Patents Examined by Xiaoliang Chen
  • Hybrid nanosilver/liquid metal ink composition and uses thereof
    Patent number: 11510314
    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 22, 2022
    Assignee: XEROX CORPORATION
    Inventors: Naveen Chopra, Barkev Keoshkerian, Chad Steven Smithson, Kurt I. Halfyard, Michelle N. Chretien
  • Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant
    Patent number: 11504453
    Abstract: A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: November 22, 2022
    Assignee: VERILY LIFE SCIENCES LLC
    Inventors: Alexander Loo, Damiano Patron, Matthew Page
  • Light-emitting module for vehicle lamp
    Patent number: 11506352
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 22, 2022
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • Systems and methods for hybrid glass and organic packaging for radio frequency electronics
    Patent number: 11503704
    Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 15, 2022
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Stanton Earl Weaver, Jr., Joseph Alfred Iannotti
  • Thermal management in circuit board assemblies
    Patent number: 11503700
    Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: November 15, 2022
    Assignee: KUPRION INC.
    Inventor: Alfred A. Zinn
  • Multilayer wiring board and probe card including same
    Patent number: 11497126
    Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 8, 2022
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Nitride ceramic resin composite body
    Patent number: 11492299
    Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: November 8, 2022
    Assignee: DENKA COMPANY LIMITED
    Inventors: Yoshitaka Minakata, Eri Sasaki, Toshitaka Yamagata, Saori Inoue, Ryo Yoshimatu, Ryuji Koga
  • Method for manufacturing wiring board, and wiring board
    Patent number: 11490528
    Abstract: Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: November 1, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kazuaki Okamoto, Hiroshi Yanagimoto, Rentaro Mori
  • Interposer printed circuit boards for power modules
    Patent number: 11490517
    Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: November 1, 2022
    Assignee: ABB POWER ELECTRONICS, INC.
    Inventors: John Andrew Trelford, Richard John Yeager, Alok Kumar Lohia, Thang Danh Truong
  • Flexible printed circuit board
    Patent number: 11483928
    Abstract: A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: October 25, 2022
    Assignees: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshiro Adachi, Yoshifumi Uchita, Yoshio Oka
  • Pattern plate for plating and method for manufacturing wiring board
    Patent number: 11479860
    Abstract: A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 25, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takayoshi Nirengi, Hideo Iguchi
  • Cover film for flexible printed circuit board and flexible printed circuit board
    Patent number: 11477884
    Abstract: According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: October 18, 2022
    Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Takuma Hitotsumatsu, Hideki Kashihara
  • Apparatus and method relating to electrochemical migration
    Patent number: 11470727
    Abstract: Embodiments of the present invention provide a method (1000) of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising plating (1010) a surface of the one or more conductors with a layer comprising tin; annealing the plating; applying (1020) solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper; and annealing the electrical circuit.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: October 11, 2022
    Assignee: JAGUAR LAND ROVER LIMITED
    Inventor: Thomas Liedtke
  • Current introduction terminal, and pressure holding apparatus and X-ray image sensing apparatus therewith
    Patent number: 11470722
    Abstract: A current introduction terminal includes a board made of resin. The board has a first face and a second face opposite each other. The board hermetically separates environments of different air pressures from each other. A plurality of through via holes corresponding both to a plurality of metal terminals of a first surface-mount connector to be mounted on the first face and to a plurality of metal terminals of a second surface-mount connector to be mounted on the second face are formed to penetrate between the first and second faces, and then hole parts of the through via holes are filled with resin.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: October 11, 2022
    Assignee: RIKEN
    Inventors: Yuji Matsuda, Takashi Kameshima, Osami Sugata, Toshiaki Tosue
  • Component carrier with embedded component and horizontally elongated via
    Patent number: 11470714
    Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a via formed in the at least one electrically insulating layer structure along a horizontal path having a length being larger than a horizontal width.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: October 11, 2022
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Gin Feng, Sally Sun, Seok Kim Tay, Mikael Tuominen
  • Wiring substrate
    Patent number: 11464104
    Abstract: A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: October 4, 2022
    Assignee: KYOCERA CORPORATION
    Inventor: Keizou Sakurai
  • Method for depositing functional traces
    Patent number: 11464115
    Abstract: The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: October 4, 2022
    Assignees: MGI DIGITAL TECHNOLOGY, INKJET ENGINE TECHNOLOGY
    Inventors: Edmond Abergel, Louis Gautier Le Boulch, Clement Beges
  • Circuit board, apparatus and method for forming via hole structure
    Patent number: 11457529
    Abstract: Provided are a circuit board, an apparatus and a method for forming a via hole structure. A via hole structure formed on a main body (10) of a circuit board includes a hole (12) enclosed by a conductive layer in the main body (10), the conductive layer constitutes a wall (11) of the hole (12), and a dielectric filling layer (13), which has a dielectric constant smaller than that of the main body (10), is disposed between at least a portion of the wall (11) of the hole (12) and the main body (10), so that the parasitic capacitance of a via hole is decreased, and the impedance of the via hole is increased to become closer to the impedance of a transmission line, thereby effectively improving impedance continuity of a system link.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: September 27, 2022
    Assignee: ZTE CORPORATION
    Inventors: Changgang Yin, Yingxin Wang, Bi Yi, Huazhang Cao
  • Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
    Patent number: 11452215
    Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: September 20, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryosuke Sasaoka, Naoki Shibata, Yasunari Oyabu
  • Display device
    Patent number: 11445622
    Abstract: A display device includes a display panel including a display area on which a plurality of display elements is disposed and a non-display area on which one or more wires for driving the plurality of display elements are disposed. A back cover is attached to one surface of the display panel and has a plurality of openings. A roller unit winds or unwinds the back cover and the display panel, and a lifting unit moves the back cover and the display panel in a vertical direction. The plurality of openings overlaps the display panel, and each of the plurality of openings is disposed to be staggered with one or more of the openings in an adjacent row. A size of the back cover is larger than a size of the display panel.
    Type: Grant
    Filed: February 20, 2021
    Date of Patent: September 13, 2022
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Mi-Na Shin, ChounSung Kang, SunBok Song, GeunChang Park, Moonsun Lee