Abstract: Embodiments are disclosed of a baffle unit. The baffle unit includes an elastic member and one or more baffle blades. Each baffle blade has a first edge and a second edge, and each baffle blade has its first edge coupled to the elastic member, so that each baffle blade rotates about and deforms the elastic member in response to aerodynamic forces applied to the one or more baffle blades. Implementation of one or more of the baffle units preventing or reduces thermal impact of the airflow on liquid cooling devices and enables airflow management optimization.

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Abstract: A circuit board heat sink structure having a circuit board and comprising a metallic heat sink, wherein the circuit board has a metal substrate, an insulation layer and a conductor layer, and the wherein the circuit board is arranged on the heat sink in such a way that the metal substrate contacts a locating face of the heat sink. At least one heat transition point is formed between the heat sink and the metal substrate, which provides a defined metallic contact between the material of the heat sink and the material of the metal substrate. A method is also provided for forming the circuit board heat sink structure.

Abstract: An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing.

Abstract: A forced double-circuit air cooling system designed for using in a sealed cabinet structure. A first air circuit is formed by an air loop moved around each of local modules (3; 4) of a sealed compartment [2] with using a circulation fan (26) which is installed within a sealed air channel [28]. The first air circuit is formed within an internal air channel (18) of the sealed compartment [2]. Wherein the internal air channel is connected to a number of air heat exchangers [22]. A first pair [22.1] of said number of air heat exchangers is equipped with the circulation fan [26]. Wherein a second air circuit [25] contains straight air channels [23] arranged within the ventilated compartment [24] adjacent to the sealed compartment [2]. Each of said straight air channels [23] comprising a second pair [22.2] of air heat exchangers with a blast fan [27] between them.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Abstract: A housing includes a tubular housing and a first lid section. The first lid section is fitted to one end portion of the tubular housing. The tubular housing includes a first protruding section protruding toward a first lid section from a joint surface in contact with the first lid section. The first protruding section has a configuration allowing the tubular housing and a heat conductive member, to conduct heat from a heat generating body disposed inside the tubular housing, to be fixed together.

Abstract: A flexible circuit board includes a flexible substrate, an electronic component and a heat spreader. The electronic component and the heat spreader are disposed on a top surface and a bottom surface of the flexible substrate, respectively. The heat spreader includes a copper layer which contains more than or equal to 50% copper grains by volume with (1,0,0) crystallographic orientation.

Abstract: A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.

Abstract: A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).

Abstract: A display device includes a first heat dissipation member disposed on a display panel, and an air generator disposed on the first heat dissipation member, wherein the air generator includes an air blower, and an air flow path disposed at a side of the air blower and extending in a first direction. The air blower includes a body defining an inner space of the air blower, a first diaphragm and a second diaphragm disposed in the inner space of the body and facing each other, a first magnet disposed on a surface of the first diaphragm, and a second magnet disposed on a surface of the second diaphragm, and an air discharge hole of the body disposed between the first diaphragm and the second diaphragm, the air discharge hole opened toward the air path, and at least one of the first magnet and the second magnet is an electromagnet.

Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

Abstract: A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: A cooling device includes at least two cooling units, each cooling unit including a plate-shaped cold plate extending in a horizontal direction, a radiator extending in a first direction perpendicular to the horizontal direction and having a plurality of plate-shaped fins which, on the cold plate, is disposed parallel to a second direction perpendicular to the first direction, and a pump which supplies a refrigerant liquid to the cold plate and the radiator, in which the pump is adjacent to the radiator and is disposed in the second direction of the radiator, and the pump of one first cooling unit of the two cooling units faces the other second cooling unit of the two cooling units in the second direction or in a third direction orthogonal to the first direction and the second direction.

Abstract: A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.

Abstract: A system is disclosed that includes a bay within a computer system, such as a fan bay. The system further includes a baffle positioned around a section of a perimeter of the bay. The baffle is configured to move along the section. The baffle includes a projection that extends into the bay. The projection is configured to abut against a module, such as a fan module, so that the module drives the baffle from a closed position to an open position as the module is inserted into the bay.

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

Abstract: A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.