Patents Examined by Yuriy Semenenko
  • Patent number: 10925156
    Abstract: The present disclosure provides a circuit board structure and a display panel, the circuit board structure includes mounting substrates and a flexible conductive substrate, and the flexible conductive substrate is connected between two adjacent mounting substrates to connect the two mounting substrates together.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: February 16, 2021
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Wenxin Li
  • Patent number: 10925167
    Abstract: A computing system includes a circuit board assembly and multiple expansion cards connected to one another and also connected to the circuit board assembly. The connected expansion cards form a modular expansion card bus that allows the expansion cards to communicate between each other without routing the communications through the circuit board assembly. In some embodiments, the expansion cards are mounted on a tray that includes mounting pins that engage mounting slots of the expansion cards, allowing for simple installation of various combinations of expansion cards connected together to form a modular expansion card bus.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: February 16, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Kevin Bailey, Priscilla Lam, Darin Lee Frink, Jason Alexander Harland, Felipe Enrique Ortega Gutierrez
  • Patent number: 10916493
    Abstract: A direct current (DC) blocking capacitor can be used with an integrated circuit (IC) package. The DC blocking capacitor can include a first electrically conductive planar surface having a first area and a second electrically conductive planar surface having a second area greater than the first area. The second planar surface is in a parallel planar orientation to the first planar surface. The DC blocking capacitor can also include a first set of electrically conductive plates electrically connected to the first planar surface and a second set of electrically conductive plates electrically connected to the second planar surface. The second set of electrically conductive plates is interleaved with and electrically insulated from the first set of electrically conductive plates by a dielectric material.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Darryl Becker, Mark J. Jeanson, Gerald Bartley, Matthew Doyle
  • Patent number: 10912208
    Abstract: A housing contacting system of a control device, including: a housing cover and a base element which together define an interior of the control device; a printed circuit board having a front side and a rear side, wherein a conductive surface layer is formed on the rear side and the printed circuit board is arranged in the interior; and a spring element which is at least partially electrically conductive and is arranged between the conductive surface layer and the base element under spring prestress in order to implement rear-side contacting of the printed circuit board. Also described are a related brake control device, a utility vehicle, and a method.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: February 2, 2021
    Assignee: KNORR-BREMSE SYSTEME FUER NUTZFAHRZEUGE GMBH
    Inventors: Elena Mueller, Norbert Behrendt, Klaus Lechner, Karin Pohley
  • Patent number: 10910789
    Abstract: A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: February 2, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Markus Pindl, Bernhard Stich, Andreas Wojcik
  • Patent number: 10912201
    Abstract: Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: February 2, 2021
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Akihiko Hanya, Tsukasa Imura
  • Patent number: 10901276
    Abstract: A display device includes a display substrate comprising a plurality of pixels electrically connected to select lines and data lines; first connection pads disposed on an upper surface of the display substrate and electrically connected to the pixels; and second connection pads disposed on a surface of the display substrate that is different from the upper surface and electrically connected to the pixels, wherein the second connection pads are electrically separated from the first connection pads. This allows the area of a surface of a display substrate that can be occupied by a flexible printed circuit board attached thereto to be increased. As a result, the risk of an open-circuit of the wiring can be reduced, and the operational reliability of the device can be improved.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: January 26, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Min Su Jung, Han Bum Kwon
  • Patent number: 10905011
    Abstract: A state detecting device which can be applied even in a severe environment. The state detecting device includes a chargeable all-solid-state battery, a piezoelectric element which supplies charging power to the all-solid-state battery, and an integrated circuit including various sensors which operate with electric power supplied from the all-solid-state battery. The all-solid-state battery, the piezoelectric element, and the integrated circuit are mounted on one surface of a flexible substrate. The flexible substrate is attached to a flexible object which is either an object to be measured or constitutes at least part of an inner surface of a space to be measured.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: January 26, 2021
    Assignee: TDK Corporation
    Inventors: Masafumi Kami, Hiroshi Kobayashi, Tamon Kasajima
  • Patent number: 10897811
    Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: January 19, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Seung Hyun Hong, Jang Hyun Kim
  • Patent number: 10893606
    Abstract: A display device includes: a display panel including: a substrate foldable about a folding axis of the display device, and a pad portion provided in plurality including a first pad portion and a second pad portion respectively disposed at opposing sides of the folding axis; and a flexible printed circuit film commonly attached to the first pad portion and the second pad portion of the display panel. The flexible printed circuit film commonly attached to the first and second pad portions of the display panel defines a cut-out portion of the flexible printed circuit film which is located on an extension line of the folding axis of the display device.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Heechul Jeon
  • Patent number: 10886213
    Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 5, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Teruhiro Kuwajima, Yasutaka Nakashiba, Akira Matsumoto, Akio Ono, Tetsuya Iida
  • Patent number: 10877521
    Abstract: A display device includes a flexible substrate, a display element on the flexible substrate and including a thin film transistor, a metal layer disposed at a lower portion of the flexible substrate, and an air layer formed between the flexible substrate and the metal layer.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: December 29, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyo Jung Kim, Tae Young Kim, Jong Woo Park, Dae Youn Cho, Ki Ju Im, Young Tae Choi
  • Patent number: 10880994
    Abstract: An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: Russell S. Aoki, Jeffory L. Smalley, Jonathan W. Thibado
  • Patent number: 10877330
    Abstract: Disclosed is a display device comprising: a display panel; a driver chip; the driver chip is provided with a plurality of chip pins disposed spaced from each other, and the distance between at least two adjacent chip pins is different from the distance value between the other two chip pins; and a driving circuit board, the driving circuit board is provided with a plurality of circuit board contact points, and a circuit board contact point is connected to a chip pin correspondingly.
