Abstract: A method for page writes for triple or higher level cell flash memory is provided. The method includes receiving data in a storage system, from a client that is agnostic of page write requirements for triple or higher level cell flash memory, wherein the page write requirements specify an amount of data and a sequence of writing data for a set of pages to assure read data coherency for the set of pages. The method includes accumulating the received data, in random-access memory (RAM) in the storage system to satisfy the page write requirements for the triple or higher level cell flash memory in the storage system. The method includes writing at least a portion of the accumulated data in accordance with the page write requirements, from the RAM to the triple level cell, or the higher level cell, flash memory in the storage system as an atomic write.

Abstract: Methods of operating a memory include storing a first target data state of multiple possible data states of a first memory cell to be programmed in a target data latch coupled to a data node, storing at least one bit of a second target data state of the multiple possible data states of a second memory cell to be programmed in an aggressor data latch coupled to the data node, and programming the first memory cell and performing a program verify operation for the first target data state to determine if the first memory cell is verified for the first target data state.

Abstract: Multi-gate NOR flash thin-film transistor (TFT) string arrays are organized as three dimensional stacks of active strips. Each active strip includes a shared source sublayer and a shared drain sublayer that is connected to substrate circuits. Data storage in the active strip is provided by charge-storage elements between the active strip and a multiplicity of control gates provided by adjacent local word-lines. The parasitic capacitance of each active strip is used to eliminate hard-wire ground connection to the shared source making it a semi-floating, or virtual source. Pre-charge voltages temporarily supplied from the substrate through a single port per active strip provide the appropriate voltages on the source and drain required during read, program, program-inhibit and erase operations. TFTs on multiple active strips can be pre-charged separately and then read, programmed or erased together in a massively parallel operation.

Abstract: A memory device may be provided. The memory device may include an active control section configured to output a row active signal in response to a refresh signal when an active signal is activated. The memory device may include a refresh management section configured to control the refresh signal to skip a refresh operation for an unused row address in response to a refresh command signal and a refresh skip signal, and output an active row address for controlling the refresh operation. The memory device may include a memory section configured to perform a refresh operation for only an area of a cell array corresponding to a used row address in response to the row active signal and the active row address.

Abstract: Techniques and mechanisms to provide write access to a memory device. In an embodiment, a memory controller sends commands to a memory device which comprises multiple memory banks. The memory controller further sends a signal specifying that the commands include back-to-back write commands each to access the same memory bank. In response to the signal, the memory device buffers first data of a first write command, wherein the first data is buffered at least until the memory device receives second data of a second write command. Error correction information is calculated for a combination of the first data and second data, and the combination is written to the memory bank. In another embodiment, buffering of the first data and combining of the first data with the second data is performed, based on the signal from the memory controller, in lieu of read-modify-write processing of the first data.

Abstract: A storage device includes a nonvolatile memory device and a controller. The nonvolatile memory device includes a plurality of memory blocks, each of which includes string selection transistors connected to a plurality of string selection lines, ground selection transistors connected to a plurality of ground selection lines, and memory cells connected to a plurality of word lines. The controller reads valid data groups of a first memory block and writes the read valid data groups in a second memory block, during a read reclaim operation. The controller assigns locations of the second memory block, at which the valid data groups are written, based on read counts of the valid data groups.

Abstract: A data storage system includes a non-volatile memory array controlled by a controller. In response to receipt of write data to be written to the non-volatile memory array, the controller determines whether a read count of an unfinalized candidate block of storage within the non-volatile memory array satisfies a read count threshold applicable to the block. In response to determining that the read count of the unfinalized candidate block satisfies the read count threshold, the controller finalizing programming of the candidate block and programming an alternative block with the write data.

Abstract: A memory area is protected from rowhammer attacks by placing an extra sacrificial row at the top and the bottom of the memory addresses defining the area to be protected. The sacrificial rows of memory are written with a known bit pattern that may be read periodically to detect any rowhammer attacks that may be in progress.

Abstract: A memory system includes a first dual in-line memory module (DIMM), a second DIMM, and a controller. The first DIMM may include a first memory device including a first on-die termination (ODT) circuit connected to a data line. The second DIMM may include a second memory device including a second ODT circuit connected to the data line. The controller is connected to the first and second memory devices through the data line, generates first and second delay information, and determines whether to change an ODT duration of the first or second ODT circuit using the first and second delay information. The first delay information is indicative of a time taken for command/address or clock signals to reach the first memory device. The second delay information is indicative of a time taken for command/address signal or clock signals to reach the second memory device.

