Abstract: An electrodeposition coating composition that is excellent in bath stability and that can give a cured film enhanced in hardness and an electrodeposition coating process is provided. An electrodeposition coating composition to be used in an electrodeposition coating process which comprises the electrodeposition step of immersing a substrate in an electrodeposition coating composition and applying a voltage between the substrate as an anode or cathode and a counter electrode to thereby form a film of said electrodeposition coating composition on the surface of the substrate, and the heating step of heating said film obtained in the above electrodeposition step, and said electrodeposition coating composition comprising having electrodeposition potentiality against the curing reaction of said film.

Abstract: A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.

Abstract: The invention relates to a method for coating workpieces. According to said method, an alloy containing at least phosphorus and nickel is precipitated from an electrolyte to produce a functional, especially corrosion-resistant and wear-resistant metallic coating. The aim of the invention is to provide a means of increasing wear resistance and hardness and improving the anti-corrosion effect with a significantly higher rate of incorporation of elementary phosphorus. To this end, an at least quarternary alloy with the components nickel, cobalt, wolfram and phosphorus is electrolytically precipitated in the form of a coating. The invention also relates to a corrosion-resistant and wear-resistant coating with essentially the following composition: 0.5 to 2.0 wt. % wolfram; 1.0 to 2.0 wt % cobalt; 15 to 20 wt. % phosphorus and at least 10 wt. % nickel.

Abstract: Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an aromatic azo compound residue. Electrolysis is then carried out. According to the present invention, the content of the fine particles present in a composite plating film composed of the fine particles and a metal can be increased.

Abstract: The present process for electrodepositing a zinc oxide film comprises the steps of immersing a substrate and an opposing electrode in an electrodeposition bath which contains zinc nitrate and is kept heated, and forming the zinc oxide film on the substrate by passing a current between the substrate and the opposing electrode, wherein the process further includes a step of trapping the particles of zinc oxide precipitated in the electrodeposition bath by circulating or stirring the bath before the formation of the zinc oxide film, whereby the present process can prevent the generated zinc oxide powder from depositing on the surfaces of the substrate and the zinc oxide film formed by electrodeposition when restarting or starting the formation of a zinc oxide film by the electrodeposition using an electrodeposition apparatus, and hence the formation of a uniform zinc oxide film free from defects.

Abstract: A method and apparatus for the electrochemical treatment of an aqueous solution in an electrolytic cell is described. Output solution having a predetermined level of available free chlorine is produced by applying a substantially constant current across the cell between an anode and a cathode while passing a substantially constant throughput of chloride ions through the cell.

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control unit (30) is arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control unit comprises an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control unit (30) alternates the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: A method of manufacturing electrode foil for aluminum electrolytic capacitors and an AC power supply unit used therewith are disclosed. An etching is performed on an aluminum foil immersed in an electrolytic solution by applying an AC current to a pair of electrodes in the electrolytic solution. A waveform of the AC current is a deformed sine wave including a period of time (a) when an electric current rises from zero to a peak value, and another period of time (b) when the electric current falls from the peak value to zero. With the periods of time (a) and (b) made different from each other, the surface area of the aluminum foil is efficiently expanded by the etching and an enhancement of electric capacity of the electrode foil is obtained.

Abstract: The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a filtration method of copper electrolyte for removing electrolytic by-products and dirt which affect copper electrolysis, by passing copper electrolyte through a filter element precoated with a filtering aid, in the present invention, a precoated layer of a filtering aid is formed on a filter element in advance. Activated carbon preliminary treatment solution containing powdery activated carbon is passed through the filter element formed with the precoated layer, and is also circulated until no powdery activated carbon leaks from an outlet of the filter element, thus forming a powdery activated carbon layer on the precoated layer. Subsequently, the copper electrolyte is passed through for filtration.

Abstract: A bath composition for the electropolishing of a metal surface made of nonalloyed titanium is disclosed. The bath composition may comprise sulfuric acid of 2 to 40% by volume, hydrofluoric acid of 10 to 18% by volume and acetic acid of 42 to 62% by volume.

Abstract: A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble &bgr;-naphtholethoxylate compound having the formula wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the formula XO3S(CH2)3SS(CH2)3SOX3 and a water-soluble mercaptopropanesulfonic acid or salt thereof having the formula HS(CH2)3SO3X, where X is sodium, potassium, or hydrogen, a water-soluble polyethylene glycol having a molecular weight ranging from about 4,600 to about 10,000, and a water-soluble polyvinylpyrrolidone having a molecular weight ranging from about 10,000 to about 1,300,000.

