Patents Examined by Zachary M. Pape
  • Patent number: 10165711
    Abstract: An electrical device comprising electrical components, the electrical components of the electrical device being arranged in at least two separate compartments (1, 2) having walls, wherein the at least two compartments are substantially closed and arranged at a distance from each other and the walls of the at least two compartments are arranged to form walls of a cooling channel (7) between the compartments (1, 2).
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 25, 2018
    Assignee: ABB Schweiz AG
    Inventors: Aaro Pallasmaa, Jaakko Hyytiä
  • Patent number: 10153525
    Abstract: An arrangement may include an electrical component and a heat exchanger arranged on the electrical component for controlling a temperature of the component. An electrically insulating isolation layer may be arranged at least partially between the heat exchanger and the component. The isolation layer may be connected to at least one of the component and the heat exchanger via a materially cohesive connection.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: December 11, 2018
    Assignee: Mahle Behr GmbH & Co. KG
    Inventors: Thomas Himmer, Volker Schall, Christopher Laemmle, Stefan Hirsch, Oliver Heeg
  • Patent number: 10153629
    Abstract: An electrical joint is provided. The electrical joint includes a first conductive component, a second conductive component, and a thermal cooling interface positioned between the first and second conductive components, the thermal cooling interface including a base plate coupled to the first conductive component, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, the plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: December 11, 2018
    Assignee: ABB Schweiz AG
    Inventor: Peter James Greenwood
  • Patent number: 10128640
    Abstract: A retrofitting device for medium voltage panels which comprises a plurality of first and second horizontal CB contacts aligned in a first and second horizontal plane, a plurality of first and second vertical SWG contacts aligned in a first and second vertical plane, a first bar assembly comprising first connection elements for connecting each of said first horizontal CB contacts with a corresponding first vertical SWG contact, a second bar assembly comprising second connection elements for connecting each of said second horizontal CB contacts with a corresponding second vertical SWG contact, said first connection elements comprising a first portion and a second portion linked to each other and free to change the angular position with respect to each other in a vertical plane when in an unlocked condition, said second connection elements comprising a third portion and a fourth portion linked to each other and free to change the angular position with respect to each other in a vertical plane when in an unlocked
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: November 13, 2018
    Inventors: Fabio Pellegrini, Stefano Magoni, Carlo Gemme, Giorgio Magno
  • Patent number: 10128639
    Abstract: A power distribution system includes a server rack comprising a vertically stacked plurality of power shelf assemblies. Each assembly has first and second opposing sides defining vertical planes, and third and fourth opposing sides extending between the first and second sides. For each assembly, a first bus bar extends along a horizontal plane between the third and fourth sides, a second bus bar extends along the horizontal plane between the first bus bar and the first side of the assembly, a first set of power supply pins extends along the horizontal plane from the first bus bar toward the second side of the assembly, and a second set of power supply pins extends along the horizontal plane from the second bus bar toward the second side of the assembly, wherein the second set of power supply pins further protrude through respective apertures in the first bus bar.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: November 13, 2018
    Assignee: Bel Power Solutions Inc.
    Inventor: Marek Lach
  • Patent number: 10130000
    Abstract: An electronic system includes a rack assembly including a first rail and a second rail defining a first width therebetween and a chassis that supports electronic components and is insertable between the first rail and the second rail. The chassis includes a first side and a second side defining a second width therebetween that is less than the first width. The electronic system further includes a power connector coupled to the chassis and movable between a first position and a second position. The power connector and the second side define a third width when the power connector is in the first position. The power connector and the second side define a fourth width when the power connector is in the second position. The third width is greater than the first width and the fourth width is less than the first width.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: November 13, 2018
    Assignee: ABB Schweiz AG
    Inventors: Mark Allen Johnson, Edward Clark Fontana, Charles Edward Higby
  • Patent number: 10123461
    Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: November 6, 2018
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Angela Chen, Soheil Farshchian, Winnie Leung, Michael Chi Kin Lau
  • Patent number: 10122161
    Abstract: A mast head apparatus includes a mast head enclosure defining a plurality of stab slots and defining a wire access opening, the plurality of stab slots being vertically aligned along a vertical axis of the mast head enclosure, the wire access opening disposed at a bottom portion of the mast head disclosure.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: November 6, 2018
    Assignee: BUSWAY SOLUTIONS, LLC
    Inventors: Mark H. Baldwin, Eric N. Shatzer
  • Patent number: 10117362
    Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 30, 2018
    Assignee: Excalibur IP, LLC
    Inventors: Scott Noteboom, Albert Dell Robison
  • Patent number: 10117356
    Abstract: A heat sink connector pin includes a pin assembly with linkage that provides the movement of a pin head or cap in a downward movement to cause multiple movable fingers at an opposing end of the pin to mechanically move from a retracted position that allows insertion of the heat sink connector pin through an opening in the substrate, such as a through-hole, to move to an outward extended position so that the multiple fingers engage or grasp a bottom surface of the substrate. In one example, the movable fingers are rotatably connected to share a same rotational axis with each other. In one example, the pin assembly includes a sleeve adapted to receive the shaft structure and is adapted to engage with the pin head. The sleeve includes a substrate stop surface adapted to contact a top surface of the substrate during insertion of the pin through the substrate.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 30, 2018
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Donald L. Lambert
  • Patent number: 10111363
    Abstract: A system for transferring heat by free convective flows of coolant inside a flexible container is disclosed. The flexible container is able to fully conform with the surface of base and heat sources, and the coolant filled inside the flexible container can easily create free convective flows in a narrow gap for continuously and efficiently remove the heat from the heat sources. A method for forming a heat transfer module is disclosed. The flexible container can be placed on the heat sources and then being inflated by the coolant to fully conform with the surface of base and heat sources. Alternatively, the inflated flexible container is being pressed to fully conform with the surface of base and heat sources during assembly of the heat transfer module.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: October 23, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Yu-Ming Chen
  • Patent number: 10108232
    Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: October 23, 2018
    Assignee: CAREFUSION 303, INC.
    Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
  • Patent number: 10103086
    Abstract: A fixing frame for a heat sink includes boards, at least one foldable plate, and connection members. The boards surround a hollow area, and the hollow area includes a main accommodating space and at least one subsidiary accommodating space at one side of the main accommodating space. At least one foldable plate is detachably connected to one of the boards and is disposed in the subsidiary accommodating space. The connection members are disposed on the boards. By means of the connection members, the fixing frame mounts the heat sink on a circuit board of various sizes to dissipate heat therefrom.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: October 16, 2018
    Assignee: ABLECOM TECHNOLOGY INC.
    Inventor: Chen-Tang Lin
  • Patent number: 10103692
    Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 16, 2018
    Assignee: CommScope Technologies LLC
    Inventors: Sammit A. Patel, Yongjie Xu, Qiyun Gu, Richard W. Brown
  • Patent number: 10104815
    Abstract: An organic EL display apparatus includes: a display panel; a plate-shaped base disposed on a rear surface side of the display panel; a flexible wiring substrate; a circuit substrate; an electronic component attached to at least one of the wiring substrate and the circuit substrate; a heat conductive member attached to a rear surface of the electronic component; a rear structural member disposed to cover the heat conductive member; and a connecting member that connects the base and the rear structural member and generates a compressive force that compresses the heat conductive member being sandwiched by the electronic component and the rear structural member.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 16, 2018
    Assignee: JOLED INC.
    Inventor: Kenichi Masumoto
  • Patent number: 10096979
    Abstract: A gas-insulated electrical device includes a covering film covering an inner surface of a ground tank filled with an insulation gas. The covering film is formed of an insulation dielectric covering film that becomes more positively charged than metals in a triboelectric series, and becomes positively charged upon contact with metal foreign matter. At the same time, the metal foreign matter becomes negatively charged upon contact with the covering film. In a case where the high-voltage conductor is charged to a negative polarity, a Coulomb's force acts on the metal foreign matter in contact with the covering film in a direction away from the high-voltage conductor. The metal foreign matter in the ground tank is thus suppressed from floating.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: October 9, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Manabu Yoshimura, Takashi Miyamoto, Soichiro Kainaga, Hitoshi Sadakuni
  • Patent number: 10098263
    Abstract: A data center can include an inflatable enclosure in which rack computer systems can be installed and can provide computing capacity. The inflatable enclosure includes an inflatable structure which is at least partially inflated based on cooling air discharged into the inflatable enclosure by one or more cooling modules. A cooling module can include a cooling system and a cooling air vent, where the cooling system adjustably induces a stream of cooling air and the cooling air vent adjustably directs the cooling air stream into a particular space enclosed by an inflatable structure. The inflatable enclosure can be established by separate modules positioned on opposite sides of a space and an inflatable structure which extends across the space between the modules. The inflatable structure can be extended over additional spaces to expand the inflatable enclosure, thereby providing additional space to install rack computer systems.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: October 9, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Stephanie Towner, Brock Robert Gardner, Giorgio Arturo Pompei
  • Patent number: 10091910
    Abstract: A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: October 2, 2018
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: An-Chih Wu, Mu-Shu Fan, Hsin-Chang Chen, Hung-Yi Kuo, Ming-Chieh Li
  • Patent number: 10091884
    Abstract: A display device includes a display panel, a printed circuit board under the display panel and having one surface on which a driving chip is mounted, a first reinforcing member between the display panel and the printed circuit board, and a second reinforcing member under the printed circuit board, configured to face the printed circuit board having the driving chip therebetween, the second reinforcing member having a recessed groove in one surface facing the driving chip and the driving chip being in the recessed groove.
    Type: Grant
    Filed: August 6, 2016
    Date of Patent: October 2, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jihoon Kim, Yongmin Kim
  • Patent number: 10085366
    Abstract: Enhanced cooling for electronic components within a computing device is provided. Blowers are preferably leveraged as air movers, and an airflow deflection surface (preferably configured as a ramp) is disposed within a plenum to guide airflow under an electronic component (such as a hard disk drive or solid state drive), the electronic component being placed in an inverted alignment whereby a surface having a higher heat transfer rate is facing down (toward the blower), and then into an intake of the blower. Air output from the blower may then pass into a downstream plenum formed at least in part by the blower, an inverted downstream electronic component, and a support member thereof, thus providing serial cooling of the downstream component. Anti-recirculation flaps are preferably disposed at the air output of the blower.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: September 25, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: William J. Anderl