Abstract: A modular electronic assembly includes a chassis, a housing supported by the chassis having an access opening through a first wall of the housing, a removable access panel or releasable member at least partially covering the opening, and a midplane supported by the chassis and slidably removable from the chassis through the opening when the housing is mounted on the chassis. A method of constructing a modular electronic assembly is also disclosed.

Abstract: Methods and apparatus for preventing the accidental or premature decoupling of a device from a support chassis. The apparatus includes a moveable securing member. The moveable securing member is configured to be moved from a first position to a second position, wherein one of the first and second positions permits removal of the device from the support chassis, while the other position prevents removal of the device. An actuator coupled to the moveable securing member is responsive to an authorization command, so that a user or a controller can cause the securing member to be moved. The controller can be configured to operate in response to either or both of a user input or an error detection signal corresponding to the device.

Abstract: In an enclosure structure of an electronic apparatus having a concave portion made up of a bottom wall and a surrounding wall, the concave portion being used for storing a functional part, an outer wall opposite to the surrounding wall of the concave portion, and a connecting wall connecting one end portion of the outer wall and one end portion of the concave portion, that is, in the integrally formed enclosure structure, a rib is provided over the surrounding wall of the concave portion, the outer wall, and the connecting wall, and a cut portion is provided at the other end portion opposite to one end portion connected to the connecting wall.

Abstract: A recess for fully receiving an electronic component and a window opened from the bottom of the recess to the bottom surface of a metal substrate are formed in the metal substrate. A wiring board is bonded to the underside of the metal substrate, and the electronic component is fixed to the bottom of the recess. Input and output terminals of the electronic component are connected to electrode pads of the wiring board exposed within the window using wire bonding. A metal lid is bonded to the top surface of the metal substrate to close the opening of the recess. Electromagnetic waves generated by the electronic component are confined to the electronic device because the electronic device is surrounded by the metal substrate, the metal lid, and a ground electrode disposed on the wiring board. Heat dissipation performance is assured because the electronic component is connected to the metal substrate.

Abstract: Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid transporting apparatus. The liquid transporting apparatus may provide liquid communication between the sealed electronics module and an external liquid cooling module. The sealed electronics module may also include an apparatus for the cooling electronics components in the electronics module using liquid that is transported between the sealed electronics module and the external liquid cooling module.

Abstract: A surface mounted power supply circuit apparatus, including a circuit substrate, circuit constituting parts mounted on the circuit substrate, and a sealing member provided on the circuit substrate for covering the circuit constituting parts, at least one portion of the circuit constituting parts being configured to be contained in a containing portion formed in the circuit substrate.

Abstract: A printed circuit board and a routing scenario thereof are disclosed. The printed circuit board includes three dielectric layers, two signal layers and several differential pairs. Some differential pairs are disposed in one signal layer, while some differential pairs are interleavingly disposed in the adjacent other signal layer. The differential pairs in one signal layer carries signals that flows to one direction, while the differential pairs in the adjacent signal layer carries signals that flows to an opposite direction. Under such a routing scenario, the crosstalk between differential pairs in adjacent signal layers may be reduced.

Abstract: A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.

Abstract: A method for forming a medium is provided. In accordance with the method a base layer is provided. A material layer is formed on the base layer. The material layer has void. A transponder having a memory is positioned in the void. A medium is also provided. The medium has a base layer and a material layer having a void. A transponder having a memory is positioned in the void.

Abstract: A power supply module removably disposed within an automated data storage and retrieval system. An automated data storage and retrieval system which includes one or more power supply modules removably disposed therein. An accessor movably disposed with an automated data storage and retrieval system comprising a gripper mechanism which can be releaseably attached to a power supply module. A method to supply power to an automated data storage and retrieval system. A method to monitor the operation of a power supply module removably disposed within an automated data storage and retrieval system.

Abstract: A card connector includes a card-mounting seat formed with an insertion groove that is defined by opposite end walls, opposite side walls and a bottom wall. Each end wall has two opposite upright extension wall portions defining a receiving groove therebetween. Two anchoring blocks are connected pivotally and respectively to the extension wall portions of the end walls of the card-mounting seat. When an insertion side of an electronic card is inserted into the insertion groove in the card-mounting seat, conductive members, which are mounted in the card-mounting seat, contact electrically and respectively conductive terminals of the electronic card, and a protrusion of one of the anchoring blocks engages a notch in a lateral side of the electronic card while the electronic card is anchored between the anchoring blocks.

Abstract: An extended memory card capable of coupling to a reduced size memory card and having an electrical connection to a card reader is disclosed. The extended memory card comprises a first flash memory and a first client controller, where the card reader accesses to the first flash memory by controlling the operation of the first client controller. The reduced size memory card further comprises a second flash memory and a second client controller, where a host controller accesses to the second flash memory by controlling the operation of the second client controller. The extended memory card coupled to the reduced size memory card has the same size as an MMC card. The reduced size memory card has the same size as the RS-MMC card.

Abstract: The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radio frequency (RF) management system.

Abstract: A circuit board has, in a first signal layer, a signal conductor having a relatively small width and a contact pad having a relatively large width. The relatively large width of the contact pad combined with the relatively narrow signal conductor creates an impedance mismatch between the contact pad and the signal conductor. The circuit board has, in a second signal layer, a ground plane separated from the first signal layer by a nonconductive layer. The circuit board defines an opening in the second signal layer underneath the contact pad. The presence of the ground plane underneath the contact pad typically affects the impedance of the contact pad. The opening in the second signal layer removes a portion the ground plane relative to the contact pad and, therefore, reduces the impedance mismatch between the contact pad and the signal conductor.

Abstract: An adapter assembly including a base for supporting a SINCGARS radio and a radio frequency power amplifier, a first connector for electrically connecting with the SINCGARS radio and a second connector for electrically connecting with the power amplifier, a first power supply electrically connected with the first connector and a second power supply and a third power supply, the second power supply and the third power supply each being electrically connected with the second connector.

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract: A power supply keying method for use with an electrical apparatus includes defining a plurality of power supply classes; associating with the plurality of power supply classes a plurality of power supplies, each of the plurality of power supplies including a power supply housing having a unique keying arrangement corresponding to one power supply class of the plurality of power supply classes; and providing in the electrical apparatus a power supply receptacle for receiving at least one power supply of the plurality of power supplies, the unique keying arrangement of the power supply housing in conjunction with the power supply receptacle permitting reception of a particular power supply of the plurality of power supplies into the power supply receptacle only if the power supply class associated with the particular power supply has power supply electrical characteristics that satisfy electrical power requirements of the electrical apparatus.

Abstract: A circuit board is mounted within a housing in a resilient manner to minimize the introduction of stresses warping the circuit board as the housing is warped or as a circuit board warped during its manufacture is mounted within the housing. The housing includes spaced apart mounting pads between which screw inserts extend as rigid columns through mounting holes within the circuit board. The surfaces of the mounting holes slide on the surfaces of the screw inserts, with the circuit board being resiliently held by resilient pads between its surfaces and the mounting pads.

Abstract: A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the first support substrate and the second support substrate and a link area that connects a solder shunting area with the first solder pad, wherein the link area is narrower than the first solder pad and the solder shunting area.