Abstract: In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the electroplating current during the electroplating process. Generally, for a particular electroplating bath, where the electroplating current duty cycle is greatest the NiFe electroplated material has a higher Fe at. %, and where the electroplating current duty cycle is reduced, a lower Fe at. %. Therefore, electroplated NiFe components from a single electroplating bath can have differing NiFe concentrations where the electroplating current duty cycle is altered. Additionally, NiFe components can be electroplated with a graduated or changing Ni and Fe concentration by altering the electroplating current duty cycle during the electroplating process.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a silicate containing coating or film upon a metallic or conductive surface.

Abstract: An electric energy conversion/storage system includes an ozone generating means (12) for producing an ozonized gas from a raw material gas containing oxygen by utilizing electric energy, an ozone adsorbing/desorbing means (15) for adsorbing ozone contained in the ozonized gas and desorbing ozone from the adsorbed state, a gas circulation system for causing the raw material gas and the ozonized gas to flow through the ozone generating means (12) and the ozone absorbing/desorbing means (15) while feeding back to the ozone generating means (12) a residual part of the oxygen gas remaining after adsorption of ozone, a coolant supply means (16) for cooling the ozone adsorbing/desorbing means (15), and an ozone discharging means (29, 30) for taking out an ozone containing gas which contains ozone molecules from the ozone adsorbing/desorbing means (15) to thereby supply the ozone containing gas to an ozone consumer (23).

Abstract: A part fabricating apparatus has a holder for holding an object to be machined immersed in an electrolytic solution. A machining electrode subjects a surface of the object to an electrochemical reaction to electrolytically machine the surface of the object. The machining electrode has a sharp-edged tip and is coated with an insulator except for the sharp-edged tip. A spacing changing unit detects and changes a spacing between the surface of the object and the machining electrode. A potential/current control unit controls a potential/current on the machining electrode. An electrolytic solution changing unit supplies a first electrolytic solution for subjecting the surface of the object to be machined to a removal process to fabricate a cast mold, supplies a second electrolytic solution for depositing a first metal on a surface of the cast mold to form a first metal layer, and supplies a third electrolytic solution for depositing a second metal inside the cast mold to form a part.

Abstract: Nitride layer formation includes a method wherein a material is electrodeposited on a substrate and converted, at least in part, to a layer comprising nitrogen and the electrodeposited material. The electrodepositing may occur substantially selective on a conductive portion of the substrate. Also, the converting may comprise exposing the electrodeposited material to a nitrogen-comprising plasma. Chromium nitride and chromium oxynitride are examples of nitrogen-comprising materials. Copper or gold wiring of an integrated circuit are examples of a substrate. The processing temperature during the electrodepositing and the converting may be selected not to exceed 500° C. The thickness and composition of the nitride layer may be effective to limit diffusion of the wiring through the nitride layer. A diffusion barrier forming method may include forming a patterned layer of integrated circuit copper wiring over a substrate.

Abstract: A sliding member having excellent seizure resistance comprising a metallic member provided with a sulfide-based solid lubricating layer on the sliding surface thereof is provided, characterized in that the interface of the metallic member in contact with said solid lubricating layer is provided with a surface roughness Rmax of 1 &mgr;m or higher. The sliding member above is obtained by preparing an aqueous solution dissolved therein one or two types or more of thiocyanates or thiosulfates of alkali metals or alkaline earth metals, and by performing electrolytic treatment in which a steel member the surface roughness thereof is controlled is used as the anode. In this manner, an iron sulfide based layer is formed on the surface of the steel member by using the Fe component derived from the steel and the S component from the solution as the reacting agents.

Abstract: In a production system of electrolyzed water A, alkaline water and acid water produced in a pair of electrode chambers 12, 23 of an electrolyzer 10 are discharged from discharge conduits 41, 42 through a flow passage changeover valve 50. The discharge conduits 41, 42 are provided at their outlet portions with manually operated faucets 43, 44 and 45, 46. Water flow sensors 81, 82 ate provided to be turned on and off in accordance with the flow of water supplied from a water supply conduit 24.

Abstract: The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regions of the substrate. Another method according to the present invention includes forming a uniform conductive material overburden on a top surface of the substrate. The present invention also discloses a method for depositing a second conductive material on the first conductive material of the substrate.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.