding machine. The sanding drum is height adjustable and is powered by an electric motor.

Abstract: A method for forming a silicon ingot includes the following steps: providing a silicon ingot of variable electrical resistivity and containing interstitial oxygen, determining the interstitial oxygen concentration in different areas of the silicon ingot, calculating the concentration of thermal donors to be created in the different areas to reach a target value of the electrical resistivity, and subjecting the different areas of the silicon ingot to annealing so as to form the thermal donors. The annealing temperature in each area is determined from the thermal donor and interstitial oxygen concentrations of the area and from a predefined annealing time.

Abstract: An abrasive article including a disc including a central axis; a primary outer edge substantially coaxial with the central axis and having a circumferential length, L1; a secondary outer edge substantially coaxial with the central axis and coplanar with the primary outer edge, the secondary outer edge having a circumferential length, L2, wherein L2 is less than L1; and a structurally weakened portion extending substantially adjacent to the secondary outer edge. In an embodiment, the abrasive article further includes a shedable portion configured to rupture the structurally weakened portion when the shedable portion is removed from the abrasive disc. In another aspect, an abrasive article having an initial outer circumferential length, LI, and a length of deliberately exposable circumferential edge surface, LOE, wherein LOE is greater than LI.

Abstract: An abrasive assembly including a back-up pad having a central axis, an engagement component, and an alignment element; and an abrasive disc having a central axis, the abrasive disc engaged with the back-up pad, the abrasive disc including an alignment element; wherein the alignment element of the back-up pad aligns with the alignment element of the abrasive disc, wherein the engagement component of the back-up pad engages with the abrasive disc, and wherein the back-up pad and the abrasive disc have a concentricity tolerance, C, as measured between the central axis of the back-up pad and the central axis of the abrasive disc, of no greater than about 0.1.