Abstract: An apparatus and system for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The apparatus and system includes a chamber for partially immersing the substrate in a solvent (e.g., deionized water), a chamber for receiving an oxidizing gas (e.g., ozone), and a mechanism for rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas.

Abstract: The present invention relates to a method for cleaning containment enclosures, and in particular for dedusting them. The invention is implemented with double containment; and suctioning is performed within a removable receptacle.

Abstract: The wafers W are dipped and rinsed in pure water in the processing bath 60, and then dichloromethane is fed into the processing bath 60, thereby changing the state of the wafer W from being dipped in pure water to being dipped in dichloromethane. Thereafter, the wafers W is raised up to the drying chamber 61, and dichloromethane remained on the surface of each wafer W is evaporated, and the hot N2 gas is discharged onto the wafers W. Thereby, no water marks are produced, and no resist is dissolved, and the substrate can be dried in safety.

Abstract: A computer-implemented method and system for cleaning a contaminated cannula so that it may be reused includes moving the contaminated cannula from a drug reconstitution station where the cannula is used to prepare a drug solution into a first rinsing station where the cannula is cleaned. A database is referred to to determine what drug solution the cannula has been contaminated with, and to determine a first amount of cleaning fluid that needs to be passed internally through the cannula, and a second amount of cleaning fluid that needs to be passed externally about the cannula so that there is effectively no contaminant remaining inside and outside of the cannula. The first amount of cleaning fluid is passed internally through the cannula. The second amount of cleaning fluid is passed externally about the cannula. After the cannula is cleaned, the cannula is moved to the drug reconstitution station to prepare another drug solution.

Abstract: A hot forming die (10) has forming surfaces (16, 18) and the forming surfaces have a nickel oxide layer (20). A stop off material coating (22) builds up on the nickel oxide layer (20) in operation. A method of cleaning the forming surfaces (16, 18) of the hot forming die (10) includes washing the forming surfaces (16, 18) of the hot forming die (10) in water to remove the stop off material (22) without removing the nickel oxide layer (20) from the forming surfaces (16, 18). The forming surfaces (16, 18) may be soaked in water (26) and/or a jet (30) of pressurized water may be directed onto the forming surfaces (16, 18). The stop off material is quickly removed without damaging the forming surfaces (16, 18). The retention of the nickel oxide layer (20) improves the quality of the hot-formed articles and the interval between cleaning of the hot forming die (10) is increased.

Abstract: A method for servicing firefighter's turnout gear includes the step of transporting a mobile servicing facility in proximity to a fire department facility. The mobile servicing facility carries cleaning equipment for cleaning firefighter's turnout gear. For example, the cleaning equipment may include a cleaning machine for use with a carbon dioxide-based cleaning agent, a solvent, or laundry equipment. The method also includes the steps of operating the cleaning equipment to clean turnout gear of the fire department facility, and transporting the mobile servicing facility away from the fire department facility. Optionally, the mobile servicing facility also carries repairing equipment, supplies for repairing the turnout gear, power generation equipment, and/or a tracking system for preparing a report of services performed on the turnout gear.

Abstract: A process for removing oil containing machine coolant from machining chips in which the chips are deposited in a sluice and flushing jets of citrus oil based cleanser used as a washing liquid are used to move the chips down the sluice and into a chip separator tank, the coating of oil containing coolant scoured from the chips by the action of the cleanser and flushing jets. The chips are conveyed up a sloping wall of the tank to be moved out of the washing liquid, drained and dried. The washing liquid is pumped out the tank and after removal of the oil is again used to form the flushing jets in the sluice.

Abstract: A method for producing a saponified ethylene-vinyl acetate copolymer, which comprises washing chips of a saponified ethylene-vinyl acetate copolymer. In this method, the chips containing impurities and methanol are introduced into a washing column through an upper portion thereof; water is introduced into the washing column through a lower portion thereof; while the methanol concentration in the solution in the upper portion of the column is maintained in the range of 25 to 45 wt % and the chips are allowed to fall (i.e. sink) from the upper portion of the column, methanol and water with at least a part of the impurities are discharged from the column through an upper portion thereof; and the chips are taken out of the column through a lower portion thereof with water that contains methanol in a lower concentration than the methanol concentration in the solution in the upper portion of the column.

Abstract: A method and apparatus for treating substrates in a fluid container with at least one fluid and ultrasound provided. Each of two oppositely disposed walls of the fluid container are provided with at least two ultrasound radiation areas that can be respectively individually activated. The ultrasound radiation areas of one of the container walls is activated in a chronological relationship to the ultrasound radiation areas of the other container wall in such a way that oppositely disposed ultrasound radiation areas of the container walls are not activated simultaneously.

Abstract: A substrate cleaning apparatus includes a chamber having a substrate support capable of supporting and rotating a substrate in the chamber. A cleaning solution injector is provided to inject a cleaning solution onto the substrate in the chamber. A portion of the cleaning solution is thrown off the rotating substrate to form a cleaning solution mist in the chamber. A cleaning gas inlet introduces a cleaning gas into the chamber and an outlet exhausts the cleaning solution mist and cleaning gas from the chamber. This reduces the formation of residues from the cleaning solution mist on the substrate.

