Abstract: Methods, systems, and devices for protecting components in memory from overvoltage are described. A memory system may include a voltage regulator coupled with a first voltage source and a reference circuit that is configured to output a reference signal for the voltage regulator. The reference circuit may include a transistor that is used to generate the reference signal. The memory system may also include a protection circuit that is configured to maintain a voltage between a gate of the transistor and a second node of the transistor below an upper voltage limit. The protection circuit may include a comparator that is configured to compare a difference between a voltage of the reference signal output by the reference circuit and a voltage of the first voltage source with a reference voltage. The comparator may control a pull-down circuit coupled with the output of the reference circuit based on the comparison.

Abstract: Systems and method are directed to Universal Flash Storage (UFS) memory system configured to support deep power-down modes wherein the UFS memory system is not required to be responsive to commands received from a host device coupled to the UFS memory system. Correspondingly, in the deep power-down modes, a link or interface between the UFS memory system and the host device may also be powered down. The UFS memory system may enter the deep power-down modes based on a command received from the host device or a hardware reset assertion, and exit the deep power-down modes based on a hardware reset de-assertion or power cycling. While in deep power-down modes, the power consumption of the UFS memory device is substantially lower than the power consumption of the UFS memory device in conventional power modes.

Abstract: Memory having an array of memory cells might include control logic configured to cause the memory to inhibit memory cells of a first subset of memory cells from programming during each programming pulse of a first plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of a second plurality of programming pulses, inhibit memory cells of a second subset of memory cells from programming during each programming pulse of the second plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of the first plurality of programming pulses, and enable memory cells of a third subset of memory cells for programming during at least one programming pulse of the first plurality of programming pulses and during at least one programming pulse of the second plurality of programming pulses.

Abstract: A system-on-chip (SoC) includes a fuse circuit and decoding circuitry. The fuse circuit includes functional fuses, control fuses utilized as the functional fuses, and fuses configured to store override data that indicates an association between the functional fuses and the control fuses utilized as the functional fuses. The decoding circuitry is configured to output configuration data associated with a configuration of the fuse circuit based on the override data and an initial configuration of the fuse circuit. In such a scenario, functional operations of the SoC are executed based on the configuration data. Alternatively, the decoding circuitry is configured to output a set of functional data based on the override data and various functional data stored in the functional fuses and the control fuses utilized as the functional fuses. In such a scenario, the functional operations are executed based on the outputted set of functional data.

Abstract: Disclosed are a device and a method for calibrating a reference voltage. The reference voltage calibrating device includes a data signal communication unit that transmits/receives a data signal, a data strobe signal receiving unit that receives a first data strobe signal and a second data strobe signal, a voltage level of the second data strobe signal being opposite to a voltage level of the first data strobe signal, and a reference voltage generating unit that sets a reference voltage for determining a data value of the data signal, based on the first data strobe signal and the second data strobe signal, and the reference voltage generating unit adjusts the reference voltage based on the first data strobe signal and the second data strobe signal.

Abstract: A memory controller optimizes read threshold values for a memory device using multi-dimensional search. The controller performs a read operation on cells using a pair of default read threshold values on a multi-dimensional plane. When the read operation has failed, the controller determines program states of cells and a pair of next read threshold values based on the program states and performs an additional read operation using the next read threshold values.

Abstract: The invention provides a semiconductor apparatus and a continuous readout method capable of achieving high speed continuous readout. The continuous readout method for NAND type flash memory of the invention includes: a detecting step of detecting a frequency of an external clock signal; a readout step of reading data from the memory cell array based on a readout timing corresponding to the frequency of the detected external clock signal; a holding step of holding the read data in a latch (L1) and a latch (L2), and an output step of outputting the held data in synchronization with the external clock signal.

Abstract: A memory device according to an embodiment includes a memory cell block including a plurality of pages with each page corresponding to a word line of a plurality of word lines, a peripheral circuit configured to perform a program operation on the plurality of pages, and control logic configured to control the peripheral circuit to perform the program operation. The control logic changes and sets a bit line voltage applied to bit lines of the memory cell block during a program verify operation of the program operation according to a program order of each of the plurality of pages.

Abstract: The present disclosure generally relates to improved foggy-fine programming. Rather than initially writing to SLC and then later performing a foggy write to QLC with the data read from SLC and then a fine write to QLC with data re-read from SLC, the foggy write to QLC can be performed in parallel to the initial writing to SLC using the same buffer. Once the foggy write to QLC has completed, and the writing to SLC has also completed, the data buffer can be released. The data written in SLC is then be read from SLC and passes through a relocation buffer for the first and only time to then be written using fine programming to QLC. Thus, the data only passes through the relocation buffer one time and the relocation buffer can be freed to usage after only one pass of the data therethrough.

Abstract: A semiconductor memory apparatus includes a plurality of memory cells. Each memory cell includes a switching element and a storage capacitor. The semiconductor memory apparatus further includes a first word line extended from a part of the plurality of memory cells, a second word line which is enabled after the first word line is enabled in a refresh mode for refreshing data stored in the storage capacitor, a word line control circuit configured to enable and disable the first word line. The word line control circuit comprises at least one switch that couples and decouples the first word line and the second word line.

