Patents Examined by Vinh P. Nguyen
  • Patent number: 11150282
    Abstract: A single-phase electric meter having a phase conductor intended to be connected to a phase of an electric line located upstream of the single-phase electric meter and to a phase of an electric installation located downstream of the single-phase electric meter, the single-phase electric meter further including a breaking unit mounted on the phase conductor, an upstream voltage sensor arranged to periodically measure an upstream voltage upstream of the breaking unit, and a processing device arranged to acquire upstream voltage measurements and to open the breaking unit when the upstream voltage drops below a first predetermined threshold voltage.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 19, 2021
    Assignee: SAGEMCOM ENERGY & TELECOM SAS
    Inventor: Henri Teboulle
  • Patent number: 11150295
    Abstract: A system includes a power supply configured to adjust a voltage supplied to a device under test (DUT) based on one of an input voltage of the DUT supplied to a power supply sense input of the power supply and a feedback signal indicative of an internal voltage of the DUT supplied to the power supply sense input, and a relay circuit configured to transition between supplying the input voltage to the power supply sense input and supplying the feedback signal to the power supply sense input. When supplying the feedback signal to the power supply sense input, the relay circuit establishes an electrical path between the input voltage and the power supply sense input to prevent the power supply sense input from floating during the transition.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: October 19, 2021
    Assignee: Marvell Asia Pte, Ltd.
    Inventor: Quang Nguyen
  • Patent number: 11143495
    Abstract: A sensor system includes an eddy current sensor including at least one coil with excitation electronics coupled across the coil. An optical displacement sensor is secured to the eddy current sensor so that a vertical distance between the sensors is fixed. The optical displacement sensor is located on top of and concentric with the coil so that a measurement axis of the optical displacement sensor is collinear with an axis of symmetry of the coil. A computing device including a processor and memory is coupled to receive sensor data from the eddy current sensor and the optical displacement sensor that is adapted for analyzing the sensor data obtained from measuring a coated substrate including a coating layer on at least one side of a metal substrate to determine at least a thickness of the coating layer.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: October 12, 2021
    Assignee: Honeywell International Inc.
    Inventors: Michael Kon Yew Hughes, Sebastien Tixier, Tobias Nebel
  • Patent number: 11143695
    Abstract: An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 12, 2021
    Assignee: DENSO CORPORATION
    Inventor: Hisashi Kato
  • Patent number: 11143673
    Abstract: Disclosed is a camera module inspector of rotating type distributing a load of processing test raw data. In an exemplary embodiment, the camera module inspector of rotating type includes a rotary index table including a plurality of socket units, a plurality of testers arranged around the rotary index table, a plurality of test control processors connected to correspond to the plurality of socket units, respectively, to be fixed on the rotary index table, a network connection unit establishing network connections with respect to the plurality of test control processors, a redundancy check processor processing the test raw data faster than the test control processor, connected to the network connection unit and data controller test raw data requiring a great deal of processing time out of the test raw data generated in the plurality of test control processors to be transmitted to the redundancy check processor through the network connection unit.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 12, 2021
    Assignee: ISMEDIA CO., LTD
    Inventors: Seong Cheol Hong, Jong Won Kim, DongChoon Kim
  • Patent number: 11137422
    Abstract: A sensor device for detecting voltage in a conductor cable includes a sense electrode to be disposed over a surface of the conductor cable to cover a sense region having a sense axial width and a sense circumferential length and a reference electrode to be disposed over the surface of the conductor cable to cover a reference region. The reference region has an axial position adjacent the axial position of the sense region and has a reference circumferential length greater than the sense circumferential length. The sensor device further includes a charge measurement circuit connected in series between the sense electrode and the reference electrode to measure a charge measurement and circuitry to compare the charge measurement to a threshold to detect a presence of the voltage in the conductor cable.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: October 5, 2021
    Assignee: RF Code, Inc.
