Patents Examined by Yuriy Semenenko
  • Patent number: 11304294
    Abstract: A display device includes a flexible first substrate including a display part, a bending part provided at one side of the display part, and a pad part provided at an end of the bending part, wherein the display part includes a plurality of pixels; a second substrate facing the display part; a back film including a first film part and a second film part separated from the first film part, wherein the first film part is adhered to the display part of the flexible first substrate, and the second film part is adhered to the pad part; and a supporting member disposed between the first film part and a second film part.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 12, 2022
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ji Sun Park, Dal Jae Lee, Ji Yong Jeong
  • Patent number: 11304293
    Abstract: A display apparatus includes a display panel which have first display pads arranged in a first direction, a main circuit board, a first flexible circuit board which includes first substrate pads connected to the main circuit board and the first display pads and a first driving chip connected to the first substrate pads, and is bent in a direction toward a back surface of the display panel, and a protective member disposed on the first flexible circuit board. The protective member covers the first driving chip.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: April 12, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yoo jeong Lee, Hyunseop Song, Minsoo Kang, Yeong Won Kim
  • Patent number: 11291116
    Abstract: An integrated circuit structure and method of forming is provided. A die is placed on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: March 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Jui-Pin Hung, Kuo-Chung Yee
  • Patent number: 11284547
    Abstract: An electronic device including a flexible display module, the flexible display module including a flexible display panel, the flexible display panel having a display portion, a panel bending portion and a display pad portion, a flexible circuit board connected with the display pad portion and disposed at a rear surface of the flexible display panel and an electrostatic shielding member covering the panel bending portion of the flexible display panel.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 22, 2022
    Assignee: LG DISPLAY CO., LTD.
    Inventor: Insik Shin
  • Patent number: 11284505
    Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: March 22, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ping-Han Tsou, Li-Chien Wan
  • Patent number: 11277114
    Abstract: An elastic wave device includes an interdigital transducer electrode and a wiring electrode made of metal and provided on a first main surface of a piezoelectric substrate. Via hole electrodes penetrate the piezoelectric substrate. Each via hole electrode is connected to an external connection terminal. A cover member defines a hollow space in which the interdigital transducer electrode is sealed, together with the first main surface of the piezoelectric substrate. A heat dissipating member is provided on the wiring electrode to extend from the wiring electrode toward the cover member and penetrate the cover member.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Taku Kikuchi, Daisuke Sekiya
  • Patent number: 11277901
    Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a method for fabricating a ceramic device can include forming a plurality of conductive features on or through a selected layer along a boundary between a first region and a second region, each conductive feature extending into the first region and the second region. The method can also include forming an assembly that includes the selected layer and one or more other layers. The method can further include separating the first region and the second region along the boundary such that each of the first region and the second region forms a side wall, the side wall including exposed portions of the conductive features, the exposed portions capable of forming electrical connection with a conductive shielding layer.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: March 15, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Shaul Branchevsky, Howard E. Chen, Anthony James Lobianco
  • Patent number: 11264742
    Abstract: The display device includes: a display panel; a first circuit board having a first portion connected to one portion of the display panel and comprising a connector; and a second circuit board electrically connected to the first circuit board through the connector, wherein the first portion includes a base film, a dummy pad disposed on the base film, and a first solder mask partially covering the dummy pad and exposing a portion of the dummy pad, the dummy pad includes a covered region covered by the first solder mask and an exposed region exposed by the first solder mask, and a solder ball, The exposed region of the dummy pad is connected to the connector through a solder ball.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: March 1, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chan Yoon Woo, Seung Hwan Cheong, Ah Young Son
  • Patent number: 11257746
    Abstract: A silicon interconnect fabric includes: (1) a substrate having a front side and a back side; (2) a front side patterned metal layer on the front side of the substrate; (3) a back side patterned metal layer on the back side of the substrate; (4) multiple conductive vias extending through the substrate and connecting the front side patterned metal layer and the back side patterned metal layer; and (5) multiple conductive posts connected to the back side patterned metal layer.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: February 22, 2022
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Boris Vaisband, Subramanian S. Iyer, Adeel A. Bajwa
  • Patent number: 11252822
    Abstract: A flexible printed circuit (FPC) board includes a base film, a pair of traces and a chip. The pair of traces are disposed on the base film, and each trace has opposite first and second terminals. The chip is disposed on the base film and has pins that are respectively coupled to the first terminals of the traces. When the FPC board is bonded to a panel through the second terminals of the traces that are shorted to each other, the chip is configured to transmit a detection signal through one of the pins and receive a reception signal through the other of the pins, and to determine whether the FPC board works normally with the panel depending on the reception signal.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: February 15, 2022
    Assignee: Himax Technologies Limited
    Inventor: Hsuan-Ching Liu
  • Patent number: 11252813
    Abstract: An advantageous effect of a low-pass filter that reduces high-frequency noise can be obtained by including an input terminal that extends from a front surface to a rear surface of a multilayer circuit board including a double-sided circuit board; a first wiring conductor having an end connected to the input terminal on the rear surface of the multilayer circuit board; a first via that extends from an other end of the first wiring conductor to the front surface of the multilayer circuit board; a second wiring conductor having an end connected to the first via on the front surface of the multilayer circuit board; and a first input capacitor disposed on the second wiring conductor; by being conductive due to the input terminal and the first via being configured in series; and including the first input capacitor.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: February 15, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshihisa Minami, Takuya Ishii