Abstract: One embodiment of a memory device comprises a selector and a storage capacitor in series with the selector. A further embodiment comprises a conductive bridging RAM (CBRAM) in parallel with a storage capacitor coupled between the selector and zero volts. A plurality of memory devices form a 1S-1C or a 1S-1C-CBRAM cross-point DRAM array with 4F2 or less density.

Abstract: Provided are a memory controller and memory system having an improved threshold voltage distribution characteristic and an operating method of the memory system. As a write request of data with respect to a first block is received, an erase program interval (EPI) is determined denoting a time period elapsed after erasure of the first block. When the determined EPI is equal to or less than a reference time, data is programmed to the first block based on a first operation condition selected from among a plurality of operation conditions. when the When the determined EPI is greater than the reference time, the data is programmed to the first block based on a second operation condition selected from among the plurality of operation conditions.

Abstract: A non-volatile memory device and an erasing operation method thereof are provided. The non-volatile memory device includes a main memory cell region and a control circuit electrically connected to the main memory cell region. The main memory cell region has a plurality of memory cells. The control circuit is configured to perform an erasing operation on the memory cells, wherein the control circuit is configured to: obtain a current threshold voltage of the memory cell to be erased; calculate a difference between the current threshold voltage and an original threshold voltage to obtain a voltage shift value, wherein the original threshold voltage represents the pre-delivery threshold voltage of the memory cells; adjust an erase verify voltage level according to the voltage shift value; and determine whether the erasing operation is completed according to the adjusted erase verify voltage level.

Abstract: A semiconductor memory device includes a memory cell array including a plurality of memory cells, a word line connected in common to gates of the memory cells, and a control circuit configured to execute a read operation on the memory cells by applying a first read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the first read voltage and a second read voltage to the word line to determine for each of the memory cells whether or not the memory cell has a threshold voltage that is below the second read voltage. The control circuit determines the first read voltage by applying at least first to third voltages to the word line, and determines the second read voltage based on the first read voltage.

Abstract: Systems and method are provided for a word line driver. A first supply branch is configured to provide a source voltage level for a word line. A second supply branch is configured to provide a boosted voltage for the word line. The word line driver is configured to apply the source voltage level to the word line based on a first selection signal, and the word line driver is configured to apply the boosted voltage to the word line based on a second selection signal, the second selection signal being delayed relative to the first selection signal.

Abstract: A magneto-resistance random access memory (MRAM) cell includes a transistor, a wire and a magnetic tunnel junction (MTJ). The MTJ includes a fixed layer of fixed magnetic polarity electrically connected with the transistor, a free layer of variable magnetic polarity electrically connected with the wire and an insulator between the fixed and free layers. First current passed through the wire destabilizes the variable magnetic polarity of the free layer. Second current passed through the transistor in one of two directions during first current passage through the wire directs the variable magnetic polarity of the free layer toward a parallel or anti-parallel condition with respect to the fixed magnetic polarity of the fixed layer. A ceasing of the first current prior to a ceasing of the second current sets the variable magnetic polarity of the free layer in the parallel or anti-parallel condition.

Abstract: According to one embodiment, a semiconductor memory device includes: a first memory cell and a second memory cell capable of storing data and coupled in parallel to a bit line; a first word line coupled to the first memory cell; a second word line coupled to the second memory cell and being different from the first word line; and a control circuit. The first memory cell and the second memory cell share a first well region and are opposed to each other, with the first well region interposed. The control circuit is configured, in a first operation, to repeat application of a first voltage to the first word line and the second word line a plurality of times while increasing the first voltage.

Abstract: Apparatuses and techniques are described for performing an operation which irreversibly prevents access to a set of memory cells. The operation provides a strong erase bias for select gate transistors of NAND strings. The erase bias induces a phenomenon in the select gate transistors which permanently increases their threshold voltages. This prevents access to the memory cells such as for program or read operations. The operation can involve one or more erase-verify iterations. In each erase-verify iteration, an erase bias is applied to the select gate transistors such as by charging up the channels of the NAND strings and holding a control gate voltage of the select gate transistors at a relatively low level, thereby causing a relatively high channel-to-control gate voltage.

Abstract: A memory device includes receivers that use CMOS signaling levels (or other relatively large signal swing levels) on its command/address and data interfaces. The memory device also includes an asynchronous timing input that causes the reception of command and address information from the CMOS level receivers to be decoded and forwarded to the memory core (which is self-timed) without the need for a clock signal on the memory device's primary clock input. Thus, an activate row command can be received and initiated by the memory core before the memory device has finished exiting the low power state. Because the row operation is begun before the exit wait time has elapsed, the latency of one or more accesses (or other operations) following the exit from the low power state is reduced.

Abstract: According to one embodiment, a memory system includes a first memory and a memory controller. The first memory is nonvolatile and includes a plurality of memory cell transistors, each of which stores data corresponding to a threshold voltage. The memory controller causes the first memory to execute a read operation to acquire data corresponding to the threshold voltage from the plurality of memory cell transistors on the basis of a result of comparison between the threshold voltage and a read voltage. The memory controller selects a first candidate value from among a plurality of candidate values for the read voltage in accordance with a degree of stress that affects the threshold voltage; and causes the first memory to execute the read operation using the first candidate value as the read voltage.