Abstract: Architecture, design, structure, layout, and method of forming a Programmable Resistive Device (PRD) memory in standard cell library are disclosed. The PRD memory has a plurality of PRD cells. At least one of the PRD cells can have a PRD element coupled to a first supply voltage line and coupled to a second supply voltage line through a program selector. The PRD cells reside in a standard cell library and following most of the standard cell design and layout guidelines.

Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: setting one of a plurality of word lines to be a program word line, setting the word lines except the program word line to be a plurality of unselected word lines; raise a voltage on the program word line from a reference voltage to a first program voltage during a first sub-time period of a program time period; raising the voltage on the program word line from the first program voltage to a second program voltage during a second sub-time period of the program time period; and raising voltages on at least part of the unselected word lines from the reference voltage to a pass voltage during the second sub-time period.

Abstract: A memory device is provided. The memory device receives a main clock signal and provides an internal main clock signal; a data clock buffer to receive a data clock signal; and a latency control circuit configured to generate latency information based on the data clock signal and provide the latency information to a data circuit. The latency control circuit includes: a divider configured to generate divided-by-two clock signals based on the data clock signal; a divider configured to generate divided-by-four clock signals based on a first group of the divided-by-two clock signals; a first synchronization detector configured to output divided-by-two alignment signals indicating whether a second group of divided-by-two clock signals is synchronized with the data clock signal; and a latency selector configured to detect phases of the divided-by-four clock signals based on the divided-by-two alignment signals and adjust a latency of the main clock signal based on the phases.

Abstract: Memory devices and systems with partial array refresh control over memory regions in a memory array, and associated methods, are disclosed herein. In one embodiment, a memory system includes a memory controller and a memory device operably connected to the memory controller. The memory device includes (i) a memory array having a plurality of memory cells arranged in a plurality of memory regions and (ii) inhibit circuitry. In some embodiments, the inhibit circuitry is configured to disable one or more memory regions of the plurality of memory regions from receiving refresh commands such that memory cells of the one or more memory regions are not refreshed during refresh operations of the memory device. In these and other embodiments, the memory controller is configured to track memory regions that include utilized memory cells and/or to write data to the memory regions in accordance with a programming sequence of the memory device.

Abstract: A carbon nanotube ternary SRAM cell with an improved stability and low standby power comprises a write bit line, a read bit line, a column select bit line, an inverted column select bit line, a write word line, an inverted write word line, a read word line, an inverted read word line, a first P-type CNFET, a second P-type CNFET, a third P-type CNFET, a fourth P-type CNFET, a fifth P-type CNFET, a sixth P-type CNFET, a seventh P-type CNFET, an eighth P-type CNFET, a ninth P-type CNFET, a first N-type CNFET, a second N-type CNFET, a third N-type CNFET, a fourth N-type CNFET, a fifth N-type CNFET, a sixth N-type CNFET, a seventh CNFET, an eighth N-type CNFET and a ninth N-type CNFET. The carbon nanotube ternary SRAM cell has the advantages of being lower in power consumption, capable of solving the half-select problem and the read-disturb problem and high in static noise margin.

Abstract: According to one embodiment, a semiconductor memory device includes the following configuration. A second word line is provided above a first word line on a substrate. A third word line is provided above the second word line. A semiconductor layer includes a first part that passes through the first word line, a second part that passes through the second and the third word lines, and is provided above the first part, and a joint provided between the first and second parts. When a write operation is performed on a memory cell of the third word line, prior to applying a write voltage to the third word line, a first voltage is applied to a bit line, a second voltage is applied to the third word line, and a third voltage higher than the second voltage is applied to the second word line.

Abstract: Methods, systems, and devices for multiple plate line architecture for multideck memory arrays are described. A memory device may include two or more three-dimensional arrays of ferroelectric memory cells overlying a substrate layer that includes various components of support circuitry, such as decoders and sense amplifiers. Each memory cell of the array may have a ferroelectric container and a selector device. Multiple plate lines or other access lines may be routed through the various decks of the device to support access to memory cells within those decks. Plate lines or other access lines may be coupled between support circuitry and memory cells through on pitch via (OPV) structures. OPV structures may include selector devices to provide an additional degree of freedom in multideck selectivity. Various number of plate lines and access lines may be employed to accommodate different configurations and orientations of the ferroelectric containers.

Abstract: A memory device is disclosed. The memory device includes a bottom contact, and a memory layer connected to the bottom contact, where the memory layer has a variable resistance. The memory device also includes a conductive top electrode on the memory layer, where the top electrode and the memory layer cooperatively form a heterojunction memory structure. The memory device also includes a lateral barrier layer connected to the bottom contact, the memory layer, and the conductive top electrode, where the lateral barrier layer is configured to substantially prevent conduction of ions or vacancies from the bottom contact, the memory layer, and the conductive top electrode to the lateral barrier layer.