    Inventors: Jonathan Andrew Guy, Jacob Aaron Perlmutter, Iurii Buiankin
  • Patent number: 11137437
    Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 5, 2021
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shoji Takano, Fumihiko Matsuda, Yoshihiko Narisawa
  • Patent number: 11137439
    Abstract: A digitally controlled hybrid (active-passive) tuning system includes a passive slide screw tuner using a slabline in which also fixed and adjustable signal couplers (wave-probes) are mounted, leading to and from an active feedback loop, digitally controlled using an electronic tuner. The wave-probes control the static amplitude and phase of the feedback signal and the electronic tuner controls the actual dynamic (high speed) amplitude and phase of the re-injected signal. The slide screw tuner serves as an additional static pre-matching for reducing the required feedback injection power. Appropriate passive and active calibration and search routines allow identifying tuner states satisfying DUT parameter targets.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: October 5, 2021
    Inventor: Christos Tsironis
  • Patent number: 11137441
    Abstract: A device for testing performance of main boards of electronic devices includes a housing, two bases, a control device, a humidifier, a heating device, and a refrigerating device. A cavity in the housing comprises separated first and second portions. The heating device is interconnected with the first portion to create a predefined high temperature environment and the refrigerating device is interconnected with the second portion to create a predefined low temperature environment. The humidifier is interconnected with the first portion and the second portion, and configured to create predefined degrees of humidity respectively in the first portion and the second portion. The bases are inside the first portion and the second portion, and electrically connected to the control device.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: October 5, 2021
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Cun-Wei Zou
  • Patent number: 11131699
    Abstract: A method that includes changing a probe angle with respect to the conductor surface of a substrate that has a flat conductor surface mounted on the mounting surface of a stage in a high-frequency test system, thereby changing the state of contact of the tip of a signal terminal and tip of a ground terminal with the conductor surface, outputting high-frequency signals from the signal terminal to the conductor surface and receiving reflected signals using the probe to find S-parameters at different probe angles, and determining, based on a plurality of the S-parameters, a reference probe angle at which the reference line formed connecting the tip of the signal terminal and tip of the ground terminal is parallel with the conductor surface.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 28, 2021
    Assignee: NATIONAL INSTITUTE OF ADVANCED SCIENCE AND TECHNOLOGY
    Inventors: Ryo Sakamaki, Masahiro Horibe
  • Patent number: 11125804
    Abstract: A failure positioning method for positioning leakage defect cell between the gate and the active region of transistor cells arranged in an array. The positioning method includes the steps of: measuring the resistance between a first metal wire connecting the active regions and a second metal wire connecting the gates, and positioning a first region where the defect cell is located by resistance ratio; electrically isolating the active region contact holes and the gate contact holes from each other; shorting the gate contact holes in the first region; and performing active voltage contrast analysis on the plurality of columns of transistor cells in the first region to position the leakage defect in the first region by comparing the voltage contrast images. With the positioning method, the transistor cell having a leakage defect at nA level may be accurately found from a plurality of transistor cells arranged in an array.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: September 21, 2021
    Assignee: Shanghai Huali Integrated Circuit Mfg. Co. Ltd.
    Inventors: Lingye Yang, Li Sun
  • Patent number: 11119063
    Abstract: An impedance measuring apparatus and method is disclosed. The impedance measuring apparatus includes one or more capacitors configured to receive an induced signal determined by an impedance of a measurement target, a controller configured to output a control signal to selectively turn a switch on or off based on whether a voltage value of the induced signal is included in a threshold range, and the switch configured to determine whether to set, to be a reference voltage value, a voltage value of a capacitor voltage signal output from the one or more capacitors based on the control signal.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: JongPal Kim
  • Patent number: 11119120
    Abstract: A probe is connectable to a test instrument for measuring signals of a DUT, where the probe includes a probe head that includes multiple leads configured to connect to signal probe points of the DUT, and a sensor connected between two of the leads; at least one probe output configured to connect to the test instrument; a current detection circuit configured to detect current of the DUT through the sensor, and to provide a detected current signal; a voltage detection circuit configured to detect voltage of the DUT between the sensor and ground, and to provide a detected voltage signal; a combiner configured to combine the detected current signal and the detected voltage signal, and to provide a power signal indicating power of the DUT; and switches configured to selectively output at least one of the detected current signal, the detected voltage signal, and the power signal.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 14, 2021
    Assignee: Keysight Technologies, Inc.
