Abstract: Provided herein may be a semiconductor memory device. The semiconductor memory device may include a memory unit configured to store the write data. The semiconductor memory device may include an interface chip configured to receive a first timing signal and a second timing signal, and configured to detect a locking delay from the first timing signal and generate a third timing signal from the second timing signal generated by delaying the first timing signal using the detected locking delay by at least two periods.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell, a second memory cell, a first word line electrically coupled to the first memory cell, a second word line electrically coupled to the second memory cell, and a control circuit configured to supply voltages to the first word line and the second word line. In a read, the control circuit applies a first voltage to the first word line and a second voltage to the second word line, applies, after applying the first voltage to the first word line and the second voltage to the second word line, a third voltage lower than the first voltage and the second voltage to the second word line, and applies, after applying the third voltage to the second word line, the third voltage to the first word line.

Abstract: A NAND flash memory including a plurality of levels of cells and a plurality of bitlines. Each bitline corresponds to a plurality of program states, the program states include an Erase-state, a highest state and a plurality of middle states, wherein the bitline voltages of the middle states during programming are between the bitline voltage of the Erase-state and the bitline voltage of the highest state during programming, and the bitline voltages of the middle states during programming are different from each other. The bitline program voltages of middle states of a NAND flash memory are controlled, thus a higher initial programming voltage of wordlines can be set without causing over-programming on the middle states of the bitlines. Therefore, program time is saved, and the programming speed is increased to achieve a fast program function.

Abstract: Techniques to utilize a very low power state with a memory subsystem that includes one or more non-volatile memory devices and a volatile memory system. A memory controller is coupled with the one or more non-volatile memory devices and the volatile memory system. The memory controller comprising at least an embedded control agent and memory locations to store state information. The memory controller to selectively enable and disable the one or more non-volatile memory devices. The memory controller transfers the state information to the volatile memory system prior to entering a low power state. Control circuitry is coupled with the memory controller. The control circuitry to selectively enable and disable operation of the memory controller.

Abstract: A memory device includes a local bit line coupled to a plurality of memory cells and a global bit line through first and second selectable parallel paths having first and second impedances, respectively. The first path is active in at least one of a set operation or a forming operation and the second path is active in a reset operation. A select device to select a memory element includes a drain having a first doping level and a source having a second doping level lower than the first doping level, wherein the device is configured to provide a first on impedance or a second on impedance to the resistive memory element in response to a control signal.

Abstract: A semiconductor device includes an array of memory cells, and a reference voltage generation circuit including a first set of reference memory cells coupled to a first bit line, a second set of reference memory cells coupled to a second bit line, a first capacitor having a first terminal coupled to the first bit line, and a second terminal, a second capacitor having a first terminal coupled to the second terminal of the first capacitor at a first node and a second terminal coupled to the second bit line, an amplifier including a first input selectively coupled to the first node and a second input coupled to an output of the amplifier that provides reference voltage used by sense amplifiers, and a third capacitor including a first terminal coupled to the output of the amplifier and a second terminal coupled to a first supply voltage.

Abstract: Various implementations described herein are directed to an integrated circuit with memory circuitry having an array of bitcells that are accessible via multiple bitlines. The integrated circuit may include a write driver coupled to at least one bitline of the multiple bitlines through a column multiplexer. The integrated circuit may include a pass transistor coupled to the write driver and the column multiplexer via a write data line. The integrated circuit may include a charge storage device coupled between the pass transistor and write assist enable circuitry. The integrated circuit may include a transmission gate coupled to a gate of the write driver. The integrated circuit may include a clamp transistor coupled between the gate of write driver and the charge storage device such that the clamp transistor receives a voltage assist signal from the charge storage device at the gate of the write driver.

Abstract: A memory device and associated techniques for optimizing the channel boosting level in an unselected NAND string during a read operation for a selected NAND string. A tracking circuit tracks an indicator of a floating voltage of unselected word lines of a block. For example, this can include tracking a time since a last sensing operation, and determining whether a power on event has occurred without a subsequent sensing operation. In response to a read command, the indicator is used to set parameters in the read operation which can reduce disturbs. This can include setting a duration and/or a magnitude of a select gate voltage pulse during the increase of the voltage of the unselected word lines. The duration and/or a magnitude of the control gate voltage pulse can also be set based on a temperature.

Abstract: A semiconductor memory device may include a memory cell array area, a peripheral area, and an interface area. The memory cell array area may include at least one memory plane. The peripheral area may be formed adjacent to one side of the memory cell array area. The interface area may be formed adjacent to one side of the peripheral area and include a plurality of data input/output pads. The peripheral area may include a data path logic area formed between the memory cell array area and the interface area. The interface area may include at least one SerDes (serializer/deserializer) area configured to transmit, to the memory cell array area, data inputted through the data input/output pads, or output, through the data input/output pads, data received from the memory cell array.

