Patents Examined by Trinidad Korka
  • Patent number: 5159158
    Abstract: An electrical assembly, such as an insulator or a surge arrester, utilizing a plurality of elastomeric weathershed housings for enclosing a core member therein. The elastomeric weathershed housings are coupled and sealed together by an insulating collar. A radially directed force is applied to the collar or the weathershed housings to cause intimate contact between the collar and the end portions of the weathershed housings to provide a weathertight seal. In the preferred embodiment, the radially directed force is provided by insertion of the core member into the axial bore of the weathershed housings causing radial outward expansion of the weathershed housings into intimate contact with the insulating collar. In another embodiment, the radially directed force is provided by a heat shrinkable insulating collar, which is shrunk about the end portions of adjacent weathershed housings. The core member can be an insulating rod or a plurality of electrical components, such as metal oxide varistors.
    Type: Grant
    Filed: November 7, 1990
    Date of Patent: October 27, 1992
    Assignee: Hubbell Incorporated
    Inventors: John D. Sakich, Waymon P. Goch
  • Patent number: 5153385
    Abstract: A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an array of solderable surfaces (24). A polymer coating (18) is applied over the semiconductor device (12), the wirebonds (16), and the top side of the printed circuit board (10) and cured. The coating (18) is then sputter etched in a partial vacuum to enhance the adhesion of the transfer molding compound (20) to the printed circuit board (10). The semiconductor device is encapsulated by a transfer molding process. The polymer coating (18) also provides a barrier to alpha particle emission, improves the moisture resistance of the completed package and reduces stress at the surface of the device.
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: October 6, 1992
    Assignee: Motorola, Inc.
    Inventors: Frank J. Juskey, Lonnie L. Bernardoni, Thomas J. Swirbel, Barry M. Miles
  • Patent number: 5153384
    Abstract: A circuit board comprising a base having a substantially flat surface and an insulative layer made of a heat-resisting synthetic resin formed on the flat surface of the base. The insulative layer is provided with grooves for forming conductive parts, and each of the groove is defined by a bottom surface formed by the base and side walls formed by the insulative layer. A conductive adhesive layer having a good adhesion characteristic with respect to the base, such as Cr, is formed on the bottom surface of the grooves, and a conductive layer is formed on the conductive adhesive layer so that a surface defined by the insulative layer and the conductive parts including the conductive layer and conductive adhesive layer is substantially flat.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: October 6, 1992
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventors: Takahiro Iijima, Shinichi Wakabayashi
  • Patent number: 5140110
    Abstract: A printed circuit board includes a first electric conductive layer formed on an insulating base plate to form signal patterns and a ground pattern. An insulation layer covering the signal patterns and a second electric conductive layer connected to the ground pattern are sequentially formed on the plate. A large area ground land is formed in the vicinity of a ground terminal of a digital IC by the first electric conductive layer to be connected to the ground terminal, which is directly surface-connected to the second electric conductive layer so that a ground impedance of the ground terminal can be reduced.
    Type: Grant
    Filed: August 26, 1991
    Date of Patent: August 18, 1992
    Assignee: Nintendo Co. Ltd.
    Inventors: Katsuya Nakagawa, Masakazu Nagano, Jun Higashiyama
  • Patent number: 5138383
    Abstract: An apparatus for using superconductivity intended to increase its critical current density by locating not a superconductor of the metallic type but another superconductor of the ceramic type on the side of high magnetic field in a cryostat. According to this constitution, the apparatus provides higher current density (JC) and better in performance.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: August 11, 1992
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shoji Shiga, Kiyoshi Yamada, Takayuki Sano
  • Patent number: 5138393
    Abstract: A magnetic core comprises at least one layer of magnetic film composed of an amorphous alloy and an electrically insulating film made of polyimide. Powder materials having a property for alleviating mutual influence between the magnetic thin film and the insulating film during a heat treatment thereof are stuck to a surface of the magnetic film or the insulating film. The magnetic film and the electrically insulating film are alternately wound up in a predetermined shape with powder material interposed therebetween to thereby form a magnetic core.
    Type: Grant
    Filed: June 6, 1990
    Date of Patent: August 11, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masami Okamura, Takao Sawa, Takao Kusaka, Yoshiyuki Yamauchi
  • Patent number: 5136124
    Abstract: A method for forming an electrically conductive line between two layers of insulating material and method for connecting the line through both layers of the insulating material to the opposite surfaces is provided. In the method, first, second and third layers of insulating material are provided wherein the first and third layers are separated by the second layer of insulating material which is different in etch rate from the first and third layers. The edge portion of all three layers is exposed and the insulating layer of the second material is selectively etched to remove the revealed edge portion and provide a slot between the first and third layers of insulating material. Also openings are provided in both the first and third layers of insulating material which communicate with the slot and extend respectively through the layers of the first and third insulating material.
