Abstract: What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

Abstract: A cooling system simultaneously cools both a power module and a vehicle motor. A vehicle motor housing is provided in thermal communication with a plurality of manifolds. Each manifold defines a cooling fluid inlet, a cooling fluid outlet, and a distribution recess providing fluid communication. The distribution recess may be defined by a wall having an exterior major surface in thermal communication with the vehicle motor. A manifold fluid insert may be disposed within the distribution recess, defining a plurality of inlet branch channels and outlet branch channels. A power module may be coupled to the manifold and a heat sink feature. A flow of coolant fluid is provided from each cooling fluid inlet, through the inlet branch channels of the manifold fluid insert for impingement with the heat sink feature, returning through the outlet branch channels and to the cooling fluid outlet of the respective manifold.

Abstract: A display panel and chip-on-film (COF) package bonding structure is provided and includes a display panel including a panel substrate and a plurality of panel bonding pins. The panel bonding pins are disposed on the panel substrate and are arranged along a lateral direction. Each of the panel bonding pins is trapezoidal and is directed along a longitudinal direction. A COF package is bonded to the display panel and includes a package substrate and a plurality of package bonding pins. The package bonding pins are disposed on the package substrate, are arranged along the lateral direction, and are bonded to the panel bonding pins respectively. Each of the package bonding pins is trapezoidal and along the longitudinal direction. The trapezoidal panel bonding pins and package bonding pins can be aligned with and contacts each other.

Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

Abstract: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first surface finish on one or more electrical routing features located on a first side of a package substrate and on one or more lands located on a second side of the package substrate, the second side being opposite the first side of the substrate. The method may further include removing the first surface finish on the first side of the package substrate; and depositing a second surface finish on the one or more electrical routing features of the first side. The depositing of the second surface finish may be accomplished by one of a Direct Immersion Gold (DIG) process or an Organic Solderability Preservative (OSP) process. Other embodiments may be described and/or claimed.

Abstract: A touch display panel and a liquid crystal display device are disclosed. The touch display panel comprises: a substrate (1); a Chip-On-Film (COF) (2), one end of the COF (2) being bound on the substrate and the other end of the COF (2) having a first binding pin (21); and a flexible circuit board (3), one end of the flexible circuit board (3) being bound on the substrate (1) and the other end of the flexible circuit board (3) having a second binding pin (31), wherein a width L2 of the second binding pin (31) is greater than a width L1 of the first binding pin (21).

Abstract: An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.

Abstract: A liquid crystal apparatus includes a first wiring substrate on which a first driving IC is mounted, a second wiring substrate disposed to overlap the first wiring substrate, a first terminal group electrically connected to the first wiring substrate and including a terminal electrically connected to the first driving IC, a second terminal group electrically connected to the second wiring substrate and including another terminal electrically connected to the terminal, and a monitoring pad provided on the second wiring substrate and electrically connected to the other terminal.

Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Abstract: A voltage regulator module includes a first circuit board, a switching circuit and a second circuit board. The switching circuit is disposed on a first surface of the first circuit board. A first contact pad is disposed on a second surface of the first circuit board. The switching circuit is connected with the contact pad through a conductive hole of the first circuit board. A first surface of the second circuit board is in contact with the first surface of the first circuit board. The first surface of the second circuit board includes a second contact pad. The second contact pad is fixed on the corresponding first contact pad. A second surface of the second circuit board includes a conductive pad. The conductive pad is connected with the corresponding second contact pad through a conductive hole of the second circuit board. The conductive pad is connected with a system board.

Abstract: A flexible circuit film, which is capable of preventing broken portions during an assembly process, and an electronic device comprising the same is disclosed. The flexible circuit film comprises a bonding pad portion, a body portion, and a film bending portion between the bonding pad portion and the body portion, wherein at least some portion of the film bending portion has a thickness that is less than a thickness of the body portion.

Abstract: A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.

Abstract: A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.

Abstract: A flexible conductor track (10) for connecting electronic modules, includes conductor track structures (12), two connecting regions (14, 16) for electrically connecting the conductor track structures (12) to corresponding conductor tracks of electronic modules, and at least one long slit (18, 20) in a region (11) in the conductor track (10) located between the two connecting regions. At least one of the connecting regions is designed to be connected to a corresponding connecting region of an electronic module by anisotropic conductive film adhesive (ACFA) bonding.

Abstract: A cable holding element configured for attachment to either an angled frame having internal corners, or external corners or both. The cable holding element includes a base body and rows of latching projections that project from the base body to define at least one channel area for holding cable. The latching projections each have a first section and a second section. The first section and the second section form an acute angle towards the base body. A first row of latching projections opposes a second row of latching projections. The opposing latching projections cooperate to interlock without contact, in a comb-like manner to hold cable within the cable holding element and to form guiding structure that guides cable into and out from the channel area. In an alternate embodiment, the cable holding element has a flat base body capable of attachment to a planar surface.

Abstract: A data connection apparatus of a supporting apparatus includes a stationary part and a movable part. One of the stationary and movable parts has a circuit board having a number of electrically conductive pads, and the other has a receptacle within which the circuit board is received, such as when a circuit interrupter is moved to an installed position within a cassette of a draw-out switchgear cabinet. The data connection apparatus includes a housing within which the receptacle is formed, with the housing having a plurality of electrical contacts within the receptacle. The housing and the circuit board each have relieved regions in the exemplary form of ramped surfaces and edges that facilitate reception of the circuit board in the receptacle. Moreover, the circuit board and the housing are situated on structured that afford a certain level of flexibility to further facilitate reception of the circuit board in the receptacle.

Abstract: A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.

Abstract: An alternating current/direct current input device includes an appliance input socket and an information and communications technology (ICT) device. The ICT device is powered by the appliance input socket. The appliance input socket includes a ground contact, a positive electrode contact, a negative electrode contact, and a signal switch. A contact depth of the signal switch in the appliance input socket is less than a contact depth of the positive electrode contact or the negative electrode contact in the appliance input socket. The signal switch is configured to generate a control signal when a direct current connector is separated from the appliance input socket. The control signal can be used to enable the ICT device to disconnect the appliance input socket from a conductive electrode of the direct current connector after the ICT device enters a no load state.

Abstract: The disclosure provides a display panel and a display device. In an array substrate of the display panel, at least two protrusions are defined on a side of a non-display region away from a display region to form an extending portion. A recess is defined between adjacent protrusions. A driver chip is disposed in a space between a periphery of a display region and a periphery of a non-display region. Distances between the driver chip, the periphery of the display region, and the periphery of the non-display region are increased. A bending section of a flexible circuit board is disposed in the recess. As a result, width of the non-display region will not be increased.