Abstract: Circuits, systems, and methods for double-polarity reading of double-polarity stored data information are described. In one embodiment, a method involves applying a first voltage with a first polarity to a plurality of the memory cells. The method involves applying a second voltage with a second polarity to one or more of the plurality of memory cells. The method involves detecting electrical responses of the one or more memory cells to the first voltage and the second voltage. The method also involves determining a logic state of the one or more memory cells based on the electrical responses of the one or more memory cells to the first voltage and the second voltage.

Abstract: Disclosed in some examples are methods, systems, memory devices, and machine readable mediums for performing an erase page check. For example, in response to an unexpected (e.g., an asynchronous) shutdown, the memory device may have one or more cells that did not finish programming. The memory device may detect these cells and erase them or mark them for erasure.

Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be selected using a selection component that is in electronic communication with a sense amplifier and a ferroelectric capacitor of a ferroelectric memory cell. A voltage applied to the ferroelectric capacitor may be sized to increase the signal sensed during a read operation. The ferroelectric capacitor may be isolated from the sense amplifier during the read operation. This isolation may avoid stressing the ferroelectric capacitor which may otherwise occur due to the applied read voltage and voltage introduce by the sense amplifier during the read operation.

Abstract: A memory system may include: a memory device comprising a plurality of memory blocks each having N word line groups; and a controller suitable for: selecting bad memory blocks among the plurality of memory blocks, arranging normal word line groups of the selected bad memory blocks into one or more memory-block-word-line groups each including non-conflicting N normal word line groups, and managing each of the memory-block-word-line groups as a reused memory block.

Abstract: A memory system may include: a memory device including a plurality of memory blocks each memory block having a plurality of pages; and a controller suitable for performing a plurality of operations to first memory blocks among the memory blocks at a first time, recording a checkpoint information for the operations in the memory blocks, selecting second memory blocks among the first memory blocks through the checkpoint information at a second time after a power-off in the memory system while performing the operations, and performing a dummy write operation to the second memory blocks.

Abstract: According to one embodiment, a semiconductor storage device includes: a first bank that includes a first memory cell group and writes data into the first memory cell group upon receipt of a first command; a second bank that includes a second memory cell group and writes data into the second memory cell group upon receipt of the first command; and a delay controller that issues the first command for the first bank upon receipt of a second command, and issues the first command for the second bank after an interval of at least a first period.

Abstract: A memory device is provided as follows. A memory cell array includes a plurality of memory cells, and the plurality of memory cells are divided into a first memory group and a second memory group. A first page buffer group is coupled to the first memory group and includes a plurality of first page buffers. A second page buffer group is coupled to the second memory group and includes a plurality of second page buffers. The first page buffer group performs a first data processing operation on data stored in the first page buffer group and stores a result of the first data processing operation. The second page buffer group performs a second data processing operation on data stored in the second page buffer group and stores a result of the second data processing operation. The first and second data processing operations are performed at substantially the same.

Abstract: A memory system includes a calibration engine, a memory, and a memory controller coupled to the memory by a channel used to transmit a plurality of commands from the memory controller to the memory. The memory controller estimates a total energy consumed based on the first plurality of commands in a first sampling period and determines a first temperature change of the memory based on the first total energy consumed. The memory controller transmits an impedance calibration command to the calibration engine if the first temperature change of the memory exceeds a first threshold. The calibration engine changes an impedance of an I/O terminal of the memory based on the calibration command.

Abstract: Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.

Abstract: According to one embodiment, a magnetoresistive memory device includes a substrate having a first surface which includes a first direction; and memory elements each having a switchable resistance. A first column of memory elements lined up along the first direction is different from an adjacent second column of memory elements lined up along the first direction at positions of memory elements in the first direction.

Abstract: A memory includes a plurality of memory blocks, a plurality of sensing circuits, a plurality of global bit lines, a common pre-charging circuit and a selection circuit. Each global bit line of the plurality of global bit lines is coupled to at least one of the memory blocks by a corresponding sensing circuit of the plurality of sensing circuits. The common pre-charging circuit is configured to individually pre-charge each global bit line of the plurality of global bit lines to a pre-charge voltage. The selection circuit is configured to selectively couple the common pre-charging circuit to a selected global bit line of the plurality of global bit lines.