  • Patent number: 11252812
    Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Seung Hyun Hong, Jang Hyun Kim
  • Patent number: 11239220
    Abstract: The present disclosure provides a semiconductor package. The semiconductor package includes a carrier member, a plurality of inductors and a memory chip. The carrier member includes a first surface, a second surface and a centrally-located opening. The carrier member also includes a plurality of conductive pads on the second surface proximal to the opening. The memory chip is attached to the carrier member in a face-down manner. The memory chip includes a plurality of bidirectional and unidirectional signal-transmission pins electrically coupled to the inductors. The memory chip also includes a plurality of bonding pads. A plurality of bonding wires, passing through the opening, electrically connect the bonding pads on the memory chip to the conductive pads on the carrier member. A first insulative structure substantially encapsulates the memory chip and the inductors. A plurality of solder balls are attached to the second surface of the carrier member.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: February 1, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Wu-Der Yang
  • Patent number: 11217576
    Abstract: Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: January 4, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Quang Nguyen, Christopher Glancey, Shams U Arifeen, Koustav Sinha
  • Patent number: 11219143
    Abstract: The present disclosure provides a control unit of display device and a display device. The control unit of display device includes: a back plate a plurality of circuit structures, the plurality of circuit structures being arranged on the back plate; a plurality of electric field shielding structures, each of the electric field shielding structures being arranged between the circuit structures and configured to shield an electric field between the circuit structures, wherein each of the electric field shielding structures includes a plurality of shielding strips, the plurality of shielding strips are spaced apart from each other and projections of the shielding strips on a corresponding side of the circuit structure are continuous and uninterrupted.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: January 4, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Pan Li, Yong Qiao
  • Patent number: 11212919
    Abstract: A voltage regulator module includes a circuit board assembly, a magnetic core assembly and a molding compound layer. The circuit board assembly includes a printed circuit board and at least one switch element. The switch element is disposed on a first surface of the printed circuit board. Moreover, at least one first copper post, at least one second copper post, at least one third copper post and the magnetic core assembly are disposed on a second surface of the printed circuit board. The magnetic core assembly includes at least one opening. The at least one first copper post is penetrated through the corresponding opening, so that at least one inductor is defined by the at least one first copper post and the magnetic core assembly collaboratively. The molding compound layer encapsulates the printed circuit board and the magnetic core assembly in a double-sided molding manner.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: December 28, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yahong Xiong, Shaojun Chen, Da Jin, Qinghua Su
  • Patent number: 11211838
    Abstract: According to the present invention, provided is an IPM rotor of the present invention, which includes a plurality of core sheets, having hole portions configured to accommodate magnets and being laminated on one another, and the magnets are inserted in the hole portions. The IPM rotor includes a first core sheet having a spring plate portion provided to the hole portion, and a second core sheet having a recessed portion provided the hole portion. A protruding portion is provided to the hole portion of at least one of the plurality of the laminated core sheets. The protruding portion is provided to at least one of the hole portion of the first core sheet, the hole portion of the second core sheet, or a hole portion of a third core sheet to be further arranged.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: December 28, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Aida, Masafumi Okazaki, Yuji Takizawa, Satoru Akutsu, Hideya Nishikawa, Akihiko Mori
  • Patent number: 11204093
    Abstract: An electronic module (1) includes a first electronic submodule (2) and at least one further electronic submodule (3, 4). The first electronic submodule (2) and the at least one further electronic submodule (3, 4) are electrically conductively connected to each other with an electrical conductor (5, 6), which is reversibly deformable, at least in sections. The first electronic submodule (2), the at least one further electronic submodule (3, 4), and the electrical conductor (5, 6) are encased in a fluid-tight manner with a casing (15), which is reversibly deformable, at least in sections. An actuator device includes at least one mechanical module and the electronic module (1). A method for manufacturing such an actuator device is also provided.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: December 21, 2021
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Matthias Reisch, Michael Arnegger, J├╝rgen Wafzig
  • Patent number: 11202371
    Abstract: A multilayer substrate includes a stacked body obtained by stacking a plurality of insulating base material layers, a driver IC including a plurality of mounting electrodes, coils, and magnetic sensors. The driver IC and the magnetic sensors are mounted to the stacked body. The coils include a first end and a second end that are electrically connected to the driver IC through a conductive bonding material. The first end and a mounting electrode are connected at one position through the conductive bonding material.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: December 14, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Shingo Ito
  • Patent number: 11201602
    Abstract: Apparatus and methods for tunable filtering are provided. In certain embodiments, a tunable filter is implemented using one or more controllable capacitors formed on a semiconductor die and using one or more shielded integrated inductors formed on a secondary circuit board that attaches to a carrier circuit board. Additionally, the shielded integrated inductors are formed from patterned metallization layers of the secondary circuit board, and shielding is provided on the secondary circuit board and/or the carrier circuit board to shield the inductors from the semiconductor die and/or other components.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: December 14, 2021
    Assignee: Analog Devices, Inc.
    Inventors: Ekrem Oran, Faith Kocer, Santosh Kudtarkar, John Poelker, Po-Hao Yeh, Christopher O'Neill, Christoph Steinbrecher