Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).

Abstract: The abrasive nozzle head includes, within a hollow head body mounted to a nozzle adapter supplying high pressure water: a water nozzle; a mixing chamber; and an abrasive nozzle, which are arranged coaxially with the nozzle adapter. The abrasive nozzle head is provided with an abrasive supply portion that supplies an abrasive to the mixing chamber. The head body has a recessed hole formed by drilling from a side surface, the recessed hole intersecting with the jet axis of a water jet. A mixer member is removably inserted into the recessed hole, and formed with the mixing chamber and an abrasive supply port. The abrasive nozzle head also includes: a positioning portion that positions the mixing chamber coaxially with the water nozzle and the abrasive nozzle when the mixer member is fully inserted; and a fixing portion that releasably fixes the mixer member in the fully inserted position.

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract: A coated abrasive article including a body having a backing including a spunlace polyester-based material and a saturant contained in the spunlace polyester-based material, the saturant including a material selected from the group of phenolic resin, acrylic, urea resin, and a combination thereof, and an abrasive layer overlying the backing including abrasive particles.

Abstract: Systems and methods for treating concrete, which includes the steps of wetting a surface of concrete with a amorphous colloidal silica, allowing time for the colloidal silica to penetrate the concrete surface, and cutting the surface of the concrete with a bladed tool wherein the longitudinal blade portion is positioned approximately at an angle between 30 degrees and 90 degrees relative to the surface of the concrete.

Abstract: Provided is a method for manufacturing an optical element from glass after polishing and in which either or both of a cleaning liquid used in a cleaning step for the glass after polishing and a rinsing liquid used in a rinsing step after the cleaning step are a liquid that inhibits expansion of cracked parts present on the surface of the glass after polishing.

Abstract: The invention relates to a deburring machine for ends of sections (3, 51) of an elongate profile which are cut to length, with a receiving means (4) for a stack (2) or a bundle (50) of sections (3, 51) and a separating device for the sections (3, 51) of the stack (2) or the bundle (50), with a conveying device for the separated sections (3, 51) and at least one brush (40) which is arranged along the conveying device and which is in contact with the ends of the separated sections (3, 51) during the conveying thereof and which deburrs the ends.

Abstract: Apparatus and method for sharpening a tool. In accordance with some embodiments, a selected side surface of the tool is placed in contacting engagement against an upper reverse sharpening guide surface that faces an abrasive surface extending along a first plane. The upper reverse sharpening guide surface is aligned along a second plane that intersects the first plane at an acute angle. A tool cutting edge contactingly engages a non-abrasive support surface disposed between the upper reverse sharpening guide surface and the abrasive surface to establish a plunge depth of the tool prior to contact with the abrasive surface. The tool is thereafter moved away from the upper reverse sharpening guide in a lateral direction across the abrasive surface while nominally maintaining the tool at the acute angle to sharpen the cutting edge in a trailing cutting edge orientation.

Abstract: This invention relates to abrasive flap wheel that include hybrid fabrics. This invention also relates to methods of making and using said abrasive flap wheels. The claimed processes and systems related to the use and manufacturing of abrasive flaps are improved and cost effective.

Abstract: A positioning structure for cutting machines or grinder machines has a rotating shaft and a positioning assembly. The rotating shaft has an abutting face, a fixing portion, at least one mounting protrusion, and a fastening hole. The at least one mounting protrusion axially protrudes from the abutting face, and the fixing portion axially protrudes from the at least one mounting protrusion. The fastening hole is axially formed in the at least one mounting protrusion. The positioning assembly is screwed with the rotating shaft and has a positioning element and a fastening element. The positioning element has an abutting portion and a through hole. The fastening element is mounted through the through hole and the fastening hole. Therefore, when a size of an assembling hole of a cutting disk or a grinder disk changes, the rotating shaft does not need to be changed and reinstalled.

Abstract: The invention relates to devices, systems and methods for restoring optical discs, including CD's, DVD's and Blu-ray discs. The invention provides an easy to use device for user's to repair optical discs without having to clean or remove rotating pads in the device between uses for the life of the pads of about 84 cycles.

Abstract: A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.

Abstract: The present disclosure provides a belt transmission device and a grinding apparatus. The device comprises: a grinding stand; rotation wheels mounted on the grinding stand, including a driver wheel and driven wheels; a grinding belt supported by rotation wheels; a first sensor fixedly provided on the grinding stand and configured to detect a rotation speed of any one of the driven wheels; and a controller configured to control a rotation speed of the driver wheel and connected with a driving motor of the driver wheel, wherein the controller is further connected with the first sensor, receives rotation speed signals of the one driven wheel detected by the first sensor, calculates difference between the rotation speeds of the driver wheel and the one driven wheel, and compares the difference with a predetermined difference range in the controller; and when the difference is beyond the predetermined difference range, an alarm is provided.

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Abstract: A grinding disk is provided with a support plate with anchoring projections. A drive connector is connected to the support plate. An elastically deformable pad in the form of an injection molded part of un-foamed elastomeric thermoplastic synthetic material is provided and has a first face and an opposite second face. The pad has a chamber structure provided on the first face. The chamber structure has chambers laterally delimited by intermediate walls. The chambers have a top side that is open and is facing in a direction of the first side. The pad has a substantially closed support surface provided on the second face and facing away from the chamber structure. A working element is to be attached to the support surface. The support plate is connected to the first face of the pad to support the pad. The anchoring projections of the support plate are embedded within the pad.

Abstract: An embodiment of the present invention provides a surface plate provided at a wafer double-side grinding device for grinding a wafer. The surface plate includes a plurality of first surface plate grooves formed in a first direction, and a plurality of second surface plate grooves formed in a second direction different from the first direction. The first surface plate grooves and the second surface plate grooves have first and second surface plate groove portions arranged therein, the first and second surface plate groove portions having steps formed in a direction toward the center or an outer periphery of a lower surface plate.

Abstract: A grinding tool, such as a cutting disc, includes a matrix, in particular a sintered metal matrix, and diamonds embedded in the matrix. At least the majority of the diamonds are each assigned at least one wear-promoting particle and/or at least one wear-inhibiting particle. The at least one wear-promoting particle and the at least one wear-inhibiting particle are likewise embedded in the matrix.

Abstract: The invention relates to a machine (10) for machining and/or measuring a workpiece (49). Machine (10) has a machine frame (18), a first transverse member (24) which is rotatably mounted by means of a first round guide (25) about a first rotational axis (D1) on the machine frame (18) and on which a tool unit (11) with a tool (13, 14) is arranged, where the tool (13, 14) is arranged at a distance from the first rotational axis (D1). Machine (10) also has a second transverse member (40) which is rotatably mounted by means of a second round guide (41) about a second rotational axis (D2) on the machine frame (18), and on which a workpiece clamping device (12) is arranged at a distance from the second rotational axis (D2). The two rotational axis (D1, D2) are aligned parallel to one another.

Abstract: Fluid jet systems, components and related methods are provided which are well adapted for processing workpieces under particularly work-friendly conditions. Embodiments include fluid jet systems and related methods that reduce, minimize or eliminate a gap between a workpiece being processed and jet receiving devices that receive and dissipate the energy of a fluid jet passing through the workpiece. Other embodiments include fluid jet systems and related methods involving fluid jet processing of workpieces in a submerged condition. Still further embodiments include fluid jet systems and related methods involving position and orientation adjustment of a fluid jet receptacle to coordinate the path of an incoming fluid jet with a central axis or other feature of the fluid jet receptacle.