Patents Examined by Yuriy Semenenko
  • Patent number: 10390424
    Abstract: A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: August 20, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takanori Ito
  • Patent number: 10381910
    Abstract: A linear vibration generating device, which includes a stator fixed on a bracket and having a center yoke concentrically fixed in an inner space of coil winding units and at least one blade extending from the center yoke in a direction perpendicular to the concentric axis, and a vibrator having a magnet surrounding outer circumferences of the coil winding units, and an elastic body disposed between the stator and the vibrator. The blade has at least one passage through which a coil wire for electrically connecting the coil winding units passes.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: August 13, 2019
    Assignee: JAHWA electronics Co., Ltd.
    Inventors: Soon Koo Shim, Young Bin Chong, Chun Choi, Won Gook Lee, Min Goo Lee
  • Patent number: 10368439
    Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: July 30, 2019
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Aleksandar Aleksov, Sasha N. Oster, Shawna M. Liff
  • Patent number: 10361631
    Abstract: A circuit assembly for a power converter includes power stage blocks. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of the substrate that is opposite to the side where the power stage IC dies are disposed. A power stage block may generate two output phases of the power converter.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: July 23, 2019
    Assignee: MONOLITHIC POWER SYSTEMS, INC.
    Inventors: Jinghai Zhou, Chia-Hsin Chang
  • Patent number: 10356900
    Abstract: A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: July 16, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jung Yun Jo, Jeong Do Yang
  • Patent number: 10355541
    Abstract: An axial flux machine includes a modulated stator, a rotor, and a plurality of spacers. The modulated stator includes plural stator units. Each stator unit includes a magnetic core and at least one winding. The magnetic core has first plate, a second plate, and a sidewall connecting the first plate to the second plate, and the winding is disposed on the magnetic core. The stator units construct the modulated stator. By modulating the stator, the slot fill factor and the cogging torque performance can be improved. The spacers are disposed to isolate the magnetic cores. The rotor is disposed in the modulated stator and includes plural first magnetic pieces and second magnetic pieces arranged alternately, and the magnetic flux lines of the first and second magnetic pieces respectively pass through sidewalls of the magnetic cores to construct C-type magnetic loops of opposite directions thereby improving power density.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: July 16, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Ching-Hsiung Tsai, Chu-Ju Li, You-Chiuan Hsu
  • Patent number: 10348176
    Abstract: A vibration motor includes a housing; a stator; an vibrator accommodated in the housing; an elastic piece suspending the vibrator in the housing; a protrusion protruding along the center axis from the hole wall of the accommodation hole and formed at a position on the mass block corresponding to and fit with the bending structure; at least two magnets fixed on one side of the first side walls far from the hole wall of the accommodation hole. The vibrator includes a mass block with an accommodation hole, a center axis passing through a geometrical center thereof along a vibration direction of the vibrator; and a yoke disposed along a hole wall of the accommodation hole. The yoke includes a first side wall, a second side wall, and bending structures.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: July 9, 2019
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Lubin Mao
  • Patent number: 10349530
    Abstract: A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: July 9, 2019
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Robert C. Cooney, John Huss, Kandy Elaine Spahr, Deron J. Staas, Mark W. Metzler, Debabrata Pal
  • Patent number: 10347864
    Abstract: A display device includes a display device, a window, and an adhesive material. The display panel includes a display area and a non-display area. The window is on the display panel. The adhesive material is between the display panel and the window. The window includes a base substrate and a blocking barrier. The base substrate includes a first area overlapping the display area, a second area overlapping the non-display area, and a third area protruding outwardly from the display panel. The blocking barrier is on the second area of the base substrate, includes convex patterns and an inner surface facing a central portion of the base substrate. The inner surface of the blocking barrier and the convex patterns contact the adhesive material.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: July 9, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Jae Hong Kim
  • Patent number: 10349521
    Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: July 9, 2019
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Hannes Voraberger
  • Patent number: 10340301
    Abstract: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Volume Chien, Yun-Wei Cheng, I-I Cheng, Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Mu Huang
  • Patent number: 10331161