    Inventors: Jason Swaim, Edward Vernon Brush
  • Patent number: 11121536
    Abstract: Systems and methods for displaying electric power system metering information in a panel may use digitized signals from primary protection relays. The system may include multiple panel meters. One or more of the panel meters may receive the digitized signals using an electrically non-conductive communication media. In various embodiments, the panel may be electrically isolated from the primary protection relay. The panel may be hot swappable and may be connected to a primary protection relay while the relay is in continuous operation.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: September 14, 2021
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Edmund O. Schweitzer, III, Krishnanjan Gubba Ravikumar, Austin Edward Wade
  • Patent number: 11112442
    Abstract: A quantum power sensor has a two-level quantum system strongly coupled to a transmission line that supports a propagating wave. A method of measuring power in a transmission line includes coupling a two-level quantum system to the transmission line; and determining the coupling and the Rabi frequency of the two-level system.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: September 7, 2021
    Assignee: NPL MANAGEMENT LIMITED
    Inventors: Oleg Vladimirovich Astafiev, Rais Shaikhaidarov, Vladimir Nikolaevich Antonov, Teresa Clare Hoenigl-Decrinis, Sebastian Erik De Graaf
  • Patent number: 11112452
    Abstract: According to one embodiment, an IC tray mounting thereon IC packages to be tested includes a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and IC package mounting places on which the IC packages are to be mounted. The through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages. The IC package mounting places are provided correspondingly to a region of a test board where a plurality of test pins used for an electrical test to one of the IC packages are arranged.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: September 7, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Akihiro Hayashida
  • Patent number: 11105838
    Abstract: A turns ratio meter may be connected to each phase of each set of windings. The excitation voltage used in testing is a DC square wave. The excitation voltage is relatively low, between 1 and 48 volts. The step down and step up testing is performed several times with different voltages and/or frequencies. Excitation losses of the transformer are determined based upon the multiple step down and step up tests. The step down and step up testing can be performed without reconfiguring the test leads on the transformer. The testing is performed on a single phase of the transformer or all three phases of the transformer simultaneously. The turns ratio of the transformer is accurately determined using the results of the step down and step up testing and the calculated excitation losses.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 31, 2021
    Assignee: AVO Multi-Amp Corporation
    Inventors: Oleh Iwanusiw, Vince Oppedisano, Kristopher Neild
  • Patent number: 11092625
    Abstract: Techniques are provided to facilitate current sensing recovery for imaging systems and methods. In one example, a device includes a detector configured to detect electromagnetic radiation and generate a detection signal based on the detected electromagnetic radiation. The device further includes a current sensing circuit configured to provide, based on the detection signal, a first signal. The device further includes a signal generator configured to provide a second signal to adjust a bandwidth associated with the current sensing circuit. The device further includes an imaging integration circuit configured to generate an image of at least a portion of a scene based at least in part on the first signal. Related methods and systems are also provided.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: August 17, 2021
    Assignee: FLIR COMMERCIAL SYSTEMS, INC.
    Inventors: John D. Schlesselmann, Brian B. Simolon
  • Patent number: 11085961
    Abstract: An example method provides a power MOSFET, a voltage source coupled to the power MOSFET, and a current measurement device coupled to a first non-control terminal of the power MOSFET. The voltage source, the current measurement device, and a second non-control terminal of the power MOSFET couple to ground. The method uses the voltage source to apply a voltage between a gate terminal and the second non-control terminal of the power MOSFET, the voltage greater than zero volts and less than a threshold voltage of the power MOSFET. The method also uses the current measurement device to measure a first current flowing through the first non-control terminal while applying the voltage. The method further uses the first current to predict a second current through the first non-control terminal for a voltage between the gate terminal and the second non-control terminal that is approximately zero.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 10, 2021
    Assignee: Texas Instruments Incorporated
    Inventors: Robert Allan Neidorff, Henry Litzmann Edwards
  • Patent number: 11073536
    Abstract: An ID chip socket according to an embodiment disclosed herein includes: a contactor configured to be fixed to an upper side of the frame; a socket-conductive part penetrating the contactor in a vertical direction and configured to enable electrical connection in the vertical direction; an ID chip fixed to an upper side of the socket-conductive part and electrically connected to the socket-conductive part; and a cover configured to cover an upper surface of the ID chip and to be fixed to at least one of the contactor and the frame.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: July 27, 2021
    Assignee: ISC CO., LTD.
    Inventor: Young Bae Chung