Abstract: A circuit board comprising a plurality of film substrates in which films having heat deformation properties are laminated one on another, conductive patterns formed on at least one surface of each of the resin films, and connecting portions for electrically connecting the conductive patterns. The connecting portions are formed of parts of the conductive patterns, where the parts of the conductive patterns are made of conductive material including thermoplastic resin, and other parts of said conductive patterns are made of thermosetting resin.

Abstract: A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). These bridges (16) are designed to transmit or receive visual, acoustical or other electromagnetic data and power. The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the edges (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to bridge and electrically connect the pads (14) located on the array elements (12). The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed.

Abstract: A stainless steel mandrel (10) is etched with a negative pattern (16) of an electrical circuit that is to be made with the mandrel and then covered with Teflon (20) which is subsequently lapped to provide a coplanar surface of stainless steel and Teflon. A pattern of electrical conductors (30) is then electroformed, as by electrolytic or electroplating, on the exposed surfaces of the mandrel between the embedded Teflon. Surfaces of the electrical conductors of the circuit are then processed, as required for enhanced adhesion to a substrate, and a dielectric substrate of polyamide and acrylic is then laminated upon the surface of the mandrel over the electroformed conductors so that the dielectric substrate adheres to the conductors. The assembly of dielectric substrate and conductors is then separated from the planar surface of the mandrel and its embedded Teflon.

Abstract: The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates.

Abstract: This magnetostatic wave device includes a ferrimagnetic substrate like, for example, a YIG thin film. On this ferrimagnetic substrate a strip line is formed. One end of the strip line is connected to an input terminal and the other end is connented to an output terminal. A magnetic field is applied to the ferrimagnetic substrate by a magnet. In this case, the ferrimagnetic substrate is so disposed that a direction parallel to its principal plane and a direction perpendicular to its principal plane are not parallel to the direction of a line of magnetic force of the magnet.

Abstract: A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser resistance (and wiring density) than the others. In one example, several (e.g. at least four) such layered subassemblies may be included in the overall assembly such that those layers located along one side of the board may possess substantially greater wiring densities than the layers on the other side of the board while those layers on said other side will in turn possess lesser resistance (and greater current capacities). There are also described at least three methods for making the above multilayered circuit board assembly. Such a structure may be utilized in supercomputer applications.

Abstract: Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.

Abstract: The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive techniques. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.

Abstract: A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

Abstract: A printed wiring board comprises a board member having a major surface virtually broken down into a first zone and a second zone, and at least one through-hole of a predetermined diameter is open at the first zone of the major surface, wherein an electrically conductive test pattern with a first conductive sub-pattern and a second conductive sub-pattern spaced apart from each other is formed on the second zone of the major surface, a first test hole of the first predetermined diameter being formed in the first conductive sub-pattern in such a manner as to split the first conductive sub-pattern into two disconnected pieces without breakage of the second conductive sub-pattern in so far as the first predetermined diameter is matched with a design specification, thereby easily checking the at least one through-hole by using current to see whether or not the predetermined diameter is correct.

Abstract: A superconducting magnetic energy (SMES) system having an axially sectioned multilayered solenoid coil immersed in a liquid helium bath contained in annular helium vessel includes as an interface between each section of the inner and outer layers of the coil and the helium vessel a finger plate assembly comprising a plurality of electrically nonconductive finger plates clamped at one end with spacers between adjacent finger plates to hanger plates welded to the helium vessel walls. The other ends of the finger plates are interleafed with the turns of the coil and clamped together with the coil turns by clamping assemblies which clamp the turns in adjacent layers of the coil. Loading bars between the layers transmit the radial loads generated by the magnetic and thermal forces acting on the coil to the finger plates.