    Abstract: A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a plurality of first through holes and a plurality of second through holes capable of being electrically connected with the processor by penetrating through the first board from the top surface to the bottom surface; a second board arranged at a position distant from the bottom surface of the first board and provided with a power supply device; a first conductor mounted on the bottom surface of the first board and electrically connects the plurality of first through holes and the power supply device, and a second conductor mounted on the bottom surface of the first board and electrically connects the plurality of second through holes and the power supply device.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: June 25, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yuki Kanai, Takashi Imamoto
  • Patent number: 10332827
    Abstract: Various applications of interconnect substrates in power management systems are described.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: June 25, 2019
    Assignee: Volterra Semiconductor Corporation
    Inventors: Mihalis Michael, Kwang Hong Tan, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos
  • Patent number: 10334718
    Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: June 25, 2019
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Michael Sperber
  • Patent number: 10332678
    Abstract: A power storage module includes: a power storage unit with a plurality of power storage elements; and a circuit unit attached to the power storage unit. The circuit unit includes: a high-current member through which a composite current obtained from the plurality of power storage elements flows; a low-current member through which a detection current for detecting a state of the individual power storage elements flows; and a lower case and an upper case that hold the high-current member and the low-current member.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: June 25, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideyuki Kuboki, Hiroki Hirai, Makoto Higashikozono, Kenji Nakagawa
  • Patent number: 10333193
    Abstract: A printed circuit board and a printed circuit board includes a signal transmitting part; a ground part that includes an impedance adjusting part and a dummy part; and an insulating layer disposed between the signal transmitting part and the ground part.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: June 25, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Park, Han Kim
  • Patent number: 10327326
    Abstract: Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 18, 2019
    Assignee: Apple Inc.
    Inventors: Brad G. Boozer, Colin M. Ely, Steven P. Cardinali
  • Patent number: 10327328
    Abstract: To provide a printed circuit board that allows for easy exchange of only a deterioration detection conductor, and can reduce costs. A printed circuit board includes: a main printed circuit board in which a wiring pattern is formed on an insulated substrate; and a deterioration detection wiring board in which deterioration detection wiring (deterioration detection wiring pattern) which is wiring having a form whereby deterioration is promoted compared to the wiring pattern on the insulated substrate is formed on a separate insulated substrate from the main printed circuit board, and is exchangeably connected to the main printed circuit board in a vicinity thereof by way of a replacement-enabling connection part.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 18, 2019
    Assignee: FANUC CORPORATION
    Inventors: Takeshi Sawada, Yuichi Okochi, Norihiro Saido
  • Patent number: 10321569
    Abstract: Electronic module with all-sided electromagnetic interference (EMI) shielding and methods of making same. The electronic module includes an encapsulated circuit board between a top plate and a conductive bottom plate, electrical leads extending from the circuit board through the bottom plate, and a continuous conductive coating substantially covering the entire electronic module except for a bottom surface of the bottom plate. The conductive coating forms direct, independent connections at least to the circuit board and the bottom plate. The conductive coating provides EMI shielding across the top and sides of the electronic module. The conductive bottom plate provides EMI shielding across the bottom of the electronic module. Methods of manufacturing include encapsulating a circuit board between a top plate and bottom plate, separating materials from the encapsulated circuit board to expose conductive traces on the circuit board and bottom plate, and coating the sawed device with a conductive coating.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: June 11, 2019
    Assignee: VPT, INC.
    Inventors: Stephen J. Butler, Anthony G. Salamone
  • Patent number: 10320048
    Abstract: A communication device includes a circuit board having an upper surface and a lower surface, an upper housing disposed on the upper surface, and a lower housing disposed on the lower surface. The circuit board includes a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. The upper housing includes a depression corresponding to the top cavity, and the lower housing includes an aperture corresponding to the bottom cavity.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: June 11, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventor: Ping-Chin Tseng