Abstract: Various kinds of wastewater and water such as methane fermentation digestion liquids, domestic wastewater, sewage, service water, culture pond water, wastewater defined by an active sludge law and wastewater from food industries are decomposed, cleaned and treated with a high efficiency with oxygen radicals, hydroxyl radicals and diphenyl para picrihydoral radicals, and injurious materials are decomposed, cleaned and treated by oxidizing and reducing functions. An apparatus for cleaning dissolved organic matters and a trace amount of injurious materials consisting of a anode which is formed or welded by coating clay or glass with a material prepared by mixing 2 to 15% by weight of a transition metal with 1 to 10% of an oxidized transition metal and sintering the glass within a range from 800 to 1500° C.

Abstract: The present invention relates to a process for electrochemical oxidation of bromide to bromine, more particularly to oxidation of bromide ions in brine, bittern and effluents using an indigenous cation exchange membrane flow cell.

Abstract: This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface.

Abstract: Aluminum surface mount capacitors containing one or more anode foil coupons are initially anodized in an aqueous phosphate solution in order to produce an anodic oxide film having extreme resistance to hydration and attack by corrosive anions for the purpose of producing surface mount capacitors at high yield and of high stability.

Abstract: In a method for producing sodium hypochlorite, brine solution is piped from the brine tank to a first inlet in a first electrolyzer cell of an electrolyzer assembly while simultaneously piping chilled water from a chiller having a temperature range from about 10° C. to about 25° C. to the first inlet so that the brine solution combines with the chilled water. The chilled brine solution is electrolyzed in the first electrolyzer cell. The hypochlorite and brine solution resulting from electrolysis occurring in the first cell is piped to a second inlet in a second electrolyzer cell in the electrolyzer assembly while simultaneously piping chilled water from the chiller having a temperature range from about 10° C. to about 25° C. to the second inlet so that the chilled water combines with the hypochlorite and brine solution. Each cell can have more than one inlet, preferably up to 6 inlets. The chilled hypochlorite and brine solution are electrolyzed in the second cell.

Abstract: The present invention provides a self-replenishing liquid water source onboard an automobile for supplying liquid water to an electrolyzer, such as an on-board hydrogen generator useful for the suppression of unwanted emissions. While automobiles typically have water reservoirs resupplied by a person, the invention provides a passive means of water collection for reliable replenishment due to operations of the automobile itself. The invention provides condensate from the engine exhaust gas by cooling a region of the exhaust system using cooling fluid from the engine coolant system. The cooling fluid is circulated during a period following the engine cold start event when the heat load on the engine coolant system is low.

Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

Abstract: The present invention is directed to a method of creating porous anode foil for use in multiple anode stack configuration electrolytic capacitors, producing a pore structure that is microscopic in pore diameter and spacing, allowing for increased energy density with a minimal increase in ESR. Initially, an anode metal foil is etched, according to a conventional etch process, to produce an enlargement of surface area. The etched foil is then placed into the electrochemical drilling solution of the present invention. Alternatively, the etched foil may be masked, so that only small areas of the etched foil are exposed, prior to being placed in the electrochemical drilling solution. A DC power supply is used to electrochemically etch the masked or unmasked foil in the electrochemical drilling solution of the present invention such that pores on the order of a few microns diameter are produced through the foil.

Abstract: An apparatus for engaging a work piece during plating facilitates electrolyte flow during a plating operation. The apparatus helps to control the plating solution fluid dynamics and electric field shape to keep the wafer's local plating environment uniform and bubble free. The apparatus holding the work piece in a manner that facilitates electrolyte circulation patterns in which the electrolyte flows from the center of the work piece plating surface, outward toward the edge of the edge of the work piece. The apparatus holds the work piece near the work piece edges and provides a flow path for electrolyte to flow outward away from the edges of the work piece plating surface. That flow path has a “snorkel” shape in which the outlet is higher than the inlet. In addition, the flow path may have a slot shape that spans much or all of the circumference of holding apparatus. It may be made from a material that resists deformation and corrosion such as certain ceramics.

Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.

Abstract: This invention relates to radioactively coated devices, preferably radioactively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coating, and are therefore suitable for use within biological systems. Methods for coating a device with a radioisotope comprising are also disclosed. One method comprises immersing the device within a solution containing a &Ugr;, &bgr;+, &agr;, &bgr;− or &egr; (electron capture) emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation to produce a coated substrate. A second method involves coating a substrate using electroless plating, and yet a third method involves the use of electroplating a radioisotope onto a substrate of interest. With these methods, the coating procedures are followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate.

Abstract: A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is simulated, the distribution of currents then flowing through individual parts of a finite element model of a to-be-coated object is obtained, the electric variables of currents flowing through the respective surfaces of the finite elements of the to-be-coated object are obtained and accumulated according to the current distribution, the thickness of an electrodeposition coating film is calculated as h=&Sgr;KFICC.E.&Dgr;t/&rgr; if the cumulative electric variable is higher than a deposition starting electric variable such that a fixed concentration is attained by OH− or H+.

Abstract: A method of manufacturing a decorative plate (1) includes the steps of: preparing a metal substrate and covering selected areas (11, 16) of the substrate with a protective film; anodizing the substrate; and removing the protective film to expose metallic surfaces in the selected areas of the substrate.

Abstract: The invention relates to a process for the electrochemical preparation of chlorine from aqueous solutions of hydrogen chloride in an electrolysis cell, comprising an anode chamber and a cathode chamber, the anode chamber being separated from the cathode chamber by a cation exchange membrane, the anode chamber containing an anode and the cathode chamber a gas diffusion cathode, and the aqueous solution of hydrogen chloride being passed into the anode chamber and an oxygen-containing gas into the cathode chamber, and the oxygen pressure in the cathode chamber being at least about 1.05 bar.

Abstract: The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment. Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied, characterized in that with Sn (tin) as a base, one of Bi (bismuth), Ag (silver) and Cu (copper) is selected, a Bi content to the Sn is set to 1.0% or less, the Bi content to the Sn is set to 2.0 to 10.0%, an Ag content to the Sn is set to 1.0 to 3.0%, the Ag content to the Sn is set to 3.0 to 5.

Abstract: A storage stable hydrogen cell comprising an anode cap subassembly, cathode can subassembly, and a grommet is disclosed. For one embodiment the cathode in the cathode can subassembly is configured for contact with the electrolyte. The cathode is hydrogen permeable and substantially impermeable to O2, CO2 and water. In turn, the cathode can preclude the passage of O2, CO2 and water into and out of the cell, and simultaneously can facilitate the permeation of hydrogen through at least one aperture in the cell. In another embodiment, a commercially available Zn-air cell is converted into storage stable H2 cells by sealing a membrane structure around the apertures of the Zn-air cell. Such membrane precludes the passage of O2, CO2 and water into and out of cell but allows the passage of hydrogen generated in the cell through the aperture of the cell and through the membrane.

Abstract: The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates.

Abstract: A target material is electropolished by applying a voltage between an anode electrode and a counter electrode while bringing the anode electrode into contact with the surface of the target material. The anode electrode is formed of an electrode material having a current density not higher than 10 mA/cm2 upon application of a voltage of +2.5V vs. silver/silver chloride electrode within a 0.1 M perchloric acid solution in an electrochemical measurement using a potentiostat.

Abstract: A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.