Abstract: A memory device includes a buffer die including a first bump array and a second bump array spaced apart from each other in a first direction parallel to a lower surface of the buffer die; a first memory die stacked on the buffer die through a plurality of first through silicon vias and including banks; and a second memory die stacked on the first memory die by a plurality of second through silicon vias and including banks, wherein the first bump array is provided for a first channel to communicate between the first and second memory dies and a first processor, wherein the second bump array is provided for a second channel to communicate between the first and second memory dies and a second processor, and wherein the first channel and the second channel are independent of each other such that banks allocated to the first channel are accessed only by the first processor not the second processor through the first channel and banks allocated to the second channel are accessed only by the second processor not the

Abstract: A semiconductor device includes a control circuit and an address generation circuit. The control circuit generates a write column address signal, a write bank selection signal and an internal write bank selection signal from a command/address signal during a write operation. The control circuit also generates a read column address signal, a read bank selection signal and an internal read bank selection signal from the command/address signal during a read operation. The address generation circuit outputs the write column address signal as a bank group address signal in synchronization with the write bank selection signal and the internal write bank selection signal or outputs the read column address signal as the bank group address signal in synchronization with the read bank selection signal and the internal read bank selection signal.

Abstract: A memory device includes: a memory bit cell; a write circuit, coupled to the memory bit cell, and configured to use a first voltage to transition the memory bit cell to a first logic state by changing a respective resistance state of the memory bit cell, and compare a first current flowing through the memory bit cell with a first reference current; and a control logic circuit, coupled to the write circuit, and configured to determine whether the first logic state is successfully written into the memory bit cell based on a read-out logic state of the memory bit cell and the comparison between the first current and first reference current.

Abstract: Apparatuses for receiving an input signal in a semiconductor device are described. An example apparatus includes a signal receiver that receives information signal: a control circuit that provides a plurality of control signals; and a signal receiver replica circuit that receives a first reference signal. The signal receiver replica circuit includes a plurality of receivers. Each receiver of the plurality of receivers receives the first reference signal and a corresponding control signal of the plurality of control signals, and further provides an output signal.

Abstract: A method of operating a memory device includes performing a first program operation on memory cells connected to a first word line among a plurality of word lines, performing the first program operation on memory cells connected to a second word line among the plurality of word lines, applying a turn-on voltage at a first level to the first and second word lines, applying a voltage at a level lower than the first level to a third word line among the plurality of word lines, performing a precharge operation on partial cell strings among a plurality of cell strings, and performing a second program operation on the memory cells connected to the first word line.

Abstract: A non-volatile memory device having a memory chip is provided. The memory chip having a memory cell array including a plurality of memory planes sharing a pad, the pad configured to communicate input and output signals. The memory chip also having a control circuit configured to monitor operations of the plurality of memory planes, and control an operation of at least one of the plurality of memory planes based on a result of the monitoring such that peak power intervals of the plurality of memory planes are at least partially distributed.

Abstract: A data storage device can detect for a failure in decoding of an x-bit row address and/or a y-bit column of an (x+y)-bit address. The data storage device decodes the x-bit row address and/or the y-bit column address to provide wordlines (WLs) and/or bitlines (BLs) to access one or more cells from among a memory array of the data storage device. The data storage device compares one or more subsets of the WLs and/or of the BLs to each other to detect for the failure. The data storage device determines the failure is present in the decoding of the x-bit row address and/or the y-bit column of the (x+y)-bit address when one or more WL and/or BL from among the one or more subsets of the WLs and/or the BLs differ.

Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.

Abstract: A magnetoresistive memory architecture in one aspect includes a plurality of bit lines each coupled to two or more respective columns of magnetoresistive memory cells, and a plurality of source lines each coupled to a respective one of the columns of memory cells. A given memory cell can be accessed by biasing a selected word line, a selected bit line, and a selected source line coupled to corresponding column of memory cells coupled to the selected bit line, and by counter biasing one or more selected source lines coupled to one or more other columns of memory cells coupled to the selected bit line.

Abstract: According to one embodiment, a semiconductor memory device includes: a first memory cell; a second memory cell; a first word line; a second word line; and a first bit line. The device is configured to execute a first operation, a second operation, and a third operation to write data into the first memory cell. In the first operation, a first voltage is applied to the second word line. In the second operation, after the first operation, a second voltage higher than the first voltage is applied to the second word line. In the third operation, after the second operation, a third voltage higher than the second voltage is applied to the first word line, and a fourth voltage lower than both the second voltage and the third voltage is applied to the second word line.

Abstract: A semiconductor device includes a semiconductor substrate including a fin of semiconductor material having a fin width and a fin length. The fin length is greater than the fin width and extends between a first fin end and a second fin end. A gate electrode extends over the fin at a first fin location between the first fin end and the second fin end. A dummy gate electrode extends over the first fin end.

Abstract: Disclosed is a memory device. The memory device includes a memory cell array that includes a target cell, a row decoder that drive a word line, and a write driver and sense amplifier that are configured to drive a bit line and a source line. The row decoder is configured to drive the word line in a first program operation and a second program operation. Between a start of the first program operation and an end of the second program operation, the write driver and sense amplifier are configured to continuously drive a bit line connected to the target cell with a second driving voltage or drive a source line connected to the target cell with a third driving voltage.