Patents Examined by Trinidad Korka
  • Patent number: 5077451
    Abstract: A printed circuit board contains a plurality of component contacts for receipt of electronic components and a plurality of electrically conductive traces, each trace being electrically connected to a corresponding one of the component contacts. A corresponding plurality of interconnect holes is formed on a selected portion of the printed circuit board with each interconnect hole contacting uniquely a corresponding one of the plurality of electrically conductive traces. A multiplicity of custom conductive traces are then formed in the interconnect region such that each of the multiplicity of conductive traces interconnects at least one of the interconnect holes to at least one other interconnect hole thereby to form an electrically conductive path between each of the interconnect holes interconnected by the custom conductive traces. A user is thus able to achieve a desired electrical function from the electronic components to be connected to the printed circuit board.
    Type: Grant
    Filed: January 17, 1991
    Date of Patent: December 31, 1991
    Assignee: Aptix Corporation
    Inventor: Amr M. Mohsen
  • Patent number: 5077450
    Abstract: A high-voltage test terminal for interconnection between high-voltage power lines and the bushing stud member of a transformer or reactor. An insulator component of the terminal is placed in compression rather than tension, the terminal having a substantially reduced moment arm to withstand angular forces which are created upon interconnection between the power lines and the stud member. Metallic end fittings for the insulator serve to maintain the insulator in permanent compression and provide ready disconnection of the bus bars of the terminal for determination of induced electrical currents such as by Doble testing. The insulator is mounted horizontally between the end fittings and between the power lines in substantially parallel and horizontal alignment therewith, and eliminates the torsional stresses which have been generated previously with upright post-type insulators.
    Type: Grant
    Filed: October 15, 1990
    Date of Patent: December 31, 1991
    Inventor: Masoud Rafiee
  • Patent number: 5075662
    Abstract: The fabrication of a flux source using magnetically rigid material is dissed for deriving a magnetic field of uniform density and enhanced magnitude within an enclosed annular cavity thereof. In the preferred embodiments, segments of the magnetically rigid material are configured and arranged in accordance with the desired direction of the magnetic field relative to the annular axis of the cavity.
    Type: Grant
    Filed: November 14, 1989
    Date of Patent: December 24, 1991
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Herbert A. Leupold, Ernest Potenziani, II
  • Patent number: 5072074
    Abstract: This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material. This invention comprises, a sheet of flexible over-layer material extending over at least the entirety of all the flexible portions; a flexible adhesive material adhesively attaching the sheet of flexible over-layer material to the entirety of all the flexible portions; sheets of a rigid substrate material extending over the entirety of all the rigid portions; and, a rigid adhesive material adhesively attaching the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the sheets of rigid substrate to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge.
    Type: Grant
    Filed: July 24, 1990
    Date of Patent: December 10, 1991
    Assignee: Interflex Corporation
    Inventors: Arthur J. DeMaso, Thomas H. Stearns
  • Patent number: 5064970
    Abstract: A wiring harness is enshrouded in a tubular length of stretchable material. The shroud holds pigtails, takeouts, connectors, harness hold-downs and the like which otherwise extend from the harness against a trunk of the harness so that it can be inserted through an opening in a firewall or other structural member of a motor vehicle or other product for installation of the harness. Once inserted through the opening, the shroud is removed, preferably by means of a closure device which initially maintains the shroud as a tubular structure but can be removed to open at least a portion of the tubular structure to facilitate shroud removal. To facilitate installation of the shroud onto a wiring harness, the shroud is initially stretched over a tubular applicator to expand the shroud.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: November 12, 1991
    Assignee: Ford Motor Company
    Inventors: Kelvin J. Bennett, Mark E. DeMott
  • Patent number: 5065186
    Abstract: An special arrangement of the magnetic components of a horizontal sweep output circuit to reduce the net flux density and magnetic induction that are present at the exterior of a video display. The special arrangement meets the new, lower VLF electro-magnetic emission standards of some of the European countries, such as Sweden. The method used for obtaining this special arrangement of horizontal sweep output components is also disclosed.
    Type: Grant
    Filed: May 3, 1990
    Date of Patent: November 12, 1991
    Assignee: NCR Corporation
    Inventor: Anthony Valenti
  • Patent number: 5064971
    Abstract: An improved fastening device. The fastener portion itself usually comprises a vise rotatably mounted on a base for connection to a support. In a first preferred embodiment the vise is mounted on a cylindrical stem rotatably mounted within a housing of the base having a cylindrical bore, the axis of rotation of the stem thus being the axis of rotation of the vise. In a second preferred embodiment, the base provides a cylindrical stem and the vise provides a housing with a cylindrical bore in which the stem is rotatably mounted. The vise has a pair of jaws between which a cable is fastened such that the neutral axis of the fastened cable is substantially perpendicular to the rotational axis of the vise.