    Type: Grant
    Filed: September 19, 1990
    Date of Patent: August 4, 1992
    Assignee: International Business Machines Corporation
    Inventors: John E. Cronin, Carter W. Kaanta, Michael A. Leach
  • Patent number: 5130497
    Abstract: An insulating spacer comprises a plurality of unit spacers each of which has a hollow portion. The unit spacers are disposed between two members, such as electrodes, so that side walls of peripheral portions of the unit spacers are not aligned on a plane between the two members. There is no possibility that the space between the two members may be filled, for the most part, with insulating solid material; and a narrow gap may be present at the remaining minor part of the space. Therefore, there is no possibility of a local concentration of electric field between the two members.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: July 14, 1992
    Assignee: Mitsubishi Denki K.K.
    Inventor: Toru Yoshikawa
  • Patent number: 5130686
    Abstract: The coil of a solenoid has a pair of cylindrical, superconductive bands ped coaxially about its exterior. The bands are mounted for movement axially along the outer surface of the coil. The bands are used to shape and redirect the flux lines of the solenoid. The bands are placed near the midpoint of the coil. Sufficient current is applied to the coil to immerse the bands in a field greater than the critical field Hc, thereby switching off the superconductive state of the bands and causing flux lines from the coil to intersect the bands. Next, the field is reduced below the critical field Hc, switching on the superconductive state of the bands. The bands are then moved to the ends of the coil, reshaping the field of the solenoid into a more uniform configuration as they move. In an alternate embodiment, the superconductive state of the bands is switched on by lowering their temperature below the critical temperature while the coil is producing its desired or working field.
    Type: Grant
    Filed: February 5, 1991
    Date of Patent: July 14, 1992
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Herbert A. Leupold
  • Patent number: 5130499
    Abstract: By folding two or more mutually connected strips of flexible printed circuit film material, an elongated flexible printed circuit comprising a main strip and one or more side strips being produced, with a minimum waste of film material. For holding the flexible circuit in its folded state and controlling the bending radii of the strips, a holding clip which locks automatically on the film material being provided.
    Type: Grant
    Filed: April 25, 1991
    Date of Patent: July 14, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Frank J. J. Dijkshoorn
  • Patent number: 5130498
    Abstract: A ceramic substrate is used for an electric or electronic circuit comprises a ceramic plate formed of a substance mainly composed of aluminum nitride, and conductive islands formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic plate for providing conductive paths to circuit components connected thereto, wherein the aluminum islands decrease the total weight of the ceramic substrate and enhance a resistance against repetition of a thermal stress.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: July 14, 1992
    Assignee: Mitsubishi Metal Corporation
    Inventors: Hideaki Yoshida, Yoshirou Kuromitsu, Makoto Toriumi, Michio Yuzawa
  • Patent number: 5128644
    Abstract: An assembly of annularly shaped, permanent magnets (1) and durable, magnetic conducting metal, annularly shaped, pole pieces (2) stacked on a non-magnetic, durable metal, center rod (3), held by threaded, durable, magnetic conducting metal, rounded, end plates (4) and thread locking adhesive. The magnets 1 being unmagnetized before assembly. Then being magnetized as a whole assembly.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: July 7, 1992
    Inventor: John E. Nellessen
  • Patent number: 5117212
    Abstract: An electromagnet for a charged-particle apparatus. The electromagnet of the first form of this invention may consist of a deflecting electromagnet comprising an iron core equipped with clamping plates having cavities through which a vacuum chamber runs. Provided in these cavities are small-sized coils using the iron core as the magnetic path and adapted to adjust the orbit for charged particles. The electromagnet of the second form of this invention consists of a deflecting electromagnet equipped with a banana-shaped principal coil whose radius of curvature is larger in its end sections than in its middle section, thereby leveling the magnetic-field distribution on the equilibrium orbit. In the electromagnet of the third form of this invention, the thickness of the iron core, surrounding the principal coil, is different at different positions along the equilibrium orbit for charged particles, thereby making it possible to obtain some desired magnetic-field distribution.
