Abstract: A mounting apparatus for mounting two or more types of data storage devices that each defines a locking hole in a sidewall thereof includes a bracket for holding the data storage devices, a fixing member, and a locking member. The bracket includes a first side wall. The first side wall defines a locating hole therein. The locating hole has at least two locating positions. The fixing member is pivotably mounted to the first side wall of the bracket. The locking member is selectively mounted to at least two positions of the fixing member. The locking member includes a locking portion extending therefrom, for selectively being inserted through the at least two locating positions of the locating hole of the bracket to engage in the locking hole of a corresponding type of data storage device.

Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.

Abstract: Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

Abstract: A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 ?m and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less (2) D23?5 (3) D150?2.5 (4) (D?65/D150)?3.0 (5) H23?140 (6) (H?65/H150)?2.3.

Abstract: The present invention discloses a fastening mechanism, by which an expansion card can be mounted in the housing of an electronic apparatus. The fastening mechanism includes: a base disposed in the housing; a retention member having one side thereof pivotally connected to one side of the base, and the side facing the rear of the housing is provided with a slot for an expansion card to insert therein; and a push handle disposed between the base and the retention member for allowing the retention member to be elastically pushed towards the expansion card to thereby hold the end portion of the expansion card in the slot of the retention member.

Abstract: In an electronic device printed circuit boards in a housing are kept parallel to each other by guiding means. One or a plurality of these printed circuit boards is connected with a housing part each on their corresponding edge by means of electronic plug-in connections. To secure the electronic plug-in connections, spring means are provided which exert pressure on opposite edges of the printed circuit boards in the direction of the plug-in connection.

Abstract: The present invention provides a display module having: a display board on which a display element displaying an image is mounted; and a chassis on which the display board is mounted and which is placed on a circuit board. The chassis has a support board and a frame plate. The support board includes: a support section which supports a portion of the display board except for a corner section of the display board; and a depressed section which continuously expands from the support section and is formed such that a surface on a side supporting the display board is lower than the support section. The frame plate is placed on the circuit board while supporting the support board at a predetermined height with respect to the circuit board.

Abstract: A computer enclosure includes a base (10), a cover (30), and a connecting device (40). The connecting device pivotably connects the cover to the base. The connecting device includes a first lever (42), a second lever (44) and a supporting arm (46). The second lever can be stopped by the first lever, for positioning the cover when the cover is in an open position.

Abstract: A mounting assembly includes a chassis having a wall, a fastener pivotally attached to the wall, and a cover detachably attached to the chassis. The wall forms a support portion for supporting a slot cover of an expansion card thereon. The fastener includes a pressing portion for pressing the slot cover against the support portion when the fastener is pivoted to a locked position. The cover is engagable with the fastener to secure the fastener in the locked position.

Abstract: A power supply comprises a chassis, a plurality of alternating current (AC) power receptacles formed into the chassis, and power supply circuit contained within the chassis and selectively coupled to ones of the plurality of AC power receptacles.

Abstract: A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of signals can be transmitted through the linear slot at one time. The circuit substrate and the method of manufacturing the slot-shaped plated through hole thereon can increase the level of integration of the circuit, decrease the average routing length of the circuit, boost the production efficiency and lower the production cost.

Abstract: A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall of a through hole in the core layer of a circuit substrate. The conductive wall has a semi-circular or a C-shaped structure. Therefore, when a signal passes the conductive via and the via land of the circuit substrate through the conductive wall in the interior of the via, because of a more continuous impedance between the via land and the conductive wall, signal reflection due to impedance mismatch along the signal transmission pathway can be reduced to enhance signal transmission quality.

Abstract: An electric power distribution and control apparatus has a stack of conductive plates each having a plurality of spaced contact pads and conductive traces connecting the contact pads to others of the pads. At least one of the plates has contact terminals for connection to electrical components for supply of electrical current. An array of contact pins pass through holes in the plates at a respective one of the contact pads such that the array of pins provides connection between selected contact pads of different selected conductive plates. An electronic system for connection to a communication bus is added to the above known system by providing a main circuit board having the electronic components thereon, a mapping circuit board having a plurality of contact pads thereon arranged for connection to respective ones of the array of pins and a header having a male pin array and a female socket array connecting the main printed circuit board and the mapping circuit board.

Abstract: A microwave filter has resonator comprised of a cylindrical structure having conductive walls filled with a dielectric material where the cylindrical structure is recessed inside a multi-layered substrate. First and second conductive coupling arms are disposed on a top layer of the substrate for coupling signals to the cylindrical structure. The conductive coupling arms are separated by a dielectric layer. The first and second conductive coupling arms extend away from the center of the cylindrical structure to form a microstrip line. The cylindrical structure further comprises a bottom portion having a solid conductive bottom plate perpendicular to the axis of the cylinder and a bottom conductive ground layer separated from the conductive bottom plate by a second dielectric layer.

Abstract: Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: An interface card coupling structure includes a bracing member fastened to a case that has a retaining plate extending from an edge with a latch hole formed thereon, and a coupling member pivotally coupled on the retaining plate. The coupling member has a latch pin on one end facing the retaining plate to engage with the latch hole and anchor the coupling member on the retaining plate. The coupling member presses an interface card to form secure coupling. The coupling member may be made by injection forming. The structural elements of the bracing member of the interface card coupling structure are thus fewer. Hence the cost may be reduced and production speed increased.

Abstract: A support system comprising a chassis having an interchangeable design and layout is disclosed. The support system further includes a front panel, a rear panel, an indicator segment, and an outlet segment. The indicator and outlet segments are detachably mounted to the chassis such that a user can convert the chassis to a front or a rear access position. It is noted that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to ascertain quickly the subject matter of the technical disclosure and is not be used to interpret or limit the scope or meaning of the claims.

Abstract: A smart card contains a carrier body for receiving at least one system component, which has (in each case) a plurality of electrical components, and which unites the electrical functions for the operation of the smart card. The system component terminates approximately evenly with the top side of the card body of the smart card. At least one of the electrical components is accessible from the top side of the smart card.

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract: A substrate has an electrical wiring pattern formed thereon, one or a plurality of electrical parts provided thereon, a first contacting part and a second contacting part provided thereon and electrically connected to the electronic parts, and one or a plurality of electrical connecting bodies. The electrical connecting bodies are different from the electrical wiring pattern, and electrically connect the first contacting part and the second contacting part.