    Type: Grant
    Filed: October 13, 1989
    Date of Patent: November 12, 1991
    Inventor: Anatol L. Bogdanow
  • Patent number: 5061190
    Abstract: A printed circuit card and card edge connector for use with a 32-bit bus include respectively a pattern of conductive fingers and pins in the connector that render the card electrically compatible with existing 8-bit STD connectors and that render the card edge connector electrically compatible with existing 8-bit STD cards. the latter compatibility makes it possible to use in 32-bit systems any of the more than a thousand existing 8-bit circuits without modification; while the former compatibility makes available to 8-bit systems an easy path to growth and the expanded computational power of a 32-bit system.
    Type: Grant
    Filed: August 14, 1990
    Date of Patent: October 29, 1991
    Assignee: Ziatech Corporation
    Inventors: James A. Medeiors, R. A. Beverly, Ty F. Safreno
  • Patent number: 5061825
    Abstract: A printed cirucit board design capable of accepting both first and second versions of an IC device. First and second IC devices (10, 20) have pins disposed along respective first and second rectangular peripheries (12a-b and 15a-b; 22a-b and 23a-b). Each pin on the first IC devices has a functional counterpart pin on the second IC device. The board configuration contains pads in first and second arrays (32a-b and 35a-b; 32a, 32c, 33a-b) that correspond to the pins on the first and second IC devices. At least some of the pads (32b) of the first array do not physically conicide with pads in the second array and are located within the rectangle defined by the second array. Each non-overlapping pad in the first array is connected by a circuit board trace (40) to a respective pad in the second array such that each circuit board trace joins two pads corresponding to counterpart pins.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: October 29, 1991
    Assignee: Chips and Technologies, Inc.
    Inventor: Robert W. Catlin
  • Patent number: 5055973
    Abstract: A printed circuit board contains a plurality of component contacts for receipt of electronic components and a plurality of electrically conductive traces, each trace being electrically connected to a corresponding one of the component contacts. A corresponding plurality of interconnect holes is formed on a selected portion of the printed circuit board with each interconnect hole contacting uniquely a corresponding one of the plurality of electrically conductive traces. A multiplicity of custom conductive traces are then formed in an interconnect region such that each of the multiplicity of conductive traces interconnects at least one of the interconnect holes to at least one other interconnect hole thereby to form an electrically conductive path between each of the interconnect holes interconnected by the custom conductive traces.
    Type: Grant
    Filed: January 17, 1990
    Date of Patent: October 8, 1991
    Assignee: Aptix Corporation
    Inventor: Amr M. Mohsen
  • Patent number: 5049704
    Abstract: An electrical conductor element in the form of a flexible or rigid sheet is provided for detecting attempts to break into a space where valuables or money are being stored, such as a strongroom or the coin container of a slot machine. The base material of the element is in the form of a woven or non-woven material or of plastic sheeting, and the electrical conductor is in the form of wire such as enameled copper wire for electrical connection with an alarm system. The conductor is secured in place by stitching, that is to say the wire is either formed into penetrating stitches by being fed from the needle or shuttle of a sewing machine or it is fed from a stationary part of the sewing machine so as to be fixed in place by stitches or conventional textile yarn or thread. When the conductor is interrupted by drilling, sawing or the like the alarm system is activated.
    Type: Grant
    Filed: April 11, 1990
    Date of Patent: September 17, 1991
    Inventor: Thomas Matouschek
  • Patent number: 5045642
    Abstract: The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.
    Type: Grant
    Filed: April 17, 1990
    Date of Patent: September 3, 1991
    Assignees: Satosen, Co., Ltd., Hewlett-Packard Company
    Inventors: Hideo Ohta, Kenji Miyamoto, Wilson O. W. San, Alfred M. Martini
  • Patent number: 5043526
    Abstract: A printed circuit board includes a first electric conductive layer formed on an insulating base plate to form signal patterns and a ground pattern. An insulation layer covering the signal patterns and a second electric conductive layer connected to the ground pattern are sequentially formed on the plate. A large area ground land is formed in the vicinity of a ground terminal of a digital IC by the first electric conductive layer to be connected to the ground terminal, which is directly surface-mounted to the second electric conductive layer so that a ground impedance of the ground terminal can be reduced.
    Type: Grant
    Filed: February 22, 1990
    Date of Patent: August 27, 1991
    Assignee: Nintendo Company Ltd.
