Abstract: An electronic device including an inverter includes a pull-up driving unit configured to drive an output node with a high voltage in response to an input signal; a path switching unit coupled in a path between the pull-up driving unit and the output node according to a direction of a first current flowing between the pull-up driving unit and the output node and operable to selectively switch on or off the path; a pull-down driving unit coupled to the output node to supply a low voltage in response to the input signal; a path blocking unit coupled in a path between the pull-down driving unit and the output node to block the path; and a bypass unit coupled to form a bypass path between the pull-down driving unit and the output node.

Abstract: Techniques are provided for managing voltages on memory cells in a cross-point array during a read operation. The techniques apply to vertical layer thyristor memory cells and non-thyristor memory cells. Voltages on selected bitlines (e.g., corresponding to memory cells from which data is to be read), are set to a read voltage level. Voltages on unselected bitlines (e.g., corresponding to memory cells from which data is not to be read and which are not to be disturbed) are set to a de-bias voltage level that is different from the read voltage level.

Abstract: Technologies are generally described herein for technologies to sense the threshold voltage for memory cells in one sensing operation. The memory cells may be storage circuits for a flash memory device, such as a multilevel flash memory device. Data may be stored and retrieved in the memory cells of the flash memory without involving the use of hardwired or predetermined thresholds. According to some configurations, the sense time distribution from a set of flash cells (e.g., one row), may be processed to decode the digital state of each memory cell. In some examples, computer-executable instructions may be used to process and decode the digital state of the memory cells.

Abstract: A circuit component that exhibits a region of negative differential resistance includes: a first layer of material; and a second layer of material in contact with the first layer of material, the contact forming a first self-heating interface. The first self-heating interface is structured such that an electrical current flowing from the first layer of material to the second layer of material encounters an electrical impedance occurring at the first interface that is greater than any electrical impedance occurring in the first and second layers of material, wherein heating occurring at the first interface is dominated by Joule heating caused by the electrical impedance occurring at the first interface, and wherein the electrical impedance occurring at the first interface decreases with increasing temperature to induce a region of negative differential resistance.

Abstract: A memory architecture comprises a first memory macro comprising a first plurality of memory cells, a second memory macro comprising a second plurality of memory cells, and a control logic coupled to the first and second memory macros. The control logic is configured to write a logical state to each of the first and second pluralities of memory cells by using first and second signal levels, respectively, thereby causing the first and second memory macros to be used in first and second applications, respectively, the first and second signal levels being different and the first and second applications being different. The first and second memory macros are formed on a single chip, and wherein the first and second pluralities of the memory cells comprise a variable resistance dielectric layer formed using a single process recipe.

Abstract: A read sensing method for an OTP non-volatile memory is provided. The memory array is connected with plural bit lines. Firstly, a selected memory cell of the memory array is determined, wherein one of the plural bit lines connected with the selected memory cell is a selected bit line and the other bit lines are unselected bit lines. Then, the unselected bit lines are precharged to a precharge voltage. Then, the selected bit line is connected with the data line, and the data line is discharged to a reset voltage. After a cell current from the selected memory cell is received, a voltage level of the data line is gradually changed from the reset voltage. According to at least one result of comparing a voltage level of the data line with a comparing voltage, an output signal is generated.

Abstract: A 6T bitcell for single port SRAM that performs single ended read and single ended write is described. The presently described bitcell gives huge advantage in terms of area, dynamic power, leakage power and performance over the prior art in the industry. The bitcell and architecture does not have either a write bitline pair or a read bitline for each bitcell. It has only one read bitline per mux.

Abstract: A non-volatile memory device according to an embodiment includes a first conductive layer, a second conductive layer including metal nitride, the metal nitride absorbing oxygen, a paraelectric layer disposed between the first conductive layer and the second conductive layer, a ferroelectric layer disposed between the paraelectric layer and the second conductive layer, the ferroelectric layer including hafnium oxide, at least one third conductive layer disposed on opposite side of at least one of the first conductive layer and the second conductive layer to the ferroelectric layer, the at least one third conductive layer including metal oxide, the metal oxide having oxygen ratio larger than stoichiometric ratio, and a sense circuit configured to read data based on tunneling current flow between the first conductive layer and the second conductive layer through the paraelectric layer and the ferroelectric layer.

Abstract: Apparatuses and methods for providing activation timings of sense amplifiers in a semiconductor device are described. An example apparatus includes: a first memory bank including at least one first sense amplifier that is enabled responsive to a first activation signal; a second memory bank including at least one second sense amplifier that is enabled responsive to a second activation signal; and a control circuit that receives a control signal. The control circuit includes a delay circuit that provides a delayed control signal by delaying the control signal, a first sense amplifier control circuit coupled to the first delay circuit and provides the first activation signal respective to the delayed control signal when the first memory bank is designated, and a second sense amplifier control circuit coupled to the delay circuit and provides the second activation signal respective to the delayed control signal when the second memory bank is designated.

Abstract: A semiconductor system includes a semiconductor device suitable for not performing an internal refresh operation when entering a self-refresh mode in response to a self-refresh command, and cutting off input of an auto-refresh command when exiting the self-refresh mode.

