Abstract: A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.

Abstract: According to one embodiment, a wiring structure includes a substrate, a first conductor, second conductors, a first trace, second traces, heat-generating elements, and a first protruding conductor. The second conductors are spaced apart from the first conductor in a second direction crossing a first direction and are mutually juxtaposed with spacing in the first direction. The heat-generating elements are mutually juxtaposed in the first direction and connected to the respective second conductors and the first conductor. The first protruding conductor protrudes from either of the first conductor and one of the second conductors and is connected to a first one of the heat-generating elements. The first protruding conductor is at least partly located, in the first direction, between a center of the first one of the heat-Generating elements and a center of a second one of the heat-generating elements adjacent to the first one.

Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.

Abstract: A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

Abstract: According to an exemplary embodiment, a display device comprises: a display panel configured to include a plurality of pixels; a printed circuit board connected to the display panel; a connector mounted in the printed circuit board; and a cable fastened to the connector, wherein the connector comprises: a first connector mounted in the printed circuit board to include a first voltage pad, a second voltage pad, and a plurality of signal pads disposed between the first voltage pad and the second voltage pad; a hinge engaged with the first connector; and a second connector for rotation with respect to a hinge shaft, the second connector includes a third voltage pad and a fourth voltage pad, wherein the cable is inserted between the first connector and the second connector.

Abstract: A semiconductor package is provided and includes: an insulative layer having opposing first and second surfaces; a wiring layer embedded in the insulative layer and having a first side that is exposed from the first surface of the insulative layer and a second side opposing the first side and attached to the second surface of the insulative layer; at least one electronic component mounted on the second side of the wiring layer and electrically connected to the wiring layer; and an encapsulating layer formed on the second side of the wiring layer and the second surface of the insulative layer and encapsulating the electronic component. Therefore, the single wiring layer is allowed to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path.

Abstract: Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector module and the second connector module, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

Abstract: Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

Abstract: A driving circuit board includes: a circuit connection board having a first surface and a second surface that is opposite to the first surface in a thickness direction of the circuit connection board; at least one driver integrated circuit (IC) disposed on the first surface of the circuit connection board; and a printed circuit board assembly (PCBA) bonded to the second surface of the circuit connection board.

Abstract: The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.

Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

Abstract: A shielding member is provided. The shielding member includes a shielding layer having flexibility, and an insulating layer stacked on the shielding layer. The shielding layer includes a nanofiber layer including nanofibers plated to have electrical conductivity and coated with an adhesive material, and conductive particles disposed in the nanofiber layer.

Abstract: Disclosed is a circuit board assembly, a display device, and a method for manufacturing the same. The display device includes a main board, a logic board, a X-coordinate circuit board and a display panel. The main board and the logic board forms a circuit board assembly with a stacked structure, and the logic board is connected to the X-coordinate circuit board by a flexible flat cable line.

Abstract: A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.

Abstract: A matrix of battery cell modules includes a flexible printed circuit board assembly (PCBA) for a conformal wearable battery (CWB) with a plurality of attachment sections for each of a plurality of battery cells that are arranged in a grid-like pattern on a same side of the flexible PCBA. Each battery cell may be joined with a flexible PCB via a welding process. The flexible PCBA is configured to fold along a bend axis so that the flexible PCBA is folded approximately in half. When affixed to the flexible PCBA, the plurality of battery cell modules and a circuitry module form a grid of physical components. When folded, the flexible PCBA forms a three-dimensional grid of physical components comprising at least the battery cell modules.

Abstract: A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

Abstract: A printed circuit board with a lateral metallization groove and a processing method thereof, relates to the field of printed circuit boards with lateral metallization grooves, processing technologies thereof and batch processing methods. The processing method includes the following steps: step S01, drilling and milling grooves; step S02, performing metallization treatment; step S03, laying an outer layer circuit; step S04, performing pattern plating; step S05, performing first milling grooves; step S06, etching an outer layer; step S07, performing surface treatment after performing solder resist printing and character printing; step S08, forming to mill off connections of a processing side; step S09, performing second milling grooves to form a through groove. The present disclosure can implement: a long side of the printed circuit board can be directly connected with the ground wire rather than independently installing the ground wire; a small space is occupied and conveniently replacement.

Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

Abstract: A display module and an electronic device are provided. The display module includes a substrate, a display part, a driving chip, a flexible circuit, and a buffer part. The substrate includes a soldering portion. The display part is disposed on a light emitting side of the substrate. The driving chip is disposed on a light emitting side of the soldering portion. The flexible circuit board is bent from a first surface of the soldering portion to a second surface of the soldering portion. The buffer part is disposed between the flexible circuit board and the soldering portion.