Abstract: Provided are an automatic trigger type identification method and device and an oscilloscope, which belong to the field of oscilloscopes. The method includes analyzing characteristic parameter data of a to-be-triggered signal. The characteristic parameter data comprises at least one of bus protocol matching information or variation information of at least one characteristic parameter. In this way, a trigger type capable of stably triggering the to-be-triggered signal can be obtained for user selection or automatic selection for trigger.

Abstract: Provided is a magnetic material concentration measuring device including: a bobbin having an outer circumference around which an exciting coil, an output coil, and a further exciting coil are wound; an eccentric hole formed in the bobbin; a rotor that is rotatably fitted in the eccentric hole about an eccentric axis line; a first cutout part that forms a first flow passage on one end side in an eccentric axis line direction of the rotor; a second cutout part that forms a second flow passage whose angle is shifted in a rotor rotation direction with respect to the first cutout part, on another end side in the eccentric axis line direction of the rotor; and a communication passage that connects the first flow passage and the second flow passage.

Abstract: Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

Abstract: A particle matter analysis device, an analysis method and a manufacturing method are disclosed.

Abstract: According to aspects of the disclosure, a sensing system includes at least one sensor configured to provide an output signal indicative of a sensed property, an interface configured to be coupled to a computing device, and a processor coupled to the interface, the processor being configured to provide, to the computing device via the interface, a first Transducer Electronic Data Sheet (TEDS) template indicative of a first variable of the sensed property, and provide, to the computing device via the interface, a second TEDS template indicative of a second variable of the sensed property.

Abstract: Systems and methods for identifying a motor coupled to an electrical appliance are disclosed herein. The electrical appliance can include a motor assembly comprising at least one electric motor and a filter network including an electrical resistance component and an electrical capacitance component. The electrical appliance can also include a controller electrically coupled to the motor assembly and the filter network, the controller comprising one or more processors and a memory comprising instructions for performing a process. The process can include providing an input signal to the filter network and receiving an output signal from the filter network, the output signal being filtered by the filter network. The process can also include identifying a filter characteristic of the filter network based on the output signal and identifying a type of the electric motor based on the identified filter characteristic.

Abstract: In an integrated control device 10 of the measurement device 1, a reception sensitivity test control unit 18 repeatedly performs a reception sensitivity test of measuring a throughput of a signal under measurement transmitted from a DUT 100 which has received a test signal while changing an output level of the test signal non-linearly for each of a first orientation (PSa) regulated by a predetermined step interval of a spherical coordinate system and a second orientation (PSb) regulated by a step interval finer than the predetermined step interval, and a peak power measurement control unit 19 sets, as a peak power candidate, reception power within a range of a power width (?Pw) from the maximum reception power of reception power measured for each first orientation, measures the reception power for each second orientation with respect to the peak power candidate, and determines the peak power based on a measurement result.

Abstract: The mapping of electric power distribution circuits and electric power outlets to breakers in a breaker panel is accomplished by providing a plurality of smart power testing devices and a control device that communicates with each of the smart power testing devices. Each of the smart power testing devices is connected to a respective one of the electric power outlets in a structure. Each smart power testing device can detect the AC voltage level provided at the electric power outlet. A user opens each breaker in the breaker panel, in succession. When a smart power testing device senses loss of AC voltage, it transmits a message to the control device. The control device can then identify which outlets are on a common electric power circuit, and by opening each breaker in succession, the control device can creating a mapping of outlets to breakers.

Abstract: A switchboard is provided via a terminal bushing; a switchboard terminal coupled to the terminal bushing; a metering transformer bushing which is installed or released from the front part thereof through a breaker chamber, covers the switchboard terminal, and is inserted into the terminal bushing; and a metering transformer which is fastened to the metering transformer bushing and disposed on the outer circumference of the metering transformer bushing. The metering transformer includes at least one terminal that faces forward, and the metering transformer bushing may include an opening for exposing the at least one terminal to the front thereof.

