Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

Abstract: According to one embodiment, an electronic device includes a flexible printed wiring board includes an insulating layer, a plurality of connection pads provided on one side of the insulating layer and constituting a group, and a pad provided on another surface side of the insulating layer and having heat conductivity, wherein the pad overlaps one or more connection pads positioned at an outer edge of the group of connection pads via the insulating layer and comprises a portion extending on the outside of the connection pad on the outer edge, and a connection member includes a plurality of connection terminals connected to the connection pads via a solder.

Abstract: A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

Abstract: An electrical connection device includes a first conductive plate provided with a cutout in a circumferential edge portion of the first conductive plate and a second conductive plate adjacent to the first conductive plate without contacting the first conductive plate. A switching element includes a first terminal connected to the first conductive plate, a second terminal connected to the second conductive plate, and a control terminal, and that is turned on or off according to a voltage of the control terminal, wherein the electrical connection device further includes an insulator embedded in the cutout. A conductive path is provided on the surface of the insulator and that does not contact the first conductive plate, and to which the control terminal is connected.

Abstract: A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

Abstract: A display device is provided that includes a case comprising a bottom portion and a sidewall to define a receiving space in which the display device is accommodated. The display device comprises a display module with a display panel for displaying an image, a folding area, and a plurality of non-folding areas, and a circuit board electrically connected to the display panel. The folding area is capable of being folded about a folding axis and the non-folding areas are disposed adjacent to both sides of the folding area. A receiving groove is defined in the bottom portion of the case corresponding to a part mounting area of the circuit board. The circuit board is disposed on a rear surface of the display module.

Abstract: An embodiment includes generating a sense signal that represents a first vibration of a platform, and reducing a level of the first vibration by generating, in response to the sense signal, a second vibration in the platform. For example, a sensor generates a sense signal representing a first vibration induced (e.g., a shock-induced vibration) in the platform. And a vibration-cancel circuit reduces or eliminates a level of the first vibration in response to the sense signal. For example, the vibration-cancel circuit reduces a magnitude of a first vibration induced in a platform, or eliminates the first vibration altogether, by generating, in the platform, a second vibration having a magnitude approximately equal to the magnitude of the first vibration and having a phase approximately opposite to the phase of the first vibration. That is, the second vibration cancels the first vibration to reduce the net vibration that the platform experiences.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.

Abstract: According to an embodiment, a flexible circuit board includes: a first substrate; a second substrate disposed on the first substrate and including an opening; a first conductive pattern part disposed on a bottom surface of the first substrate; a second conductive pattern part disposed on a top surface of the second substrate; a third conductive pattern part disposed between the first substrate and the second substrate; and an upper protective layer partially disposed on the second conductive pattern part and including a first open region, wherein the third conductive pattern part includes: a first inner lead pattern part disposed in the opening of the second substrate; and a first extension pattern part connected to the first inner lead pattern part, the second conductive pattern part includes: a second inner lead pattern part disposed in the first open region of the upper protective layer; and a second extension pattern part connected to the second inner lead pattern part, and a number of first inner lead pa

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: A display device and a manufacturing method of the same are provided. The display device includes a frame, a pressure sensor, and a pressure sensing module. When a touch portion receives external pressure, a resistance value of the resistor changes, and a corresponding pressure sensing signal is output. The pressure sensing module outputs an execution signal according to the pressure sensing signal to realize a pressure touch function on a side of the frame. This eliminates a need to make holes in a side of the frame, which eliminates a mechanical button and improves dustproof and waterproof performance of the display device.

Abstract: The fitting structure for a conductive sheet of this invention comprises: a conductive member which is arranged within a predetermined region in a front case of an electronic device that has the front case and a rear case, said cases being first and second case pieces that are separably joined to each other, and which is electrically connected to ground patterns of the electronic device; and a conductive sheet which is arranged within the rear case so as to face the predetermined region of the front case and comprises a conductive layer. In a state where the front case and the rear case are joined with each other, the conductive layer of the conductive sheet is in contact with the conductive member and is electrically connected to the ground patterns of the electronic device.

Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

Abstract: A rollable display device is disclosed. The rollable display device includes a rollable display panel, a roller configured to roll and unroll the rollable display pane, and a first printed circuit board electrically connected to the rollable display panel. The first printed circuit board comprises a curved surface having a curvature that matches a curvature of a curved surface of the roller. The first curved surface of the printed circuit board is in contact with the curved surface of the roller.

Abstract: The present disclosure provides a display screen and a display apparatus, pertaining to the field of display technologies. The display screen includes: a backplane, a printed circuit board and a fixing adhesive, wherein the printed circuit board is fixed to the backplane by the fixing adhesive.

Abstract: The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based electronic circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.

Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.