    Inventors: Katsuya Nakagawa, Masakazu Nagano, Jun Higashiyama
  • Patent number: 5041699
    Abstract: The present invention discloses a laminated thermally conductive substrate for supporting microwave power amplifiers, having unique layering thicknesses with materials having similar thermal expansion characteristics, whereby the thermally conductive substrate experiences limited deflection during temperature cycling.
    Type: Grant
    Filed: May 29, 1990
    Date of Patent: August 20, 1991
    Assignee: Motorola, Inc.
    Inventor: John L. Soliday
  • Patent number: 5041700
    Abstract: A circuit board includes an aluminum nitride substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al.sub.u Ml.sub.v M2.sub.x O.sub.y N.sub.z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 3 to 50 atm %, v represents 3 to 78 atm %, x represents 0 to 50 atm %, y represents 0.005 to 25 atm %, and z represents 5 to 70 atm %), a bonding layer consisting essentially of a metal represented by M1, a barrier layer consisting essentially of a metal represented by M2, and a conductor layer consisting essentially of Au are stacked in the order named.
    Type: Grant
    Filed: September 27, 1990
    Date of Patent: August 20, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase
  • Patent number: 5036305
    Abstract: A spacer bar, or system of spacer bars, interposed between coil layers of a coil structure. The spacer bar comprises a block of electrical insulating material adapted to be arranged between adjacent layers of a coil. The spacer bar may comprise several spacer bar sections segmented axially and provided with flexible joints (e.g., Belleville washers) between sections to permit each section to move with the adjacent coil layers (the coil layers between which the section is interposed). The sections of the spacer bar are held together by passing a rod through holes provided through each section. Between each pair of spacer sections, a Belleville washer is installed to assure that under continued cycling (e.g., expansion and contraction of the coil), the spacer sections return to their original location. To maintain an adequate creep path at the ends of the blocks or sections, notches can be cut into a face of each block or section.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: July 30, 1991
    Assignee: Westinghouse Electric Corp.
    Inventors: Jeffery T. Dederer, Donald T. Hackworth
  • Patent number: 5034569
    Abstract: A multilayer interconnection circuit board includes insulating layers and conductor wiring layers which are alternately laminated. The uppermost conductor wiring layer is electrically connected to an intermediate conductor wiring layer to a predetermined stage by irradiating laser beams in the direction of lamination of layers so that the conductor wiring layer or layers located above the intermediate conductor wiring layer are successively molten by the laser beams. The surface irradiated by the laser beams of the conductor wiring layer at the predetermined stage is treated to reflect laser energy, and the surface of the conductor wiring layer or layers which are molten by the laser beams is treated so as to be susceptive to absorb the laser beams.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: July 23, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Eishi Gofuku, Mitsuyuki Tanaka, Yoshiyuki Morihiro, Hayato Takasago
  • Patent number: 5034715
    Abstract: A magnetic structure fabricated of magnetically rigid materials combines a adial magnetic field source with an axial magnetic field source to produce a conical field source. The radial magnetic field source typically comprises a substantially annular enclosed cavity with an internal magnetic field oriented perpendicular to the annular axis of the cavity. The axial magnetic field source most likely comprises a substantially cylindrical enclosed cavity with an internal magnetic field oriented parallel to the cylindrical axis of the cavity.
    Type: Grant
    Filed: November 14, 1989
    Date of Patent: July 23, 1991
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Herbert A. Leupold, Ernest Potenziani, II
  • Patent number: 5030800
    Abstract: A printed wiring board for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion including a possible plated through hole, a printed wiring circuit provided on one or both surface of the insulating sheet, an insulating layer provided on a part of the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and a part of the printed wiring circuit, a solder resist provided on the electromagnetic wave shielding layer and a sealing member of heat-resistant material or weather-resistant material which is filled or packed in the connecting through hole portion.
    Type: Grant
    Filed: January 26, 1990
    Date of Patent: July 9, 1991
    Assignee: Nippon CMK Corp.
    Inventors: Shin Kawakami, Satoshi Haruyama, Hirotaka Okonogi
  • Patent number: 5028743
    Abstract: A double sided or multi-layered printed circuit board comprises an insulating substrate having conductors on opposed major surfaces thereof which are electrically connected together via a through-hole. A sealing member composed of conductive resin fills the through-hole. An insulating layer covers the conductors and sealing member, and an electronic wave-shielding layer covers the insulating layer.
    Type: Grant
    Filed: January 26, 1990
    Date of Patent: July 2, 1991
    Assignee: Nippon CMK Corp.
    Inventors: Shin Kawakami, Satoshi Haruyama, Hirotaka Okonogi