Abstract: In an example, a portion of a memory array may be selected to be wear leveled based on how often the portion is or is to be accessed. The portion may be wear leveled.

Abstract: Systems and method for a host-driven data refresh of a Flash memory include registers provided in the Flash memory for storing various settings related to refresh operations, such as, when to start/stop refreshing, target partitions in the memory, target start/end address ranges for refreshing, refresh algorithms, refresh rate requirements, etc. A host can control the various settings for start/stop refreshing, target partitions in the memory, target start/end address ranges for refreshing, refresh algorithms, through the corresponding registers; and the Flash memory can control various values related to refresh rate requirements through corresponding registers. In this manner, a standard platform or interface is provided within the Flash memory for refresh operations thereof.

Abstract: In a semiconductor device, memory modules each having a low power consumption mode that is enabled and disabled by a control signal belong to a memory block. A transmission path of the control signal is provided such that the control signal is inputted in parallel to the memory module via an inside-of-module path, and such that the control signal is outputted by a particular memory module of the memory modules via the inside-of-module path to a downstream outside-of-module path. The particular memory module in the memory block is selected such that it has a greater storage capacity than the other memory modules belonging to this same memory block have.

Abstract: Methods, systems, and devices for a sensing scheme that extracts the full or nearly full remnant polarization charge difference between two logic states of a ferroelectric memory cell or cells is described. The scheme employs a charge mirror to extract the full charge difference between the two states of a selected memory cell. The charge mirror may transfer the memory cell polarization charge to an amplification capacitor. The signal on the amplification capacitor may then be compared with a reference voltage to detect the logic state of the memory cell.

Abstract: A nonvolatile memory device may include a plurality of cell strings including a plurality of memory cells serially coupled to one another; a plurality of bit lines coupled to a corresponding cell string of the plurality of cell strings; a plurality of page buffers each including a plurality of latches and coupled to a corresponding bit line of the plurality of bit lines; a first control circuit suitable for controlling the plurality of latches to perform an operation corresponding to an activated command signal of a plurality of command signals in an access operation; and a second control circuit suitable for activating one or more of the plurality of command signals, while controlling operations of the plurality of cell strings and the plurality of bit lines in the access operation.

Abstract: A device includes memory cells, a reference circuit, and a sensing unit. The reference circuit includes a first reference switch, a second reference switch, and reference storage units. The first reference switch is turned on when a reference word line is activated. The second reference switch is turned on when the reference word line is activated. The reference storage units include a first reference storage unit and a second reference storage unit. The first reference storage unit generates a first signal having a first logic state when the first reference switch is turned on. The second reference storage unit generates a second signal having a second logic state when the second reference switch is turned on. The sensing unit determines a logic state of the bit data of one of the memory cells according to the first signal and the second signal.

Abstract: Methods, systems, and devices for multi-deck memory arrays are described. A multi-deck memory device may include a memory array with a cell having a self-selecting memory element and another array with a cell having a memory storage element and a selector device. The device may be programmed to store multiple combinations of logic states using cells of one or more decks. Both the first deck and second deck may be coupled to at least two access lines and may have one access line that is a common access line, coupling the two decks. Additionally, both decks may overlie control circuitry, which facilitates read and write operations. The control circuitry may be configured to write a first state or a second state to one or both of the memory decks via the access lines.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.

Abstract: In an aspect of the disclosure, an apparatus is provided. In one aspect, the apparatus is a memory apparatus. The memory apparatus includes a memory. The memory includes first and second bitcell arrays. The memory apparatus also includes a sense amplifier. The sense amplifier is shared by the first and the second bitcell arrays. Additionally, the sense amplifier is configured to amplify data stored in the memory during a read operation. The memory apparatus also includes a write circuit. The write circuit is configured to write data to the memory during a write operation. The memory apparatus also includes a controller. The controller is configured to disable the write circuit during the read operation.

Abstract: A layout pattern of a static random access memory includes a pull-up device, a first pull-down device, a second pull-up device, a second pull-down device, a first pass gate device, a second pass gate device, a third pass gate device and a fourth pass gate device disposed on a substrate. A plurality of fin structures is disposed on the substrate, the fin structures including at least one first fin structure and at least one second fin structure. A step-shaped structure is disposed on the substrate, including a first part, a second part and a bridge part. A first extending contact feature crosses over the at least one first fin structure and the at least one second fin structure.