Abstract: There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

Abstract: A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.

Abstract: A heat dissipation device, a heat dissipating method, and a terminal are described. In an embodiment, the heat dissipation device, a heat dissipating method, and a terminal are configured to correspondingly form at least one ventilation wall that is configured to dissipate heat on different heat source positions of the terminal, and form a flow path of the heat dissipation airflow generated by the at least one ventilation wall, based on different heat source positions of the terminal in different applications. In an embodiment, the entire heat dissipation of the terminal can be achieved by the flexible and variable flow path to provide a good user experience.

Abstract: A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.

Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

Abstract: An electronic device for a motor vehicle, includes a first housing portion to receive one or more first electronic components, a second housing portion to receive one or more second electronic components, the second housing assembled with the first housing, and a coolant fluid inlet and a coolant fluid outlet, a coolant channel being provided in the electronic device for the coolant fluid flowing from the inlet to the outlet so as to cool all or part of the first electronic components and/or all or part of the second electronic components, said channel having, over most of the course thereof in the device, in particular over the whole of the course thereof in the device, a section perpendicular to the flow direction of the fluid which is: exclusively provided in the first housing portion or exclusively provided in the second housing portion.

Abstract: A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.

Abstract: Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.

Abstract: A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

Abstract: A system includes a heat exchanger mounted to the brackets and receiving cryogen, the heat exchanger having a vertical inlet coupled in parallel to a plurality of equal size horizontal tubes each traversing a width of the heat exchanger and further coupled in parallel to a vertical outlet pipe with an outlet diameter at least twice an inlet tube diameter; a temperature sensor; a thermostat that monitors the temperature sensor and maintains a predetermined temperature set point by communicating with a solenoid valve coupled to the heat exchanger; an exhaust line coupled to the outlet pipe that expels exhaust gas outside the enclosed facility; multiple fans attached to the heat exchanger; and a fail-safe oxygen sensor to protect a biological object in the enclosed facility.

Abstract: An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.

Abstract: An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.

Abstract: An assembly or adapter configured to provide a supply-side interconnect of electrical power to a distribution board. The adapter may be incorporated internal or external to the distribution board, by occupying the space of one or more circuit breakers, inserting an adapter into a meter termination socket, or the like. The adapter includes terminals provided to route the conductors from the utility to a breakout panel (or subpanel) for adding power devices as a supply side interconnect, and back to a regular route that may go through the meter and/or the main circuit breaker, and on to the loads. A switching component may provide an inline configuration that configures the conductors for backup function, and a parallel configuration that is a parallel interconnecting route when utility service is available.

Abstract: In a sensor arrangement for measurement of the temperature of a disk, it is provided that the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out from the housing, the heat-conducting element is configured as a rigid pin, the rigid pin has a thermal connection and a mechanical connection to the circuit carrier, the rigid pin is provided and configured to make a thermal contact with the disk.

Abstract: The disclosure provides a network equipment power supply and a heat dissipation system therefor. The heat dissipation system includes a liquid-cooling heat dissipation device and an air-cooling heat dissipation device. The liquid-cooling heat dissipation device includes a liquid inlet, a liquid outlet, and a liquid-cooling pipe between them, wherein liquid-cooling medium flows inside the liquid-cooling pipe and takes away heat generated by components arranged around the liquid-cooling pipe; The air-cooling heat dissipation device includes an air inlet, an air outlet, and an air-cooling channel between them, wherein airflow passes through the air-cooling channel and takes away heat generated by components arranged around the air-cooling channel.

Abstract: A power module is provided with reduced power and gate loop inductance. The power module may be configured in a multi-layer manner with one or more organic substrates.

Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.

Abstract: A microprocessor is attached to a cooling plate. The cooling plate is formed of two identical shells, each shell having a fluid chamber therein in communication with one or more fluid channels and a fluid port. The two shells are attached to each other such that the open top of each fluid cavity faces the other open top, so that the two fluid cavities form one large cavity. Fins are positioned inside the fluid cavity so as to form fluid passages between each two fins for the cooling fluid to flow and remove heat from the fins. Fluid chambers formed by the two shells are divided into multiple fluid channels among fins by the fins.

Abstract: An electronic apparatus that is improved in heat dissipation efficiency of a heat generating component while avoiding an increase in the size of the electronic apparatus. A first substrate has a heat generating component mounted thereon. A heat dissipation frame is arranged opposed to and in contact with a second substrate. A flexible printed circuit electrically connects the first and second substrates. A thermally conductive member is sandwiched between the heat generating component and the heat dissipation frame such that the flexible printed circuit is pressed against the heat generating component. As heat dissipation paths from the heat generating component to the heat dissipation frame, there are formed a first heat dissipation path via the thermally conductive member and a second heat dissipation path via the flexible printed circuit and the second substrate.