Abstract: An information processing device includes: a case; a base member that includes an attachment hole and a positioning hole, and that is provided inside the case; a switch that is fixed to the base member; a button member that includes an operation button that moves toward and away from the switch; an anchor member that is provided at the button member, and that includes an insertion tab that is inserted into the attachment hole and a claw that projects out from a leading end side of the insertion tab and that is hooked onto an edge portion of the attachment hole; and a positioning protrusion that is provided at the button member, and that is inserted into the positioning hole, the positioning hole being formed in an elongated hole shape extending along a projection direction of the claw.

Abstract: A modular data storage system can consist of at least first and second enclosures spanning a single pair of rails. The first and second enclosures may each have keyed couplers that mate to align the first and second enclosures along a common plane while being suspended between the single pair of rails.

Abstract: According to an embodiment, an electronic device includes a housing, metal patches, and a first metal member. The housing includes a bottom, a lid, and a side unit. The side unit is disposed to enclose a space between the bottom and the lid. A circuit substrate is disposed on a bottom surface of the bottom. The side unit is conductive and connected to a ground potential. The metal patches are disposed on a lid surface of the lid. The metal patches are arranged periodically in a first direction and a second direction. The second direction intersects the first direction. The metal patches are connected to the ground potential. The first metal member is disposed on the lid surface. The first metal member is connected to the ground potential. The first metal member includes a first portion. The first portion contacts a first surface of the side unit.

Abstract: A vehicle power module assembly including an array of frames each defining a passthrough and step is provided. The frames may be stacked such that the passthroughs are in at least partial registration with one another and the steps align to define an inlet manifold having first and second chambers extending a length of the array. The chambers may be partially open to one another such that the steps influence a momentum of coolant traveling from the first to the second chamber. A pair of endplates may be disposed on either end of the array and configured to retain the frames therebetween. Each of the frames may further define a pair of channels and may be arranged with one another to define a power stage cavity therebetween. A power stage may be disposed within the power stage cavity.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: An optical transceiver cooling assembly includes stacked cages mounted to a PCB. A heat radiator also is mounted on the PCB. Cooling devices (e.g., heat pipes) are coupled to the heat radiator and at least one of the cages. In some embodiments, the cages may include a divider that extends beyond the cage and is coupled to at least one of the cooling devices outside the cage. In some embodiments, the cooling devices extend into the cage and may be coupled together.

Abstract: A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. The energy module may supply power to at least one of heat generating component in the portable electronic device. A heat remover composed of graphene may be in thermal contact with the at least one of the components. The heat remover may also disposed over a surface of the energy module and may be formed one or more heat conduction path.

Abstract: A connecting system of a multi-section housing provided at one end face of a first and second housing superposed with their display surfaces at the outsides, comprising: a first shaft vertical to superposed surfaces of first and second housing; and a second shaft perpendicular to the first shaft, wherein if a center line of the first shaft is arranged on a line bisecting the end face to the left and right and the center line of the second shaft is arranged on the superposed surfaces of the first and second housing, the first shaft can be used to allow the second housing superposed over the first housing to be rotated by 180 degrees and, in this state, the first housing can be made to rotate by the second shaft by 180 degrees so as to arrange the display surfaces of the first and second housings on the same plane.

Abstract: A power conversion device includes a casing, a middle plate and a converter module. The casing includes a base plate. The base plate has a concave recess therein. The base plate forms a base plate convex hull at a side opposite to the concave recess. The middle plate has a middle plate groove therein. The middle plate groove corresponds to the base plate convex hull. The middle plate and the base plate combine up, such that the base plate convex hull fluidly seals the middle plate groove, making the middle plate groove to form a first coolant channel. The converter module is at least partially located in the concave recess.

Abstract: A data center micro-module includes: an enclosure, and a cabinet system, a power supply system, and a cooling system that are inside the enclosure. The cabinet system installs a computing server, the power supply system supplies power for the computing server and the cooling system, and the cooling system cools the computing server; and the enclosure is further externally provided with an interface configured to connect to another data center micro-module or connection apparatus. The foregoing data center micro-module integrates the power supply system, the cooling system and the computing server into a same module, and therefore can be directly manufactured in a factory. When a data center is built, the data center micro-modules only need to be combined and assembled, which greatly reduces a construction cycle of the data center, and the hardware architecture may be flexibly changed according to a specific deployment requirement.

Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Abstract: A system and method of forming the system. Rack containers include rack units stacked in a first direction that is parallel to a floor. Each rack unit has wheels positioned on a supporting structure on the floor which enables adjacent rack containers to move closer to or further from each other. The supporting structure is on the floor and is oriented in the second direction. The second direction is parallel to the floor and perpendicular to the first direction. A cooling conduit is secured on a top surface of each rack container to allow a cooling fluid to flow through a flexible tube into each rack container via the cooling conduit that encapsulates the flexible tube.

Abstract: An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.

Abstract: A cooling system for an automatic control component includes a frame. The frame includes a front side, a back side, a first side wall, and a second side wall. The cooling system also includes a stay coupled to the frame. Additionally, the cooling system includes a locking mechanism coupled to the front side of the frame. The locking mechanism is configured to move between a locked position and an unlocked position to secure the frame to a control module assembly. Moreover, the cooling system includes a fan positioned within the frame. The fan is configured to cool internal electronics of the control module assembly and the fan receives operative energy from the control module assembly. The cooling system also includes a printed circuit board secured within the stay and configured to receive power from the control module assembly and supply power to the fan.

Abstract: A liquid cooling heat dissipation device includes a heat-dissipating module and a liquid supply module. The liquid supply module includes an outer cover body disposed on the heat-dissipating module and at least one pump disposed inside the outer cover body. The outer cover body has an inner space divided into a first independent space adjacent to the heat-dissipating module and a second independent space far away from the heat-dissipating module and insulated from the first independent space, the at least one pump includes a stator disposed inside the first independent space and a rotator disposed inside the second independent space, and the stator is closer to the heat-dissipating module than the rotator. The instant disclosure further provides an electronic device using the liquid cooling heat dissipation device.

Abstract: A vehicle power module assembly is provided. The vehicle power module assembly may include a multi-level housing defining first and second chambers, an inlet opening into the first chamber, and an outlet opening from the second chamber. The housing may be configured such that the chambers form a stepped manifold to influence momentum of a coolant flow between the inlet and outlet. A frame may support the housing and is located proximate to at least one power inverter. A screen may be disposed in at least one of the chambers to promote coolant flow uniformity to the outlet. The frame assembly may include a plurality of frames stacked in an array, and each frame may define a channel in at least partial registration with the outlet.

Abstract: A switchgear/board cabinet is constructed using a dual compartment module (100) that includes an equipment compartment (200) and a bus compartment (300) arranged behind the equipment compartment. The bus compartment includes line connection buses (310) and load connection buses (320) for a plurality of phases, spaced-apart vertical interphase barriers (330), a horizontal support barrier (340) and a rear barrier (350) forming a back wall. Each of the vertical interphase barriers extends from a front to a back of the bus compartment, and isolates the load connection bus and line connection bus of each phase from the load connection bus and line connection bus of the other of the phases. The horizontal support barrier extends from the front to the back of the bus compartment, and supports the line connection buses. Any number of dual compartment modules may be constructed and stacked to provide a customized switchgear/board cabinet.

Abstract: Devices, systems, and methods for dissipating heat from electrical distribution assemblies and electrical switching devices are described herein. In one non-limiting embodiment, a dielectric material of relatively high thermal conductivity can be thermally coupled to electrical switching devices to act as a dielectric heat transfer window that dissipates heat. The dielectric heat transfer window includes at least a first portion thermally coupled to a heat generating component within an electrical switching device, and a second portion disposed external to the electrical distribution assembly or electrical switching device. Among other benefits, this allows heat generated within the electrical switching device to escape the interior of the electrical switching device to an environment external to the electrical switching device.

Abstract: A wall mount module includes a first bracket, a second bracket, a first cover, a second cover, a first conducting member, a second conducting member and a power cable. The first bracket has a first hole formed thereon and the second bracket has a second hole formed thereon. The first cover is disposed on the first bracket and the second cover is disposed on the second bracket. The first conducting member is disposed between the first cover and the first bracket and exposed through the first hole. The second conducting member is disposed between the second cover and the second bracket and exposed through the second hole. The power cable is connected to the first conducting member and the second conducting member.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.