Abstract: A dishwasher fluid circulation assembly is provided including a main pump, a spray arm conduit, a fine filter assembly, a drain pump, and a sump. The main pump includes a pump inlet and a discharge in flow communication with the spray arm conduit. The fine filter assembly includes a fluid inlet in flow communication with the spray arm conduit and a drain tube The drain pump is in flow communication with the drain tube; and a sump is in flow communication with the main pump and the drain pump. The main pump and drain pump are simultaneously activated to flush the fine filter assembly and remove accumulated soil therein.

Abstract: This is a method of cassette-to-cassette batch demounting process that includes providing an apparatus having two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates.

Abstract: A piston pig for pushing pigs from a larger diameter conduit into a smaller diameter conduit, where one embodiment includes a cylindrical body with a first sealing disc attached to the body and adapted to seal against the larger diameter conduit and maintain a pressure differential across the body of the piston pig. The piston pig also includes a second sealing disc attached to the body and capable of sealing against the smaller diameter conduit and maintain a pressure differential across the body. Certain embodiments also include a pressure control device, such as a resilient flapper disc, to limit the differential pressure across the body. Some piston pig embodiments may also include an end cap attached to, and slidable relative to, the body, where the end cap has a closed position in which fluid cannot bypass the end cap and an open position in which fluid can bypass the end cap.

Abstract: An automatic system is used for controlling the cleaning stage of a strip cleaning line, e.g. an aluminum strip cleaning line. The cleaning line includes a chemical cleaning section and at least one rinse section, with cleaning solution being sprayed onto the top and bottom faces of the aluminum strip as it passes through the cleaning section. A programmable logic controller has a dwell time set point for each coil of aluminum strip, which gives for standard conditions of chemical concentration and temperature the time the strip should be exposed to the spray. The controller receives input signals based on the measured temperature and concentration of the cleaning solution and adjusts the dwell time of the cleaning solution spray on the aluminum strip accordingly.

Abstract: A method of transporting rod-shaped tobacco smoke filters, which carry solid particles, along an elongated path from a sender to a receiving station, includes transporting the filters from the sender to the receiving station through the predetermined portion of the path. A plurality of jets of a pressurized gaseous fluid is directed across a predetermined portion of the path to expel from the portion of the path solid particles which are separated or separable from the filters. The expelled particles are collected in a chamber outwardly adjacent the predetermined portion of the path. The collected particles are evacuated from the chamber.

Abstract: A method for removing the circumferential edge of a dielectric layer on a semiconductor wafer is disclosed. First, a semiconductor wafer having a dielectric layer on its upper surface is provided. Second, the semiconductor wafer is placed and secured on a susceptor. Third, the circumferential edge of the dielectric layer is removed by a ring cutter. Then, the semiconductor wafer is cleaned from its central portion to its edge portion by water jets.

Abstract: An integrated circuit assembly cleaning apparatus and method allow a cleaning solution to completely fill spaces within an integrated circuit assembly. Such spaces include, for example, the thin space between the die and substrate of a flip-chip integrated circuit. The cleaning solution fills the space while the air initially occupying the space escapes. These actions are accomplished by first tilting the integrated circuit assembly from horizontal. The integrated circuit assembly is then immersed in the bath at a controllable rate to allow the cleaning solution to completely fill the space while the air in the space escapes.

Abstract: A system for preventing contaminants and particulates from coming into contact with a back side of a workpiece as the workpiece is vacuum held on a chuck or robotic end effector.

Abstract: A cleaning apparatus includes cleaning vessels 2a and 2b for storing cleaning water “W1” used for cleaning an article to be cleaned 14; concentrating vessels 3a and 3b for storing sewage “W2” discharged from the cleaning vessels; an ultrafiltration membrane 11 for receiving the sewage “W2” discharged from the concentrating vessels to separate the received sewage into filtered water “W3” and concentrated sewage “W5”; and waterway lines “L4” and “L12” for returning the concentrated sewage “W5” discharged from the ultrafiltration membrane 11 to the concentrating vessels 3a and 3b. The filth is removed from the article to be cleaned 14 by dipping the article to be cleaned 14 into the cleaning water “W1”. The ultrafiltration membrane 11 is provided with a backwash filtration system “L9”, “B4”, and “P3” for removing filthy refuse.

Abstract: A method of washing a container,including charging a material to be contained into a container body having a mouth-and-neck portion; mounting a container closure on the mouth-and-neck portion of the container body, the container closure having a top panel wall, a cylindrical skirt wall extending downwardly from a peripheral edge of the top panel wall, and a washing liquid passage formed in at least one of an upper portion of the skirt wall and a peripheral edge portion of the top panel wall; and jetting a washing liquid at the container closure so that the washing liquid passes through the washing liquid passage and enters a space between the mouth-and-neck portion of the container body and the skirt wall of the container closure, thereby washing an outer peripheral surface of the mouth-and-neck portion of the container body and an inner peripheral surface of the skirt wall of the container closure. The washing liquid is at a temperature of 65° C. to 70° C.