Patents Examined by Xiaoliang Chen
  • Setting the impedance of signal traces of a circuit board using a reference trace
    Patent number: 11166367
    Abstract: A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: November 2, 2021
    Assignee: Super Micro Computer, Inc.
    Inventors: Manhtien V. Phan, Mau-Lin Chou, Chih-Hao Lee
  • Method of manufacture of a structure and structure
    Patent number: 11166380
    Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: November 2, 2021
    Assignee: TACTOTEK OY
    Inventors: Tomi Simula, Mika Paani, Miikka Kärnä, Outi Rusanen, Johanna Juvani, Tapio Rautio, Marko Suo-Anttila, Mikko Heikkinen
  • Display device
    Patent number: 11164497
    Abstract: A display device is provided. The display device comprises a display panel including a plurality of signal pads and one or more dummy pads, and at least one flexible wiring board providing signals to the signal pads, wherein a maximum bias period of signals provided to a pair of adjacent signal pads with at least one dummy pad interposed therebetween is longer than a maximum bias period of signals provided to a pair of adjacent signal pads with no dummy pad disposed therebetween.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Tae Hoon Kwon, Ji Hyun Ka, Byung Sun Kim, Yang Wan Kim, Hyung Jun Park, Su Jin Lee, Jae Yong Lee, Jin Tae Jeong, Seung Ji Cha
  • Method for improved transfer of semiconductor die
    Patent number: 11152339
    Abstract: A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: October 19, 2021
    Assignee: Rohinni, LLC
    Inventors: Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow
  • Circuit carrier, package, and method for manufacturing a package
    Patent number: 11153977
    Abstract: A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: October 19, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventor: Stefan Pfefferlein
  • Thermal conductivity for integrated circuit packaging
    Patent number: 11147153
    Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventor: Brian J. Long
  • Printed circuit board
    Patent number: 11134576
    Abstract: A printed circuit board has a first base region and a flexible region. The printed circuit board includes a core layer including a first insulating layer including a high elastic material and a first wiring layer disposed on the first insulating layer; a first build-up layer disposed on the core layer in the first base region, and including a second insulating layer including a low elastic material, and having a first through portion penetrating through the second insulating layer; and a first electronic component disposed in the first through portion and connected to the first wiring layer.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 28, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jun Oh Hwang
  • Optical module and method for manufacturing the same
    Patent number: 11134563
    Abstract: A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: September 28, 2021
    Assignee: Lumentum Japan, Inc.
    Inventor: Daisuke Noguchi
  • Display device
    Patent number: 11127667
    Abstract: A display device comprises a pad terminal area and a first circuit board attached to the pad terminal area. The pad terminal area comprises a first pad terminal area having a first pad terminal row of first pad terminals and a second pad terminal area having a second pad terminal row of second pad terminals. The first circuit board comprises a first film having a first lead terminal row of first lead terminals and a second film having a second lead terminal row of second lead terminals. The first lead terminals are connected to the first pad terminals, the second lead terminals are connected to the second pad terminals, an end of the second film protrudes outward from an end of the first film, and the second pad terminal area overlaps an area between the end of the first film and the end of the second film.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Jun Lee, Myung Ho Lee
  • Planar converter
    Patent number: 11128233
    Abstract: The present invention relates to a planar converter, comprising: a magnetic unit comprising a first planar winding and two second planar windings magnetically coupled to each other and a magnetic core assembly; two closed circuits each comprises the first planar winding, a switch, and has a first connection point and a second connection point; two PCBs each provided with at least one of the closed circuits thereon; and two first connectors each comprising two welding ends opposite to each other, wherein the two welding ends of one of the two first connectors are connected to the first connection points of the two closed circuits, respectively, and the two welding ends of another one of the two first connectors are connected to the second connection points of the two closed circuits, respectively, and the two closed circuits are connected in parallel.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: September 21, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Da Jin, Yahong Xiong, Qinghua Su
  • Rollable display device and electronic device including the same
    Patent number: 11129274
    Abstract: A rollable display device includes a rollable structure including a plurality of unit structures, the rollable structure being configured to be rolled and unrolled based on the unit structures, and a display panel structure attached to the rollable structure, wherein respective widths of the unit structures increase in a first direction from a first side of the rollable structure to an opposite second side of the rollable structure.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: September 21, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jin-Hwan Choi, Min-Sung Kim, Tae-An Seo, Jung-Hun Lee
  • Printed circuit board and package having the same
    Patent number: 11122694
    Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae-Hong Min, Ju-Ho Kim
  • Flexible display panel and flexible display device
    Patent number: 11119538
    Abstract: A flexible display panel and a flexible display device are provided. The flexible display panel includes: a first insulating layer; a plurality of leads disposed above the first insulating layer, the plurality of leads passing through a predetermined bending region of the flexible display panel; a second insulating layer above respective one of the leads; where at least one of the leads is provided with at least one first hollow portion in the predetermined bending region, and the first insulating layer and the second insulating layer are connected via the at least one first hollow portion. In this way, product performance can be improved.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: September 14, 2021
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Yongda Ma, Xueguang Hao, Yong Qiao
  • Methods and apparatus to implement microphones in thin form factor electronic devices
    Patent number: 11119532
    Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Sumod Cherukkate, Gopinath K, Prakash Kurma Raju, Ajesh K K
  • Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
    Patent number: 11114421
    Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: September 7, 2021
    Assignee: INTEL CORPORATION
    Inventors: Eng Huat Goh, Wee Hoe, Khang Choong Yong, Ping Ping Ooi
  • Electronic device
    Patent number: 11109482
    Abstract: According to one embodiment, an electronic device includes a flexible printed wiring board includes an insulating layer, a plurality of connection pads provided on one side of the insulating layer and constituting a group, and a pad provided on another surface side of the insulating layer and having heat conductivity, wherein the pad overlaps one or more connection pads positioned at an outer edge of the group of connection pads via the insulating layer and comprises a portion extending on the outside of the connection pad on the outer edge, and a connection member includes a plurality of connection terminals connected to the connection pads via a solder.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 31, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Kota Tokuda, Nobuhiro Yamamoto
  • High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits
    Patent number: 11109486
    Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: August 31, 2021
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Zhenqiang Ma, Guoxuan Qin, Namki Cho
  • Mini smart card and method of manufacturing the same
    Patent number: 11106961
    Abstract: A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: August 31, 2021
    Assignee: BEAUIIFUL CARD CORPORATION
    Inventor: Meng-Jen Cheng
  • Electrical connection device
    Patent number: 11102887
    Abstract: An electrical connection device includes a first conductive plate provided with a cutout in a circumferential edge portion of the first conductive plate and a second conductive plate adjacent to the first conductive plate without contacting the first conductive plate. A switching element includes a first terminal connected to the first conductive plate, a second terminal connected to the second conductive plate, and a control terminal, and that is turned on or off according to a voltage of the control terminal, wherein the electrical connection device further includes an insulator embedded in the cutout. A conductive path is provided on the surface of the insulator and that does not contact the first conductive plate, and to which the control terminal is connected.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: August 24, 2021
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Akira Haraguchi
  • Printed circuit board
    Patent number: 11102886
    Abstract: A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Jung Sung, Tae Seong Kim, Jae Woong Choi