Abstract: A method of monitoring a fuse of a work machine includes sensing a fuse current; detecting when the fuse current exceeds a threshold; quantifying a difference current that is a difference between the fuse current and the threshold current when the fuse current exceeds the threshold current; determining an amount of time that the difference current is greater than zero; and generating an alert related to fuse lifetime according to the difference current and determined time.

Abstract: A system and method for controlled fluid handling and processing of singulated biosensors. The system includes a consumable for mounting and protecting biosensors.

Abstract: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.

Abstract: A measuring system for measuring signals with multiple measurement probes includes a multi probe measurement device having at least two probe interfaces that each couple the multi probe measurement device with at least one of the measurement probes, a data interface that couples the multi probe measurement device to a measurement data receiver, and a processing unit coupled to the at least two probe interfaces that records measurement values via the at least two probe interfaces from the measurement probes. The processing unit is further coupled to the data interface and provides the recorded measurement values to the measurement data receiver that also includes a data interface. The data interface of the measurement data receiver is coupled to the data interface of the multi probe measurement device.

Abstract: A method for determining sensor parameters of an actively-driven sensor system may include obtaining as few as three samples of a measured physical quantity versus frequency for the actively-driven sensor system, performing a refinement operation to provide a refined version of the sensor parameters based on the as few as three samples and based on a linear model of an asymmetry between slopes of the measured physical quantity versus frequency between pairs of the as few as three samples, iteratively repeating the refinement operation until the difference between successive refined versions of the sensor parameters is below a defined threshold, and outputting the refined sensor parameters as updated sensor parameters for the actively-driven sensor system.

Abstract: An integrated circuit includes a sub-system and a reference sub-system. The reference sub-system is substantially identical to the sub-system but is non-operating by default. The integrated circuit includes a test circuit that obtains a parameter value of the sub-system and a reference parameter from the reference sub-system. The integrated circuit detects deterioration of the sub-system based on the parameter value and the reference parameter. The integrated circuit deactivates the sub-system and activates the reference sub-system responsive to detecting deterioration of the sub-system.

Abstract: One example relates to a monitoring circuit that includes a capacitive digital-to-analog converter that receives a binary code, a reference voltage, a monitored voltage, and a ground reference, the capacitive digital-to-analog converter outputting an analog signal based on the binary code, the reference voltage, the monitored voltage, and the ground reference. The monitoring circuit further includes a comparator including a first input coupled to receive the analog signal and a second input coupled to the reference voltage, the comparator comparing the analog signal to the reference voltage and outputting a comparator signal based on the comparison. The monitoring circuit yet further includes a binary code generator that generates the binary code based on the comparator signal, the binary code approximating a magnitude of the monitored voltage.

Abstract: A method for assessing the state of damage of a semiconductor module that is subject to operational loading, in particular a semiconductor module of a drive system converter, that includes at least one semiconductor component arranged on or in a support structure. It is possible not only to estimate a spent service life for the entire semiconductor module, but also to detect unexpected or undesirable loading states and thus a premature reduction of the remaining service life of the semiconductor module. Continuous load assessments are thus possible already during the operation of the semiconductor module and allow interventions to be made in good time.

Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Abstract: A test apparatus for devices having fine pitches, includes a loading picker provided on one side of a loading part so as to sequentially adsorb devices to be tested, thereby putting the adsorbed devices on the upper surface of a vacuum chuck, a device alignment part, which is provided at an upper portion of a loading zone for aligning the devices, tester for testing a performance of the devices for a set time as the vacuum chuck positioned in the test position moves and comes into electrical contact with bumps of respective devices, and an unloading picker, which is provided at one side of an unloading zone so as to adsorb tested devices from the vacuum chuck, sorts the tested devices into good products and bad products, and unloads the tested devices as sorted on a tray of an unloading part.

Abstract: A method for open-loop or closed-loop control of the temperature of a chuck for a wafer includes detecting the position of a test device for testing a wafer and determining the spatial distances between the test device and a plurality of temperature measurement devices for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck. The method proceeds by selecting at least one temperature measurement device from the plurality of temperature measurement devices as a reference temperature measurement device; and controlling the temperature of the chuck by open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement devices.