Abstract: In some examples, an integrated circuit system includes a plurality of integrated circuit layers. At least one of the integrated circuit layers includes an integrated circuit die, which may not include any through-silicon vias that provide a pathway to an adjacent integrated circuit layer, and an interposer portion, which includes electrically conductive through-vias. The interposer portion may facilitate communication of the integrated circuit die with other integrated circuit layers of the integrated circuit system. In some examples, the stacked integrated circuit system may include more than one integrated circuit die, which may be in the same integrated circuit layer as at least one other integrated circuit die, or may be in a different integrated circuit layer.

Abstract: A receptacle assembly includes a receptacle housing having a module cavity defined by a top wall having a plurality of apertures therethrough. The module cavity has a port at a front end of the receptacle housing configured to receive a pluggable module. A communication connector is positioned in the receptacle housing having a mating interface for mating with the pluggable module. A heat exchanger is received in the module cavity having a heat spreader positioned interior of the module cavity below the top wall. The heat spreader is configured to be in thermal communication with the pluggable module. The heat exchanger has a plurality of fin segments extending from the heat spreader. The fin segments are received in corresponding apertures in the top wall to pass through the top wall to an exterior of the module cavity for heat dissipation.

Abstract: A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container.

Abstract: A display device is provided which suppresses cost increases attributable to design changes and so forth for things disposed on the inside of a product when a plurality of products of different screen size are developed, or when the screen size is changed. A display device 5 includes a display panel 11, a first board attachment component 13, a display panel board 18, a second board attachment component 21, a main board 22, a third board attachment component 23, and a power supply board 24. The main board 22 stores a plurality of display programs that produce an image to be displayed on the display panel 11, according to the screen size of the display panel 11. The first board attachment component 13, the display panel board 18, the second board attachment component 21, the main board 22, the third board attachment component 23, and the power supply board 24 are disposed in this order, starting from the display panel 11 side, on the rear side of the display panel 11.

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: A power cable termination device for a high voltage direct current gas-insulated switchgear including: an outer housing made of an electrically conducting material, connectable to the switchgear; a terminal portion of a power cable, the power cable including an electrical conductor, a circumferential electrically insulating layer, and a circumferential conductive shield which is stripped off along a first part of the power cable; an electric field grading system including a resistive field grading material layer arranged circumferentially around the power cable to axially cover the edge of the conductive shield where the conductive shield is terminated, the resistive field grading material layer being in electrical contact therewith, and a connection device connectable to the gas-insulated switchgear and arranged to provide mechanical support and electrical contact with the gas-insulated switchgear.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.

Abstract: An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide over the top of the passive heat sink and having a front wall forming a plurality of air intake ports, and a plurality of blowers mounted inside the cold skin for drawing air into the cold skin though the air intake ports and then directing the air through the passive heat sink. In one implementation, the passive heat exchanger includes multiple thermally conductive fins adjacent to the electronic device and extending rearwardly from the intake ports, the fins being spaced apart from each other for conducting heat away from the electronic device. The blowers preferably direct air rearwardly from the intake ports in the front wall into the spaces between the thermally conductive fins.

Abstract: Provided is a semiconductor device having a small footprint, where the semiconductor device includes multiple power modules and a cooling structure for these power modules. The semiconductor device includes: a first power module on a first top plate of a coolant jacket; and a second power module on a second top plate of the coolant jacket, where the second top plate face the first top plate. The coolant jacket includes a first fin in contact with the first top plate in a passage, and a second fin in contact with the second top plate in the passage. The power modules face each other through the top plates and the fins.

Abstract: An aircraft power distribution system according to an exemplary aspect of the present disclosure includes, among other things, a power source, a load, and a power distribution panel receiving power from the power source and selectively providing power to the load. The power source is connected to the power panel by a lug having a heat sink portion. The heat sink portion has at least one increased dimension relative to the remainder of the lug.

Abstract: A manifold for cooling electronic equipment, the manifold including a facility side coolant supply line, a facility side coolant return line, liquid-to-liquid heat exchangers, and pumps. The liquid-to-liquid heat exchangers are connected in parallel to the facility side coolant supply line. Each of the pumps is coupled to a liquid-to-liquid heat exchanger and regulates coolant flow through the coupled liquid-to-liquid heat exchangers.

Abstract: A circuit breaker may be plugged into a breaker compartment in a panelboard without making a connection to a power bus of the panel board. A tool may be inserted into the breaker compartment to operate movable contacts that connect, or disconnect, the circuit breaker from the power bus without de-energizing the power line network. Inserting the tool into the breaker compartment first causes a trip actuator to trip the circuit breaker.

Abstract: A breaker assembly is disclosed comprising a breaker board having a bus bar including a first engagement feature and a breaker module having a line side connector including a second engagement feature engaging the first engagement feature to inhibit separation of the breaker module from the breaker board. The breaker board can further include a board mount having a first alignment feature, and the breaker module can further include a module mount engaging the board mount and having a second alignment feature engaging the first alignment feature. In another aspect of the invention, the breaker board includes board connections, the breaker module includes breaker connections (e.g., blind mate connections), and the board connections are engaged with the breaker connections. In another aspect of the invention, the breaker module includes a ledge that defines an undercut to facilitate prying of the breaker module from the breaker board.

Abstract: Dual starters and/or feeders are positioned in a unit housing to be offset from one another in a front to back direction to provide a compact configuration for a MCC cabinet. The dual starters or feeders can communicate with a respective external handle attached to an inwardly oriented shaft. The handles can be rotary handles that connect to a respective gear assembly that transforms rotational input to linear input.

Abstract: An electronics cooling system includes a housing (101) defining four quadrants (110,111,112,113) with a front face (102) defining an air inlet (301) in the first quadrant and a rear face (203) defining an air exhaust (401) in the second quadrant. A first plenum (701) is disposed adjacent to the air inlet, while a second plenum (702) is disposed adjacent to the air exhaust. A first circuit card corridor (703) and a second circuit card corridor (704), separated by a barrier wall (705), are disposed between the first plenum and the second plenum. A first fan module (304) is disposed adjacent to the first circuit card corridor. A second fan module (404) is disposed adjacent to the second circuit card corridor. The structure defines a first cooling path to a first side of the barrier wall and a second cooling path to a second side of the barrier wall.

Abstract: A unique electrical switchgear system may include a circuit breaker compartment having a compartment wall. The electrical switchgear system may also include a tapered floor pan mounted on the compartment wall. The floor pan may have two side walls disposed oblique to each other; a back wall; and a top wall coupled to the side walls and defining a discharge opening adjacent to the back wall. The two side walls, the top wall and the compartment wall may form a tunnel for channeling cooling air in a first direction. The back wall may be operative to redirect the cooling air in a second direction different from the first direction for discharging the cooling air from the discharge opening.

Abstract: A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of the rack computing systems and the panels of the stalls. An air moving system moves air from the cold aisle through cold-aisle facing air inlets of the computing devices. The filler elements inhibit air moving toward the cold aisle-facing inlets from leaking through gaps between the computing devices of the rack computing systems and the stall panels such that the filler elements inhibit air moving toward inlets in the computing devices from leaking through the gaps between the computing devices in the rack and the stall panels.

Abstract: A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole.