Patents Examined by Zandra V. Smith
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Patent number: 11233130Abstract: Provided are a semiconductor device and a method of forming the same. The semiconductor device includes a substrate, a plurality of semiconductor nanosheets, a bottom dielectric layer, and a gate stack. The substrate includes at least one fin. The plurality of semiconductor nanosheets are stacked on the at least one fin. The bottom dielectric layer is disposed between the at least one fin and the plurality of semiconductor nanosheets. The gate stack wraps the plurality of semiconductor nanosheets.Type: GrantFiled: February 24, 2020Date of Patent: January 25, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bo-Feng Young, Sai-Hooi Yeong, Chi-On Chui
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Patent number: 11233006Abstract: An integrated circuit product includes a first layer of insulating material including a first insulating material. The first layer of insulating material is positioned above a device layer of a semiconductor substrate. The device layer includes transistors. A metallization blocking structure is positioned in an opening in the first layer of insulating material. The metallization blocking structure includes a second insulating material that is different from the first insulating material. A metallization trench is defined in the first layer of insulating material on opposite sides of the metallization blocking structure. A conductive metallization line includes first and second portions positioned in the metallization trench on opposite sides of the metallization blocking structure. The conductive metallization line has a long axis extending along the first and second portions.Type: GrantFiled: August 14, 2018Date of Patent: January 25, 2022Assignee: GlobalFoundries U.S. Inc.Inventors: Ruilong Xie, Lars Liebmann, Daniel Chanemougame, Geng Han
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Patent number: 11227858Abstract: A semiconductor package includes: a substrate having first substrate pads formed at one side edge thereof in a first direction and second substrate pads formed at an other side edge thereof in the first direction; a sub semiconductor package formed on the substrate, and including a sub semiconductor chip, a sub molding layer which surrounds side surfaces of the sub semiconductor chip and redistribution conductive layers which extend onto the sub molding layer while being connected with sub chip pads of the sub semiconductor chip and are connected to first redistribution pads and second redistribution pads formed at one side edge and the other side edge, respectively, of the sub molding layer in the first direction; a first chip stack formed on the sub semiconductor package, and including first main semiconductor chips; and a second chip stack formed on the first chip stack, and including second main semiconductor chips.Type: GrantFiled: June 15, 2020Date of Patent: January 18, 2022Assignee: SK hynix Inc.Inventor: Jinkyoung Park
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Patent number: 11227950Abstract: A semiconductor structure includes a source/drain (S/D) feature disposed in a semiconductor layer, a metal gate stack (MG) disposed in a first interlayer dielectric (ILD) layer and adjacent to the S/D feature, a second ILD layer disposed over the MG, and an S/D contact disposed over the S/D feature. The semiconductor structure further includes an air gap disposed between a sidewall of a bottom portion of the S/D contact and the first ILD layer, where a sidewall of a top portion of the S/D contact is in direct contact with the second ILD layer.Type: GrantFiled: September 16, 2019Date of Patent: January 18, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chao-Hsun Wang, Chen-Ming Lee, Kuo-Yi Chao, Mei-Yun Wang, Pei-Yu Chou, Kuo-Ju Chen
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Patent number: 11227856Abstract: A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.Type: GrantFiled: January 7, 2020Date of Patent: January 18, 2022Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Pengkai Ji, Xiaoni Xin, Yan Chen, Qingdong Chen, Shouyu Hong, Jianhong Zeng, Zhenqing Zhao
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Patent number: 11227970Abstract: A method for manufacturing LED devices is provided. The method comprises forming an epitaxial layer on a starter substrate, the epitaxial layer having a first surface that interfaces with the starter substrate and a second surface opposite to the first surface; establishing an adhesive bond between the second surface of the epitaxial layer and a carrier substrate having a pre-determined light transmittance; etching away the starter substrate; etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on a third surface of the epitaxial layer opposite to the second surface; establishing one or more conductive bonds between selected one or more LED dies, from the plurality of LED dies, and a backplane; weakening the adhesive bond between the second surface of the epitaxial layer and the carrier substrate; and moving the carrier substrate away from the backplane.Type: GrantFiled: October 8, 2019Date of Patent: January 18, 2022Assignee: Facebook Technologies, LLCInventors: CĂ©line Claire Oyer, Allan Pourchet
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Patent number: 11222790Abstract: A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.Type: GrantFiled: April 29, 2020Date of Patent: January 11, 2022Assignee: NXP USA, INC.Inventors: Richard Te Gan, Rushik Prabhudas Tank, Zhiwei Gong, Burton Jesse Carpenter, Jinmei Liu
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Patent number: 11222812Abstract: One or more embodiments are related to a semiconductor device, comprising: a metallization layer comprising a plurality of portions, each of the portions having a different thickness. The metallization layer may be a final metal layer.Type: GrantFiled: June 14, 2018Date of Patent: January 11, 2022Assignee: Infineon Technologies AGInventor: Matthias Stecher
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Patent number: 11217497Abstract: In an embodiment, a device includes: a first integrated circuit die having a first contact region and a first non-contact region; an encapsulant contacting sides of the first integrated circuit die; a dielectric layer contacting the encapsulant and the first integrated circuit die, the dielectric layer having a first portion over the first contact region, a second portion over the first non-contact region, and a third portion over a portion of the encapsulant; and a metallization pattern including: a first conductive via extending through the first portion of the dielectric layer to contact the first integrated circuit die; and a conductive line extending along the second portion and third portion of the dielectric layer, the conductive line having a straight portion along the second portion of the dielectric layer and a first meandering portion along the third portion of the dielectric layer.Type: GrantFiled: May 26, 2020Date of Patent: January 4, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu
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Patent number: 11217487Abstract: A method for forming a semiconductor arrangement includes forming a first gate structure over a first active region. The first gate structure includes a first conductive layer. An etch process is performed using a process gas mixture to recess the first gate structure and define a recess. The etch process comprises a first phase to form a polymer layer over the first conductive layer and to modify a portion of the first conductive layer to form a modified portion of the first conductive layer and a second phase to remove the polymer layer and to remove the modified portion of the first conductive layer.Type: GrantFiled: November 19, 2019Date of Patent: January 4, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Yi-Chen Lo, Li-Te Lin, Pinyen Lin
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Patent number: 11211291Abstract: A semiconductor device includes a base structure including a first interlayer dielectric (ILD) layer and a contact including a conductive liner disposed along a conductive core, a conductive plug disposed on the conductive liner between the conductive core and the first ILD layer to a height of the base structure, and a metallization level including a conductive line and a self-aligned via underneath the conductive line disposed on the contact and the conductive plug. The conductive plug protects underlying material and increases connectivity between the self-aligned via and the contact that was reduced due to misalignment.Type: GrantFiled: April 3, 2020Date of Patent: December 28, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Ruilong Xie, Christopher J. Waskiewicz, Kangguo Cheng, Chih-Chao Yang
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Patent number: 11211315Abstract: Described examples include an apparatus, including: a substrate having a first surface configured to mount at least one integrated circuit and having a second surface opposite the first surface, the second surface having a plurality of terminals arranged in rows and columns, and at least one row of the plurality of terminals disposed adjacent a first side and extending generally along the length of the substrate arranged in a pattern extending along a longitudinal line, the pattern including a first group of consecutive terminals extending in a first direction at a first angle to the longitudinal line and directed towards an interior of the substrate, a second group of consecutive terminals extending in a second direction at a second angle and extending towards the periphery of the substrate, and a third group of consecutive ones of the terminals extending from the second group in the first direction.Type: GrantFiled: October 13, 2017Date of Patent: December 28, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Casey Thomas Morrison, Lee Martin Sledjeski
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Patent number: 11211471Abstract: The present invention discloses a metal gate process. A sacrificial nitride layer is introduced during the fabrication of metal gates. The gate height can be well controlled by introducing the sacrificial nitride layer. Further, the particle fall-on problem can be effectively solved.Type: GrantFiled: September 10, 2020Date of Patent: December 28, 2021Assignee: UNITED MICROELECTRONICS CORP.Inventors: Fu-Shou Tsai, Yong-Yi Lin, Yang-Ju Lu, Yu-Lung Shih, Ji-Min Lin, Ching-Yang Chuang, Kun-Ju Li
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Patent number: 11211311Abstract: An electronic device has a sealing part 90, a first main terminal 11 protruding outward from the sealing part 90, a second main terminal 12 protruding outwardly from the sealing part, an electronic element 95 provided in the sealing part and having a front surface electrically connected to the first main terminal 11 and a back surface electrically connected to the second main terminal 12, a head part 40 connected to the front surface of the electronic element 95, a sensing terminal 13 protruding to an outside from the sealing part 90 and used for sensing and a connection part 35 integrally formed with the head part 40 and electrically connected to the sensing terminal 13. A current flowing through the sensing terminal 13 and the connection part 35 among a sensing current path does not overlap a main current path flowing through the second main terminal 12, the electronic element 95 and the first main terminal 11.Type: GrantFiled: February 20, 2017Date of Patent: December 28, 2021Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.Inventors: Soichiro Umeda, Yuji Morinaga