Abstract: An apparatus includes a memory module socket having a base end and a branching point. The base end is coupled to a printed circuit board (PCB). The branching point is external to the PCB. A first branch extends from the branching point at an angle ?1, where 90 degrees??1<180 degrees, and a second branch extends from the branching point at an angle ?2, where 90 degrees??2<180 degrees. A method includes signaling between the PCB and a first memory module and a second memory module via a base end of the memory module socket. The memory module socket connects to the PCB via the base end. The signaling is branched at a branching point of the memory module socket to the first memory module via a first branch and to the second memory module via a second branch. The branching is external to the PCB.

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.

Abstract: A power path controller included in a system-on-chip (SoC) is provided. The power path controller is coupled to a first power source and a second power source. The power path controller includes a first switch located between the first power source and a memory core included in the SoC, a second switch located between the second power source and the memory core, a comparator configured to compare a first power supply voltage supplied from the first power source with a second power supply voltage supplied from the second power source, and a switch controller configured to selectively activate the first switch or the second switch according to a comparison result of the comparator.

Abstract: A memory circuit may be provided. The memory circuit may include a memory array. The memory circuit may include an input and output path circuit coupled to a probe pad and a bump pad, and may be configured to input and output a signal between an exterior of the memory circuit and the memory array. The memory circuit may include a scanning circuit configured to generate a sensing signal by sensing a signal outputted through the bump pad while performing scanning of at least one of a reference voltage and a test strobe signal.

Abstract: A method and a circuit for reading resistive states of memory elements within crossbar arrays includes a first crossbar array having first sets of row firms and column lines, with memory elements disposed at the intersections between the row lines and the column lines, a second crossbar array having second sets of row lines and column lines, with memory elements disposed at the intersections between the row lines and the column lines, and a comparator having a first input connected to the first crossbar array and a second input connected to the second crossbar array, wherein the first input is configured to receive a sense voltage from as select column in the first crossbar array and the second input is configured to receive a reference voltage from a corresponding select column in the second crossbar array.

Abstract: Embodiments relate to circuits, electronic design automation (EDA) circuit layouts, systems, methods, and computer readable media to enable logic devices operating on a core supply voltage to drive memory devices operating on a different supply voltage using low power and high data rates while avoiding voltage over-stress of thin-oxide transistors. In an embodiment, channels of a thin-oxide PMOS transistor, a thick-oxide PMOS transistor, a thick-oxide NMOS transistor, and a thin-oxide NMOS transistor are coupled in order from a memory device voltage supply rail to a low voltage supply rail. Gates of the thin-oxide PMOS transistor and the thick-oxide NMOS transistor are coupled with an output of a flying capacitor circuit that level-shifts an input signal by a difference between the memory device supply and core supply voltages, while gates of the thick-oxide PMOS transistor and the thin-oxide NMOS transistor receive the input signal via a buffer.

Abstract: In a method of reading a memory device, difference information is generated based on a distance difference between a position of a read word-line and a position of a boundary word-line. The read word-line corresponds to a read address. The boundary word-line corresponds to a last programmed word-line in a memory block included in a memory cell array. A read word-line voltage and an adjacent word-line voltage are determined based on the difference information. The read word-line voltage is applied to the read word-line. The adjacent word-line voltage is applied to an adjacent word-line that is adjacent to the read word-line. A read data corresponding to the read address is outputted based on the read word-line voltage and the adjacent word-line voltage.

Abstract: Systems and methods are disclosed for configuring dynamic random access memory (DRAM) in a personal computing device (PCD). An exemplary method includes providing a shared command access (CA) bus in communication with a first DRAM and a second DRAM. A first command from a system on a chip (SoC) is received at the first DRAM and the second DRAM. A decoder of the first DRAM determines whether to mask a mode register write (MRW) in response to the received first command. A second command containing configuration information is received vie the shared CA bus at the first DRAM and the second DRAM. Responsive to the determination by the decoder of the first DRAM, the received MRW is either ignored or implemented by the first DRAM.

Abstract: Systems and methods are disclosed for configuring dynamic random access memory (DRAM) in a personal computing device (PCD). An exemplary method includes providing a shared command access (CA) bus in communication with a first DRAM and a second DRAM. A first command from a system on a chip (SoC) is received at the first DRAM and the second DRAM. A decoder of the first DRAM determines whether to mask a mode register write (MRW) in response to the received first command. A second command containing configuration information is received vie the shared CA bus at the first DRAM and the second DRAM. Responsive to the determination by the decoder of the first DRAM, the received MRW is either ignored or implemented by the first DRAM.

Abstract: Apparatus and methods utilize a replica circuit to generate a voltage for programming of a memory cell, such as a memory cell of a phase-change memory (PCM). Current passing through a circuit including the memory cell to be programmed is mirrored in a scaled or unscaled manner, and provided as an input to the replica circuit. The replica circuit represents voltage drops that should be encountered when programming the memory cell. An input voltage is also provided to the replica circuit, which affects the voltage drop within the replica circuit that represents the voltage drop of the cell. The voltage drop across the replica circuit can then be mirrored and provided to bias the circuit including the memory cell.