    Type: Grant
    Filed: January 11, 1990
    Date of Patent: May 26, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shunji Yamamoto, Tadatoshi Yamada
  • Patent number: 5115219
    Abstract: A superconducting magnetic energy storage apparatus comprising a cylindrical superconducting coil; a cylindrical coil containment vessel enclosing the coil and adapted to hold a liquid, such as liquefied helium; and a cylindrical vacuum vessel enclosing the coil containment vessel and located in a restraining structure having inner and outer circumferential walls and a floor; the apparatus being provided with horizontal compression members between (1) the coil and the coil containment vessel and (2) between the coil containment vessel and the vacuum vessel, compression bearing members between the vacuum vessel and the restraining structure inner and outer walls, vertical support members (1) between the coil bottom and the coil containment vessel bottom and (2) between the coil containment vessel bottom and the vacuum vessel bottom, and external supports between the vacuum vessel bottom and the restraining structure floor, whereby the loads developed by thermal and magnetic energy changes in the apparatus can
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: May 19, 1992
    Assignee: Chicago Bridge and Iron Technical Services
    Inventors: Gregory J. Withers, Stephen W. Meier, Robert J. Walter, Michael D. Child, Douglas W. DeGraaf
  • Patent number: 5113163
    Abstract: A cylindrical superconducting solenoid adapted to receive cylindrical inserts within the bore thereof. The inserts are selected having a permeability or radial thickness which will absorb or conduct a portion of the magnetic field within the interior bore of the cylindrical solenoid. Thereby, the interior magnetic field can be adjusted to any predetermined value without changing the total amount of trapped flux within the superconducting solenoid.
    Type: Grant
    Filed: November 13, 1990
    Date of Patent: May 12, 1992
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Herbert A. Leupold
  • Patent number: 5113165
    Abstract: A superconductive magnet having at least one superconductive coil is provided. A thermal radiation shield is situated inside a vacuum vessel and the thermal radiation shield encloses the superconductive coil. A thermal diode is provided for thermally linking the superconductive coil and the thermal radiation shield when the thermal radiation shield is colder than the superconductive coil.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: May 12, 1992
    Assignee: General Electric Company
    Inventor: Robert A. Ackermann
  • Patent number: 5107078
    Abstract: An electric connection of disconnection element is described as well as the corresponding connection or disconnection method and integrated circuits using such elements.The disconnection element consists of a disk or ingot joining two conductive tracks whose extremities are laid on wettable surfaces. Melting of the disk frees surface tension forces which separate its material into two balls centered on the wettable surfaces.The connection element is formed of two separate disks and, from the wettable surface pads, these disks are disposed opposite each other so that their material, once melted, unites to form a single droplet.A process is also disclosed for using these connection and disconnection elements for repairing defective integrated circuits.
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: April 21, 1992
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Francois Marion, Michel Ravetto
  • Patent number: 5107077
    Abstract: A waterproof electrical splice enclosure for receiving a single electrical connector splicing the ends of a plurality of insulated electrical conductors extending out of the connector in the same same direction and parallel to one another. The enclosure comprises an elongated hollow tube having one open end and one closed end having a cross-section slightly larger than the connector. A connector retainer is provided to retain the electrical connector adjacent the closed end of the tube with the insulated electrical conductors extending out of the open end of the tube, and the tube contains a waterproofing fluid which will not flow out of the tube but which will flow around the connector as it is slid into the tube to provide a waterproof seal around the connector and around and between the insulated conductors. A cap is connected to the tube at its open end by a hinge and has a bulbous protrusion to fit into and close the open end of the tube, and latch retains the cap in the closed position.
    Type: Grant
    Filed: April 5, 1989
    Date of Patent: April 21, 1992
    Assignee: Minnesota Mining and Manufacturing Co.
    Inventors: Albert H. Fox, Ronald C. Johansson
  • Patent number: 5105177
    Abstract: In a superconducting magnet apparatus including one winding of coiled superconductor wire, another winding of coiled superconductor wire, a cooling device for supplying coolant to cooling vessels which contain the respective windings therein and a non-magnetic partition wall interposed between the cooling vessels containing the respective windings to airtightly separate them, with these windings being located at relative positions enabling mutual inductance therebetween, even if quenching occurs in the superconducting magnet apparatus. It is designed to not lose the magnetic repulsive force such that equipment traveling at high speed can be safely transferred at least to the nearest station. In addition, electromagnetic levitation traveling equipment on which the above-described apparatus is installed and a control method therefore is also described.
    Type: Grant
    Filed: December 4, 1989
    Date of Patent: April 14, 1992
    Assignees: Hitachi, Ltd., Hitachi Engineerings and Services Co I, Ltd.
    Inventors: Naofumi Tada, Fumio Iida, Teruhiro Takizawa, Kazuo Kuroishi
  • Patent number: 5093543
    Abstract: A motor phase insulation device having folding legs that can be easily manufactured with minimum material wasted. The legs are formed from slits in the device material.
    Type: Grant
    Filed: October 26, 1990
    Date of Patent: March 3, 1992
    Assignee: Electrical Insulation Suppliers, Inc.
    Inventors: William T. Patton, Will T. Patton, Jr.