Abstract: A superconducting coil assembly. The assembly includes an insulating substrate, a plurality of insulating layers disposed in a stacked assembly on the substract, and a superconducting spiral pattern between the substrate and the adjacent insulating layer and between each adjacent pair of insulating layers. Superconducting connecting portions connect the spiral patterns to form a continuous thick film superconducting coil of right hand or left hand orientation. The spiral patterns and connecting portions are thick films of a high temperature ceramic superconducting material. A superconducting connecting link may interconnect the ends of the continuous coil to form a closed loop. The insulating layers and spiral patterns may be deposited successively over an insulating substrate. Alternatively, the insulating layers may be annular disks with vias therethrough for connecting the spiral patterns.

Abstract: A hermaphroditic enclosure especially adapted to gel seal an elongate substrate and particularly a coaxial cable splice.

Abstract: An electromagnet defines a gap between a first polepiece in the shape of the butt end of an elongate cylinder and a second polepiece in the shape of a thick annular ring. A permanent magnet having its poles aligned along the axis of the cylinder moves bidirectionally in the gap in response to alternate polarity energization of the electromagnet, serving as a prime mover. When the electromagnet is not energized then the magnetic flux of the permanent magnet shunts an adjacent polepiece, holding the magnet in place. Upon energization of the electromagnet the relatiely strong magnetic flux of the permanent magnet is switched by a relatively weak electromagnetic flux to pass through the electromagnet, exerting an electromotive force on the permanent magnet and causing it to move. This flux switching offers gain: a one-half gram samarium cobalt permanent magnet moves 0.38 mm in response to a 0.015 ampere 1.5 v.d.c. 20 millisecond current pulse (4.5.times.10.sup.-4 joules) and holds at 40.+-.2g's.

Abstract: A protective sheath for insulating a live end of an electrical cable is provided, the sheath comprising a receptacle constructed of insulative material and having interior and exterior portions, the sheath including both open and closed ends, the open end being accessible for insertion of a live end of an electrical cable. The receptacle includes a structure of attaching the receptacle to an electrical cable near a live end thereof. A retainer mounting plate may be provided within the receptacle near the closed end, the mounting plate serving as a point of attachment for the live end of the electrical cable to be protected.

Abstract: The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the solid solution at the interface between the substrate and the thick film copper and then applying the dielectric layer to the thick film copper and curing the dielectric layer. Circuit patterns and components can then be built on the dielectric layer.

Abstract: A magnetic shielding apparatus for eliminating magnetic flux from an object comprises a first superconductor wall provided at one side of the object and a second superconductor wall provided at the other, opposing side of the object and so as to intersect with the interlinking magnetic flux passing through the object. The first and second superconductor walls experience a transition from a normal conduction state to a superconduction state upon cooling below a critical temperature, and each of the first and second superconductor walls has first and second movable members movable in a direction perpendicular to the magnetic flux between a first position in which the first and second movable members conceal the object and a second position in which the first and second movable members form an aperture that exposes the object.

Abstract: A waterproof wire-sockets electrical junction cover suitable for use in wet environments includes a chamber to house the wire-sockets electrical junction. Sealable passages on one end of the chamber allow electrical wires to pass into the chamber. On the other chamber-end, a sealable port allows the wire-sockets itself to enter the chamber. The electrical wires are mechanically and electrically joined using the wire-sockets. The resulting junction is then drawn through the aforementioned sealable port into the chamber. The port is closed, thereby completely watertight sealing the wire-sockets electrical junction.

Abstract: An electromagnetic coil configuration used for swaging small tubing. The coil consists of a coaxial arrangement of an inner helical coil and an outer coil shaped as a hollow cylinder with one end open and the other end closed and connected by direct electrical contact to one end of the inner coil.

Abstract: A superconducting magnetic energy storage unit is provided in which the magnet is wound in a toroidal fashion such that the magnetic field produced is contained only within the bore of the magnet, and thus producing a very low external field. The superconducting magnet includes a coolant channel disposed through the wire. The bore of the magnet comprises a storage volume in which cryogenic coolant is stored, and this volume supplies the coolant to be delivered to the coolant channel in the magnet.