    Type: Grant
    Filed: March 3, 2019
    Date of Patent: December 29, 2020
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Haiyan Nong
  • Patent number: 10877520
    Abstract: An electronic device is disclosed herein, including a first face oriented in a first direction, the first face formed having a curvature and disposed as to be visible from an exterior of the electronic device, a body including a second face oriented towards a second direction opposite to the first direction, the second face visible from the exterior, and a display module visible when viewing the first face, the display module including a flexible display disposed under a window, and the window including a central visible area formed in a substantially rectangular shape including first, second, third and fourth visible areas disposed adjacent to four respective edges of the central visible area.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: December 29, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Dong Hun Kim, Jung Sik Park, Min Sung Lee, Chung Ha Kim, Joo Ho Seo, Han Gil Song, Seung Ah Oh, So Young Lee, Jung Won Lee, Jong Chul Choi
  • Patent number: 10867540
    Abstract: A circuit board comprising a first sub-circuit board, a second sub-circuit board, and a circuit connection structure. The first and second sub-circuit board having a first and second connection terminal, respectively. The circuit connection structure has a first port for mating with the first connection terminal, and a second port for mating with the second connection terminal. The first connection terminal, the second connection terminal, the first port, and the second port are configured such that when the first sub-circuit board is connected to the second sub-circuit board through the circuit connection structure, a first connection terminal end face faces the first port in a first direction, and a second connection terminal end face faces the second port in a second direction, and an angle between the first direction and the second direction is greater than 90° and less than or equal to 180°.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: December 15, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Yong Qiao, Jianbo Xian
  • Patent number: 10869388
    Abstract: A display device includes a flexible first substrate including a display part, a bending part at one side of the display part, and a pad part at one side of the bending part; a back film adhered to a portion corresponding to the display part and the pad part on a bottom of the first substrate; a supporting member disposed below a portion of the back film corresponding to the display part, wherein the supporting member is not bent, and wherein the bending part of the first substrate is bent along a side of the supporting member; and a second substrate facing the display part.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: December 15, 2020
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ji Sun Park, Dal Jae Lee, Ji Yong Jeong
  • Patent number: 10861741
    Abstract: Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 8, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kurt Peter Wachtler, Anindya Poddar, Usman Mahmood Chaudhry
  • Patent number: 10856723
    Abstract: A medical circuit board includes a substrate on which a wiring pattern is formed, a plurality of electronic components mounted in a mounting area on the substrate, a resinous sealing member covering the plurality of electronic components, with which the plurality of electronic components are sealed to the substrate, and a detection unit provided in an area other than the mounting area on the substrate and detecting an infiltration of a liquid from an interface between the substrate and the sealing member into the mounting area. At least a part of the detection unit is covered with the sealing member and sealed with the sealing member to the substrate.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: December 8, 2020
    Assignee: SONY OLYMPUS MEDICAL SOLUTIONS INC.
    Inventor: Masahiro Hagihara
  • Patent number: 10863619
    Abstract: A display apparatus includes a display panel including: a bending region having a curvature region and a facing region adjacent to the curvature region; and a non-bending region adjacent to the bending region and spaced apart from the facing region. The curvature region is disposed between the facing region and the non-bending region. The display apparatus further includes: a first protective member disposed in the non-bending region; a flexible circuit board connected to the display panel in the facing region; a stress relief member disposed in the curvature region; and an adhesive member disposed in the facing region. The adhesive member has a higher modulus of elasticity than that of the stress relief member and is coupled to the flexible circuit board.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kichang Lee, Myoung-ha Jeon