Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Monomer is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.

Abstract: A superconducting magnet is formed having composite conductors arrayed in coils having turns which lie on a surface defining substantially a frustum of a cone. The conical angle with respect to the central axis is preferably selected such that the magnetic pressure on the coil at the widest portion of the cone is substantially zero. The magnet structure is adapted for use as an energy storage magnet mounted in an earthen trench or tunnel where the strength the surrounding soil is lower at the top of the trench or tunnel than at the bottom. The composite conductor may be formed having a ripple shape to minimize stresses during charge up and discharge and has a shape for each ripple selected such that the conductor undergoes a minimum amount of bending during the charge and discharge cycle.

Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths.

Abstract: A superconducting magnetic field generating apparatus, and coil, a superconducting wire, a method of producing a coil and a method of connecting a superconducting wire which are suitable for such a superconducting magnetic field generating apparatus are disclosed. The superconducting magnetic field generating apparatus has a coil of a wound superconducting wire which is composed of superconducting wires with the end portions thereof connected with each other. Each of the superconducting wires is composed of a plurality of superconducting material wires embedded in a stabilizing member. The group of superconducting material wires is embedded at the connecting portion in a state in which the superconducting material wires are densely gathered to the central portion of the stabilizing member and the superconducting material wires are directly in contact with each other.

Abstract: A versatile unitary electrode splice cap for insulating and weatherproofing the splice connection between a neon tube electrode and its associated power cable in a neon sign system. The cap is useful both in "straight-on" and "double-back" installations.

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract: A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

Abstract: A circuit board comprising a dielectric composite (20,22,24) clad with electrical circuitry (16,38) is provided with an improved electrical interconnection between alternate conductive circuitry planes of the substrate. Connecting features (18,40) integral with the conductive circuitry on each conductive plane of the substrate extend into a through hole (30) of the substrate toward each other and are fused (46) to one another by irradiation from a laser beam. In another embodiment a connecting feature (52) from only one of the circuit layers (50) extends into the through hole (66) of the dielectric (60,62,64) and is electrically connected and physically bonded to the circuitry layer on the other side of the substrate by means of fusion or a drop (68) of electrically conductive resin interposed between the raised connector feature and the opposed circuit layer (74).

Abstract: A system for transmitting magnetic flux distance from a flux generating device uses a flux transmission unit for transmitting the flux that has a special portion made of superconductive material. Several embodiments disclose different flux transmission path construction and the control of the transmission of data by controlling the superconductive properties and the generation of the flux.

Abstract: Winding arrangements for cryomagnets have a winding of superconducting wire (12) connected in parallel to a winding of normally conducting wire (11) which, in the event of a quench, conducts the operating current and mechanically stabilizes the winding arrangement. Independently of this, the size of such a winding arrangement depends primarily on the tensile forces exerted on the wires and on the modulus of elasticity of the material of the wire. The size of such a winding arrangement is a significant factor in its cost and should therefore be reduced. According to the invention, the winding arrangement has a plurality of groups (17) arranged in radially repetitive layers inside the winding section, in which each winding of superconducting wire surrounds windings of a normally conducting wire and windings of steel wire or of a wire with a high modulus of elasticity.

Abstract: A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit to other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.

Abstract: The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a given portion for connecting components to the thick circuit conductor and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of the substrate, which includes a land corresponding to the parts-mounting section of the thick circuit conductor and has a predetermined circuit pattern, and a conductor for electrically connecting the land and the given portion of the thick circuit conductor. In this circuit board, the land and the given portion of the thick circuit conductor are connected by a conducting member provided in the through hole.

Abstract: A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.

Abstract: The present invention relates to an edge saddle having plural steps which is to be installed within a through groove or through hole of a chassis plate of an electric appliance or electrical instrument. The edge saddle comprises a frame body having a base portion, first engaging portions including stepped contact portions for engaging the inner side of a chassis plate and for contacting the inner surface of a through groove or through hole of the chassis plate, and a second engaging portion for engaging the outer side of the chassis plate to hold the chassis plate together with the first engaging portions, the stepped contact portions including plural steps along the direction of the plate thickness of the chassis plate. The first engaging portions are separated from the frame body by slits extending to its base portion and are supported by the base portion like a cantilever.

Abstract: A corrona test set has at least a reactor and power separation filter placed in an oil-filled conductive tank of a conductive material such as sheet steel. The exciter optionally may also be placed in the same tank enclosure which is of much smaller size than the equivalent voltage rating test set in air. High voltage taken from the circuit passes out of the tank through high voltage bushings. A preferred form of bushing is a quick coupling cable receiving device having an insulator extending into the tank and a frustoconical metallic extension extending away from the tank with a tubular internal wall connected to these respective parts at opposite ends to form a further oil-filled compartment separate from the tank.

Abstract: Via patterns (16, 18) are applied to a first interlevel oxide layer (58) down to a metal layer (52) to define a plurality of orifices. These orifices (61, 63) are filled with tungsten by selective chemical vapor deposition. A first level conductor pattern (10, 12, 14) is then used to etch away the first insulator layer (58) and portions of plugs (62, 64) that are outside the first level conductor pattern. This first level conductor pattern is also used for a subsequent first level metal etch. The entire structure is then covered with a self-planarizing oxide layer (82), which is subsequently etched back to expose the top surfaces (66, 68) of tungsten plugs (62, 64).

Abstract: A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.

Abstract: This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material with a sheet of flexible over-layer material extending over at least the entirety of the conductors in all the flexible portions. A flexible adhesive material may adhesively attach the sheet of flexible over-layer material to the entirety of all the flexible portions and a rigid substrate material extends over the entirety of all the rigid portions. A rigid adhesive material may adhesively attach the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the rigid substrate material to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge.

Abstract: A superconductive switch is provided with a pair of superconductive routes which are wound around a cylindrical core in a bifilar fashion. One superconductive wire is constituted of a pair of superconductive routes. The superconductive routes are twisted around each other at a uniform pitch. By virtue of the twisting, electromagnetic force which may exerted in the superconductive wires cancel each other, so that the wire-movement of the superconductive wire is restrained. Accordingly, the electrical current flowing through the superconductive switch can be increased.

Abstract: A solenoid device having an output which is substantially linearly proportional to its electrical input and which includes an axially adjustable polepiece. The polepiece carries a permanent magnet which is annularly disposed about the polepiece and which provides an efficient magnetic circuit in conjunction with the electromagnetic coil of the solenoid.