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Patent number: 11211475Abstract: A method of forming a method of forming a semiconductor device includes providing a semiconductor structure, etching back each gate structure of a plurality of gate structures to form an opening, forming a barrier layer over the dielectric layer, forming a sacrificial layer over the barrier layer, planarizing the sacrificial layer till a surface of the sacrificial layer is substantially flat, and using a gas cluster ion beam (GCIB) process to planarize the sacrificial layer and the barrier layer, and to remove the sacrificial layer and to provide a planarized barrier layer. The semiconductor structure includes a semiconductor substrate, a fin, the plurality of gate structures, and a dielectric layer over the semiconductor substrate between adjacent gate structures. A top of the dielectric layer is coplanar with a top of each of the plurality of gate structures.Type: GrantFiled: June 28, 2020Date of Patent: December 28, 2021Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) CorporationInventors: Haiyang Zhang, Jian Chen, Bo Su
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Patent number: 11205609Abstract: A semiconductor structure with an air gap includes a dielectric stack having a first dielectric layer on a substrate, a second dielectric layer on the first dielectric layer, and a third dielectric layer on the second dielectric layer. A first conductive layer and a second conductive layer are disposed in the dielectric stack. The first conductive layer and the second conductive layer are coplanar. A cross-like-shaped air gap is disposed in the dielectric stack between the first and second conductive layers. An oxide layer is disposed on a sidewall of the second dielectric layer within the cross-like-shaped air gap.Type: GrantFiled: March 31, 2020Date of Patent: December 21, 2021Assignee: UNITED MICROELECTRONICS CORP.Inventors: Ching-Pin Hsu, Chih-Jung Wang, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin, Purakh Raj Verma
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Patent number: 11201169Abstract: A memory device includes: a first bit line located on a dielectric layer and a second bit line located over the dielectric layer; a first word line and a second word line located between the first bit line and the second bit line; a source line located between the first word line and the second word line; a channel pillar penetrating through the first word line and the source line and the second word line, and being connected to the first bit line, the source line and the second bit line; and a charge storage structure including an upper portion surrounding an upper sidewall of the channel pillar and located between the second word line and the channel pillar; and a lower portion surrounding a lower sidewall of the channel pillar and located between the first word line and the channel pillar.Type: GrantFiled: March 31, 2020Date of Patent: December 14, 2021Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Chih-Hsiung Lee, Shaw-Hung Ku
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Patent number: 11201140Abstract: A semiconductor package includes a first sub-package on an interconnection layer. A second sub-package and a third sub-package are sequentially stacked on the first sub-package. Each of the first to third sub-packages includes a semiconductor chip and an interposing bridge. The interposing bridge includes a first through via and a second through via. The second sub-package further includes a first redistributed line electrically connecting the semiconductor chip of the second sub-package to the first through via. The third sub-package further includes a second redistributed line electrically connecting the semiconductor chip of the third sub-package to the second through via.Type: GrantFiled: June 4, 2020Date of Patent: December 14, 2021Assignee: SK hynix Inc.Inventor: Bok Kyu Choi
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Patent number: 11195763Abstract: In a method, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. The first semiconductor layers are etched at a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, thereby forming a first source/drain space in which the second semiconductor layers are exposed. A dielectric layer is formed at the first source/drain space, thereby covering the exposed second semiconductor layers. The dielectric layer and part of the second semiconductor layers are etched, thereby forming a second source/drain space. A source/drain epitaxial layer is formed in the second source/drain space. At least one of the second semiconductor layers is in contact with the source/drain epitaxial layer, and at least one of the second semiconductor layers is separated from the source/drain epitaxial layer.Type: GrantFiled: August 29, 2019Date of Patent: December 7, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hung-Li Chiang, Chao-Ching Cheng, Chih-Liang Chen, Tzu-Chiang Chen, Ta-Pen Guo, Yu-Lin Yang, I-Sheng Chen, Szu-Wei Huang
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Patent number: 11195934Abstract: The present disclosure provides embodiments of a semiconductor structure having bi-layer self-aligned contact. The semiconductor structure includes a gate stack disposed on a semiconductor substrate and having a first height, a spacer disposed on a sidewall of the gate stack and having a second height greater than the first height, and a first etch stop layer disposed on a sidewall of the gate spacer and having a third height greater than the second height. The semiconductor structure further includes a first dielectric layer disposed over the gate stack and contacting the gate spacer and the first etch stop layer and a second dielectric layer disposed on the first dielectric layer and contacting the first etch stop layer.Type: GrantFiled: June 8, 2020Date of Patent: December 7, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang