Patents Examined by Yuriy Semenenko
-
Patent number: 11089686Abstract: The invention concerns a data acquisition device (10) comprising a casing (11) defining a cavity (20), and a plurality of electronic modules (12) suitable for being stacked in the cavity (20), each electronic module (12) having a first face and a second face opposite the first face, and comprising a first set of conductive tracks extending over the first face, and a second set of conductive tracks sending over the second face, the first set of conductive tracts comprising at least one conductive track for transmitting a data signal, and the second set of conductive tracks comprising at least one conductive track for transmitting the data signal, making it possible to propagate the data signal from one module to another through the entirety of the stack, whatever the order of stacking of the electronic modules (12) in the cavity (20).Type: GrantFiled: April 19, 2019Date of Patent: August 10, 2021Assignee: SAFRAN DATA SYSTEMSInventors: Ghislain Guerrero, Olivier Pinto
-
Patent number: 11083077Abstract: A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage.Type: GrantFiled: April 28, 2020Date of Patent: August 3, 2021Assignee: Rambus Inc.Inventors: Kyung Suk Oh, Ralf M. Schmitt, Yijiong Feng
-
Patent number: 11079742Abstract: An automated breadboard wiring assembly includes a breadboard with holes therein defining at least two nodes and at least a primary wiring board. The primary wiring board has a wiring matrix composed of a plurality of interconnected wiring segments, each wiring segment having a switch therealong. A plurality of contacts are interconnected with the wiring matrix with a switch positioned between each contact and the wiring matrix. Each contact is configured to engage a respective one of the breadboard nodes. An input device is configured to indicate desired wires between nodes and the locations of the desired wires define wiring information. A microprocessor configured to receive wiring information from the input device and open selective ones of the switches such that an electrical path along selective ones of the contacts and the wire segments is defined to correspond to each desired wire set forth in the wiring information.Type: GrantFiled: December 18, 2020Date of Patent: August 3, 2021Inventor: Austin Small
-
Patent number: 11075474Abstract: A display module including display panel, first flexible connectors, second flexible connectors and printed circuit board (PCB) is provided. The first flexible connectors are electrically connected to the display panel. The second flexible connectors are respectively electrically connected to the first flexible connectors, and the second flexible connectors are electrically connected to the PCB.Type: GrantFiled: January 22, 2020Date of Patent: July 27, 2021Assignee: DARWIN PRECISIONS CORPORATIONInventor: Chi-Fu Chang
-
Patent number: 11076488Abstract: A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.Type: GrantFiled: November 12, 2019Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Hyung Ham, Jae Sung Sim
-
Patent number: 11069482Abstract: A capacitive element is provided that includes a substrate, a lower electrode on the substrate, first upper electrodes disposed to face the lower electrode, second upper electrodes disposed to face the lower electrode, a dielectric layer disposed between the lower electrode and the first upper electrodes and between the lower electrode and the second upper electrodes, a first wiring conductor that connects the first upper electrodes, and a second wiring conductor that connects the second upper electrodes. The first and second upper electrodes are adjacent to each other in a surface direction along the lower electrode and in an X-axis direction, and the first and second upper electrodes are adjacent to each other in the surface direction along the lower electrode and in a Y-axis direction.Type: GrantFiled: August 21, 2019Date of Patent: July 20, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Toshiyuki Nakaiso
-
Patent number: 11057997Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).Type: GrantFiled: June 25, 2019Date of Patent: July 6, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Tomomi Yasuda
-
Patent number: 11056949Abstract: Provided a rotating electrical machine including a rotor; a stator; and a fluid control mechanism has a first member and a second member, and is configured to create a flow of a fluid directed from one side toward the other side in an axial direction of the rotating shaft, on an outer periphery of the rotor. The first member has a portion at which the outside diameter increases gradually from the one side toward the other side, and is configured such that a shape of an outer circumferential surface is continuous with the shape of an outer circumferential surface of an end portion, in an axial direction, of the rotor. The second member is configured such that an inside diameter increases gradually from the one side toward the other side at a portion facing the portion of the first member at which the outside diameter increases gradually.Type: GrantFiled: September 12, 2019Date of Patent: July 6, 2021Assignee: Toyota Jidosha Kabushiki KaishaInventor: Takahiro Sadamitsu
-
Patent number: 11057998Abstract: A method for the spaced connection of printed circuit boards is described. For this purpose, the printed circuit boards and at least one installation unit including one distance element and one laminar cover element, respectively, as well as one fixing element per installation unit are provided. The distance element is positioned and fixed on the first printed circuit board. Subsequently, the cover element is penetrated in the region of an intake opening of the distance element. The fixing element is inserted into the intake opening and connected with the second printed circuit board. Further on, an installation element and an installation assembly for the spaced connection of two printed circuit boards are described.Type: GrantFiled: August 29, 2019Date of Patent: July 6, 2021Assignee: Würth Elektronik eiSos GmbH & Co. KGInventor: Stefan Klingler
-
Patent number: 11050321Abstract: A conduit plug for attachment to a motor case includes a base partly defining a central passage extending along a longitudinal axis of the plug. The base has a skirt extending radially with respect to the longitudinal axis and two circumferentially-spaced straight-edge segments. The plug further includes a ribbed tube cooperatively defining the central passage and extending from the skirt opposite the two straight-edge segments. Each of the two straight-edge segments includes a camming clip configured for resilient retraction toward the central passage.Type: GrantFiled: September 16, 2019Date of Patent: June 29, 2021Assignee: Nidec Motor CorporationInventor: Marc J. Corcoran
-
Patent number: 11051396Abstract: Disclosed is an electronic device. The electronic device may include a printed circuit board (PCB) including at least one conducting wire, a first integrated circuit (IC) placed on the printed circuit board and including a transmit pin electrically connected to the at least one conducting wire, and a second IC placed on the printed circuit board and including a receive pin electrically connected to the at least one conducting wire, wherein the first IC is configured to transmit a specified signal having a first voltage through the transmit pin, and change an internal impedance of the first IC based on a reflected signal of the specified signal at a first time point.Type: GrantFiled: September 9, 2019Date of Patent: June 29, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Cheolho Lee, Seungjoon Yoon
-
Patent number: 11044812Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.Type: GrantFiled: May 21, 2019Date of Patent: June 22, 2021Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventor: Hannes Voraberger
-
Patent number: 11039538Abstract: A communication system includes a flexible circuit board, a plurality of antennas disposed on the flexible circuit board, and a radio frequency (RF) tag. A distance between the RF tag and at least one antenna among the plurality of antennas is detected based on a signal emitted by the RF tag and received by the at least one antenna. Further, a deformation of the flexible circuit board is detected based on the distance between the RF tag and the at least one antenna.Type: GrantFiled: July 23, 2020Date of Patent: June 15, 2021Assignee: Whoborn, Inc.Inventors: Youngsik Bae, WonSuk Do
-
Patent number: 11036258Abstract: An image display apparatus includes a rollable display; a drive unit configured to roll up or roll down the rollable display; a network interface unit configured to exchange data with at least one mobile terminal; and a controller configured to change a height of the rollable display based on data received from the at least one mobile terminal.Type: GrantFiled: June 29, 2020Date of Patent: June 15, 2021Assignee: LG ELECTRONICS INC.Inventors: Kwangsoo Choi, Ilho Seo, Sukhyun Hong
-
Patent number: 11032935Abstract: A support structure for a flexible interconnect of a superconducting system can include a support member that is formed of thermally conductive material. The support member can include a plurality of parallel slots. Each slot can extend from a first surface of a base of the support member to a second surface of the base. The first and second surfaces of the base can be positioned on parallel planes and each slot can be shaped to allow relative movement of a fastener that allows a respective connector assembly to be affixed to the support member. Moreover, the respective connector assembly can provide mechanical support for the flexible interconnect of the superconducting system and establish a heat path between the flexible interconnect and the support member. The support member can also include a wall extending transverse from the first surface of the base, the wall comprising a plurality of through-holes.Type: GrantFiled: December 10, 2019Date of Patent: June 8, 2021Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Katharine Kramer Ferster, Jonathan Francis Van Dyke
-
Patent number: 11032904Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.Type: GrantFiled: June 12, 2019Date of Patent: June 8, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hirokazu Yazaki, Keito Yonemori, Takanori Tsuchiya, Koji Kamada, Takashi Noma
-
Patent number: 11031359Abstract: A capacitor loop substrate assembly may include a substrate with a loop shape, one or more capacitors or other electronic components on the substrate, and an opening in the substrate to allow the capacitor loop substrate assembly to be coupled to an integrated circuit package, such as a package including a die. Interconnects and/or contacts for interconnects may be formed in an integrated circuit package to couple the capacitor loop substrate assembly to the integrated circuit package.Type: GrantFiled: November 20, 2017Date of Patent: June 8, 2021Assignee: Intel CorporationInventors: Jenny Shio Yin Ong, Tin Poay Chuah, Chin Lee Kuan
-
Patent number: 11030145Abstract: A server includes an adapter device, multiple storage modules and multiple controllers. The adapter device includes a base circuit board having opposite first and second surfaces, multiple first connectors disposed on the first surface along a first direction and connected to the base circuit board, and multiple second connectors disposed on the second surface along the first direction in pairs, each of which is arranged along a second direction, is connected to the base circuit board and is disposed between adjacent two of the first connectors. Each of the storage modules is connected to a corresponding first connector. Each of the controllers is connected to a corresponding second connector.Type: GrantFiled: May 6, 2019Date of Patent: June 8, 2021Assignee: Jabil Inc.Inventor: Fengquan Zheng
-
Patent number: 11031156Abstract: Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.Type: GrantFiled: July 26, 2019Date of Patent: June 8, 2021Assignee: RAYTHEON COMPANYInventor: Rigel Q. Woida-O'Brien
-
Patent number: 11013275Abstract: Elastic electrical connectors that may be incorporated into a garment to connect multiple electrical components in the garment. These electrical connectors are typically long strips of fabric substrate to which wires are attached along a length of one side in a sinusoidal or zig-zag pattern. The connector may also include an adhesive coating on one side to secure it to a fabric. The wires are electrically insulated, which may be a thermoremovable insulation (e.g., a polyurethane having a melting point of <400° C.). The wires may be attached to the surface of the fabric strip by a stitch at each peak and trough of the sinusoidal or zig-zag pattern with a length between peak and trough stitches between about 1 mm and 15 mm.Type: GrantFiled: May 15, 2020Date of Patent: May 25, 2021Assignee: L.I.F.E. Corporation S.A.Inventors: Gianluigi Longinotti-Buitoni, Andrea Aliverti, Fabrizio Pallai